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    Conductive fabric and method for forming the same
    81.
    发明公开
    Conductive fabric and method for forming the same 审中-公开
    LeitfähigerStoff und Herstellungsverfahrendafür

    公开(公告)号：EP2508337A1

    公开(公告)日：2012-10-10

    申请号：EP11160658.8

    申请日：2011-03-31

    Applicant: Tex-Ray Industrial Co., Ltd. ,  King's Metal Fiber Technologies Co., Ltd.

    Inventor： Lee, James ,  Huang, Hong Hsu

    IPC: B32B5/26 ,  D03D15/00 ,  H05K1/00

    CPC classification number: B32B5/26 ,  D03D11/00 ,  D03D15/00 ,  D10B2101/12 ,  D10B2401/16 ,  D10B2401/18 ,  H05K1/0289 ,  H05K1/038 ,  H05K1/189 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106

    Abstract: A conductive fabric and a method for forming the same are provided. The conductive fabric comprises a first layer and a second layer. The first layer has at least one first conductive thread and a plurality of first non-conductive threads. The at least one first conductive thread is woven within the plurality of first non-conductive threads. The second layer has at least one second conductive thread and a plurality of second non-conductive threads. The at least one second conductive thread is woven within the plurality of second non-conductive threads. The first layer is woven with the second layer and insulated from the second layer so that an electronic component can be attached to and electrically connect to the at least one first conductive thread of the first layer and the at least one second conductive thread of the second layer.

    Abstract translation: 提供导电性织物及其形成方法。 导电织物包括第一层和第二层。 第一层具有至少一个第一导电线和多个第一非导电线。 所述至少一个第一导电丝线在所述多个第一非导电丝线内编织。 第二层具有至少一个第二导电线和多个第二非导电线。 所述至少一个第二导电丝线在所述多个第二非导电丝线内编织。 第一层与第二层编织并与第二层绝缘，使得电子部件可以附接到电连接到第一层的至少一个第一导电线，并且电连接到第二层的至少一个第二导电线 层。

    Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
    90.
    发明公开
    Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials 审中-公开
    成本效益的由导电性树脂基材料的热管理装置或散热器

    公开(公告)号：EP1469513A3

    公开(公告)日：2004-12-15

    申请号：EP04368030.5

    申请日：2004-04-14

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01L23/373 ,  H01L23/427 ,  H01L23/367 ,  H01L23/467 ,  H01L23/473 ,  H01L33/00 ,  F21V29/00

    CPC classification number: F28D15/04 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  F21V29/677 ,  F21V29/76 ,  F21V29/89 ,  F21Y2115/10 ,  F28F3/048 ,  F28F21/062 ,  F28F21/067 ,  F28F2215/04 ,  G06K19/07749 ,  H01H2203/0085 ,  H01L21/4878 ,  H01L23/3737 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113 ,  H01L2924/00

    Abstract: Heat sinks, heat pipes, and other thermal management devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conducive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based heat sink, heat pipe, or other thermal management devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the heat sinks can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

    Abstract translation: 散热片，热管，和其它热管理器件形成的导电加载的树脂基材料制成。 导电负载的树脂基材料包括微米导电性粉末（S），导电纤维（S），或导电性粉末和导电性纤维的在基础树脂中的主机的组合。 有利于粉末（S），导电纤维（S），或导电导电粉和纤维与基体树脂宿主的重量的组合的重量的比为约12:20和00:40之间。 微米的导电粉末由非金属，颜色形成的：如碳，石墨，并因此可以被金属镀覆，或类似物，或由金属：如不锈钢，镍，铜，银，没因此可以金属镀，或 等，或由非金属的组合，镀，或与金属粉末的组合。 微米导体纤维优选是镀镍的碳纤维，不锈钢纤维，铜纤维，银纤维，或类似的。 如注塑压缩成型或挤出：所述导电加载的树脂系散热片，热管，或其它热管理装置可使用的方法来形成。 因而用于形成散热片，导电负载树脂基材料可以是在一个薄的柔性织物的形式也可容易地被切成期望的形状。

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