公开(公告)号：EP0110332A3

公开(公告)日：1984-09-05

申请号：EP83111788

申请日：1983-11-24

Applicant: Siemens Aktiengesellschaft

Inventor： Hussain, Amir, Dipl.-Chem., Dr. rer. nat. ,  v. Stein, Christian, Dipl.-Ing. ,  Pflugbeil, Christa, Dipl.-Ing. ,  Schlitter, Hans

IPC: H05K01/03 ,  B29D03/02 ,  B32B27/12

CPC classification number: B32B27/12 ,  B29C70/086 ,  B29C70/46 ,  B29K2023/06 ,  B29K2105/0809 ,  B29K2309/08 ,  B32B15/20 ,  B32B27/18 ,  B32B27/32 ,  B32B2262/101 ,  B32B2305/076 ,  B32B2305/72 ,  B32B2457/00 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0166 ,  H05K2201/0239 ,  H05K2201/029

公开(公告)号：EP1255797B2

公开(公告)日：2016-10-12

申请号：EP00992510.8

申请日：2000-11-16

Applicant: OMG Electronic Chemicals, Inc

Inventor： BERNARDS, Roger ,  GONZALEZ, Hector ,  KUCERA, Al ,  SCHANHAAR, Mike

IPC: C23F1/18 ,  H05K3/38 ,  C23C22/68

CPC classification number: C23C22/68 ,  C23C22/52 ,  C23C2222/20 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/0239 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/124

公开(公告)号：EP2947122A4

公开(公告)日：2016-08-31

申请号：EP14740816

申请日：2014-01-14

Applicant: MITSUBISHI GAS CHEMICAL CO

Inventor： TOMIZAWA KATSUYA ,  CHIBA TOMO ,  TAKAHASHI HIROSHI ,  SHIGA EISUKE ,  UEYAMA DAISUKE ,  NOMIZU KENTARO

IPC: C08J5/24 ,  C08K3/22 ,  C08K9/06 ,  C08K9/08 ,  H05K1/03

CPC classification number: C09D179/08 ,  C08J5/24 ,  C08K3/34 ,  C08K3/36 ,  C08K9/04 ,  C08K9/06 ,  C08K9/08 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/282 ,  C08K2003/385 ,  C08K2201/011 ,  C08L101/00 ,  C09D165/00 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/31663 ,  Y10T442/2861 ,  Y10T442/2992 ,  C08L83/04

Abstract: The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 µm to 100 µm; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.

Abstract translation: 本发明提供一种树脂组合物，其包含：平均粒径为1.0nm〜100nm的氧化铝和/或勃姆石的纳米粒子（A） 平均粒径为0.20μm〜100μm的微粒（B）; 和热固性树脂（C），其中纳米粒子（A）的表面用聚硅氧烷类改性剂处理。

公开(公告)号：EP2330876A4

公开(公告)日：2015-11-04

申请号：EP09811600

申请日：2009-09-07

Applicant: UNIV TOKYO SCI EDUC FOUND

Inventor： TANIGUCHI JUN ,  YOSHINO NORIO

IPC: H05K3/20 ,  B29C33/56 ,  B29C59/02

CPC classification number: B29C33/56 ,  B29C33/424 ,  B29C33/60 ,  B29C37/0053 ,  H05K3/025 ,  H05K3/20 ,  H05K2201/0239 ,  H05K2201/0373 ,  H05K2203/1152 ,  Y10T428/24479 ,  Y10T428/24612 ,  Y10T428/24802 ,  Y10T428/24926 ,  Y10T428/31663

公开(公告)号：EP2671919A4

公开(公告)日：2014-12-10

申请号：EP11866389

申请日：2011-11-28

Applicant: PANASONIC CORP

Inventor： KONNO YUKO ,  TAKASHITA HIROMITSU ,  TAKEDA TSUYOSHI ,  FUJIWARA HIROAKI ,  YOSHIOKA SHINGO

IPC: C08L33/02 ,  C08K5/00 ,  C09D125/08 ,  C09D133/08 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18

CPC classification number: C08K5/3475 ,  C08K5/005 ,  C08L33/02 ,  C09D125/08 ,  C09D133/08 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0264 ,  H05K2203/0565 ,  H05K2203/0571

公开(公告)号：EP2180019B1

公开(公告)日：2012-02-01

申请号：EP09177928.0

申请日：2005-08-05

Applicant: Nippon Shokubai Co., Ltd.

Inventor： Sugioka, Takuo ,  Tsujino, Yasunori

IPC: C08L83/02

CPC classification number: H05K1/0373 ,  C08K3/016 ,  C08L61/28 ,  C08L63/00 ,  C08L83/04 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  Y10T428/31511 ,  C08L2666/14 ,  C08L2666/28 ,  H01L2924/00

Abstract: It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability/formability and strength, and exhibit an excellent appearance inwhich transparency is enhanced, a resin composition whose cured thin film has excellent flame retardancy, good mechanical property and heat resistance, a dispersing element containing an inorganic microfine particle which can give a flame retardancy to a resin, to which the inorganic microfine particle is added, and can reduce a hygroscopic property to the extent possible, a method for producing the same and a cured formulation obtained by using the resin composition. The present invention relates to a resin composition comprising a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a resin composition comprising three components of a phenolic compound, a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a flame retardant resin composition comprising a polyhydric phenol and an inorganic microfine particle, and a dispersing element containing an inorganic microfine particle obtained by a hydrolysis condensation reaction of alkoxide and/or metal carboxylate in a dispersion medium.

公开(公告)号：EP2330876A1

公开(公告)日：2011-06-08

申请号：EP09811600.7

申请日：2009-09-07

Applicant: Tokyo University Of Science Educational Foundation Administrative Organization

Inventor： TANIGUCHI, Jun ,  YOSHINO, Norio

IPC: H05K3/20 ,  B29C33/56 ,  B29C59/02

CPC classification number: B29C33/56 ,  B29C33/424 ,  B29C33/60 ,  B29C37/0053 ,  H05K3/025 ,  H05K3/20 ,  H05K2201/0239 ,  H05K2201/0373 ,  H05K2203/1152 ,  Y10T428/24479 ,  Y10T428/24612 ,  Y10T428/24802 ,  Y10T428/24926 ,  Y10T428/31663

Abstract: There are provided a method for producing a transfer structure, in which detachment between a transfer-receiving material and a matrix can be easily achieved without destroying the fine pattern, the transfer pattern of the matrix is satisfactorily transferred to the transfer-receiving material, and the durability of the matrix is maintained for a long time during repeated transfer; and a matrix for use in the method. A film of a silane coupling agent represented by the following formula (I) is formed on a surface of a matrix having a transfer pattern formed on the surface thereof, a transfer-receiving material is applied thereon to transfer the pattern on the surface of the matrix, and the transfer-receiving material is detached from the matrix to obtain a transfer structure formed of the transfer-receiving material. In formula (I), n represents an integer of 8, 10, 12 or 14; m represents an integer of 3 or 4; and X, Y and Z each independently represent a hydrolyzable group that is a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, or a halogen atom.

Abstract translation: 本发明提供一种方法，用于产生传递结构，在转印接收材料和基体之间的哪个分离可以在不破坏微细图案，矩阵的转印图案良好地转印到转印接收材料可以容易地实现，并且 基质的耐久性维持重复传送期间很长的时间; 和用于该方法中使用的矩阵。 由下式（I）表示的硅烷偶联剂的电影被形成，具有形成在其表面上的转印图案的基质的表面上，转印接收材料被施加在其上以的表面上的图案转移 矩阵，并且转印接收材料从基质分离以获得所形成的转印接收材料的转印结构。 在式（I）中，n为8，10，12或14的整数darstellt; 的3或4整数的米darstellt; 且X，Y和Z各自独立地表示可水解基团是甲氧基一样，在乙氧基，丙氧基，异丙氧基，或者卤原子。

公开(公告)号：EP2053907A3

公开(公告)日：2009-07-15

申请号：EP08166610.9

申请日：2008-10-14

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Laudick, David A. ,  Oberlin, Gary E.

IPC: H05K3/28 ,  H05K5/06 ,  B29C45/14 ,  H05K1/14

CPC classification number: H05K3/284 ,  B29C45/14377 ,  B29C45/14418 ,  B29C45/14639 ,  B29C45/14836 ,  B29C45/72 ,  H05K1/118 ,  H05K1/147 ,  H05K3/361 ,  H05K5/065 ,  H05K2201/0239 ,  H05K2203/1121 ,  H05K2203/1316 ,  Y10T29/49121 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49172 ,  Y10T29/5193

Abstract: An electronic assembly including a circuit board (16) and a flexible circuit interconnect (14) is overmolded by fixturing the assembly in a mold cavity such that a portion of the flexible circuit (14) protrudes from the mold, and providing a compressible elastomeric interface (18a/20a, 32) between the mold (18, 20) and the flexible circuit (14) to seal off the mold cavity and protect the flexible circuit (14) from damage due to the clamping force of the mold (18, 20). The portion of the flexible circuit (14) within the mold cavity is pre-coated with a material that ensures good adhesion with the molding compound (30), and a heat exchanger (26) thermally coupled to the portion of the flexible circuit (14) that protrudes from the mold protects the flexible circuit (14) from damage due to thermal conduction from the mold (18, 20) and mold compound (30).

公开(公告)号：EP1255797A4

公开(公告)日：2009-01-14

申请号：EP00992510

申请日：2000-11-16

Applicant: ELECTROCHEMICALS INC

Inventor： BERNARDS ROGER ,  GONZALEZ HECTOR ,  KUCERA AL ,  SCHANHAAR MIKE

IPC: C09K13/06 ,  C23C22/52 ,  C23C22/68 ,  C23F1/18 ,  H05K3/38 ,  H05K3/46 ,  C09K13/00 ,  B32B31/00

CPC classification number: C23C22/68 ,  C23C22/52 ,  C23C2222/20 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/0239 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. The adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier (Fig.1), and a uniformity enhancer (Fig.2). A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate.

公开(公告)号：EP1847575A4

公开(公告)日：2008-05-07

申请号：EP05819587

申请日：2005-12-26

Applicant: MITSUI MINING & SMELTING CO

Inventor： KAMIKORIYAMA Y ,  OGATA SUMIKAZU ,  ANAI KEI ,  SAWAMOTO HIROKI ,  HORIUCHI M ,  MUKUNO TAKASHI ,  YOSHIMARU KATSUHIKO

IPC: B01F17/16 ,  B01F17/18 ,  B01F17/52 ,  B22F1/00 ,  B22F9/24 ,  B41J2/01 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  B82Y99/00 ,  C09D11/00 ,  C09D11/322 ,  C09D11/326 ,  C09D11/38 ,  C09D11/52 ,  H01B1/00 ,  H01B1/20 ,  H01B1/22 ,  H05K3/10

CPC classification number: C09D11/52 ,  H01B1/22 ,  H05K1/097 ,  H05K2201/0239

Abstract: Disclosed is a conductive ink which enables to obtain a conductor having high film density and low electrical resistance. A circuit or the like formed by using such a conductive ink has excellent adhesion to a substrate. Specifically disclosed is a conductive ink obtained by dispersing a metal powder or metal oxide powder in a dispersion medium which is characterized in that the dispersion medium also contains a metal salt or a metal oxide as a film density improver for improving the film density of a conductor which is formed by using the conductive ink. One or a combination of two or more selected from the group consisting of water, alcohols, glycols and saturated hydrocarbons having a boiling point of not more than 300˚C at normal pressures is used as a main solvent constituting the dispersion medium.