公开(公告)号：EP1804559A3

公开(公告)日：2008-04-30

申请号：EP06026834.9

申请日：2006-12-22

Applicant: EL-ME Aktiengesellschaft

Inventor： Fischer, Markus ,  Froschermeier, Günther

IPC: H05K1/18

CPC classification number: H05K1/0275 ,  G06F21/86 ,  H05K1/0268 ,  H05K1/162 ,  H05K1/167 ,  H05K1/186 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/10151

Abstract: Ein Elektronik-Sicherheits-Modul umfaßt einen geschützten Bereich (18), in dem sicherheitsrelevante Bauteile (20) untergebracht sind. Das Elektronik-Sicherheits-Modul weist wenigstens eine Leiterplatte (10, 12) mit Mäanderleitungen (26) auf. Die Mäanderleitungen (26) der Leiterplatte (10, 12) sind in wenigstens zwei Lagen übereinander angeordnet.

公开(公告)号：EP0766503B1

公开(公告)日：2007-07-18

申请号：EP96115548.8

申请日：1996-09-27

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ohtaki, Toru, c/o Canon K.K. ,  Ichida, Yasuteru, c/o Canon K.K. ,  Takeuchi, Yasushi, c/o Canon K.K.

IPC: H05K1/02 ,  H05K1/16

CPC classification number: H01L23/48 ,  H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/165 ,  H05K3/3421 ,  H05K2201/09263 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/09772 ,  H05K2201/1006 ,  H05K2201/10689 ,  Y10S257/924 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

公开(公告)号：EP1804559A2

公开(公告)日：2007-07-04

申请号：EP06026834.9

申请日：2006-12-22

Applicant: EL-ME Aktiengesellschaft

Inventor： Fischer, Markus ,  Froschermeier, Günther

IPC: H05K1/18

CPC classification number: H05K1/0275 ,  G06F21/86 ,  H05K1/0268 ,  H05K1/162 ,  H05K1/167 ,  H05K1/186 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/10151

Abstract: Ein Elektronik-Sicherheits-Modul umfaßt einen geschützten Bereich (18), in dem sicherheitsrelevante Bauteile (20) untergebracht sind. Das Elektronik-Sicherheits-Modul weist wenigstens eine Leiterplatte (10, 12) mit Mäanderleitungen (26) auf. Die Mäanderleitungen (26) der Leiterplatte (10, 12) sind in wenigstens zwei Lagen übereinander angeordnet.

Abstract translation: 电子安全模块，例如 为了防止在自动取款机等中未经授权的访问机密数据，在至少两个重叠的偏移层中具有用于相关电子部件（20）的安全区域和具有蛇形结构的导体（26）的电路板（10）。 导体的宽度（a）不大于150μm。 这些层通过连接钻孔（28）处的导电垫（30）互连。

公开(公告)号：EP1629391A2

公开(公告)日：2006-03-01

申请号：EP04785700.8

申请日：2004-05-20

Applicant: INTEL CORPORATION

Inventor： BENHAM, John ,  CRITCHLOW, John ,  LIANG, Tao

IPC: G06F13/40

CPC classification number: G06F13/4086 ,  H01P5/185 ,  H05K1/0239 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10189

Abstract: A compact electromagnetic coupler for use with digital transmission system is described. In one embodiment, the apparatus includes a first transmission structure, including a portion having a geometry. A second transmission structure having the geometry and positioned proximate the portion of the first transmission line structure having the geometry to form a compact electromagnetic coupler with the first transmission structure a geometry of the electromagnetic coupler to enable placement within a footprint of a standard card connector. The compact electromagnetic coupler so formed enables reconstruction of the logical state and timing of a signal transmitted along the first transmission structure.

公开(公告)号：EP1467604A3

公开(公告)日：2006-02-01

申请号：EP04252038.7

申请日：2004-04-06

Applicant: Nortel Networks Limited

Inventor： Duxbury, Guy ,  Wyrzkowska, Aneta ,  Difilippo, Luigi ,  Kwong, Herman

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K1/0298 ,  H05K1/112 ,  H05K3/0005 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/10734 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Techniques for reducing the number of layers in a multilayer signal routing device (10) are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method wherein the multilayer signal routing device (10) has a plurality of electrically conductive signal path layers (16) for routing a plurality of electrical signals thereon. The method may comprise forming a plurality of electrically conductive vias (26) in the multilayer signal routing device for electrically connecting at least two of the plurality of electrically conductive signal path layers (16), wherein the plurality of vias (26) are arranged so as to form at least one channel in at least one other of the plurality of electrically conductive signal path layers (16). The method may also comprise grouping at least a portion of the plurality of electrical signals based at least in part upon their proximity to the at least one channel so that they may be efficiently routed therein.

公开(公告)号：EP1605238A1

公开(公告)日：2005-12-14

申请号：EP05009634.6

申请日：2005-05-03

Applicant: Diehl AKO Stiftung & Co. KG

Inventor： Werner, Wolfgang ,  Sebald, Marc ,  Becke, Gerhard

IPC: G01K17/06

CPC classification number: H05K1/0201 ,  G01K17/06 ,  G01K17/08 ,  H05K1/0206 ,  H05K1/18 ,  H05K2201/0133 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/10151

Abstract: Bei einem elektronischer Heizkostenverteiler (1) mit einer in einem Gehäuse (2) angeordneten Leiterplatte (4), auf deren Bestückungsseite (17) an gegenüberliegenden Leiterplattenenden (19, 20) ein Raumlufttemperatursensor (5) und ein Heizkörpertemperatursensor (6) vorgesehen sind, ist dem Heizkörpertemperatursensor (6) ein erstes, auf der Bestückungsseite angeordnetes, wärmeleitfähiges und elastisch verformbares Element (11) zugeordnet. Dem Raumlufttemperatursensor (5) ist ein zweites, an einer Gehäuseinnenseite angeordnetes, wärmeleitfähiges und elastisch verformbares Element (10) zugeordnet, das mit dem Raumlufttemperatursensor (5) über eine Durchkontaktierung (21) von der Bestückungsseite (17) zur dieser gegenüberliegenden Plattenseite (18) der Leiterplatte (4) gekoppelt ist.

Abstract translation: 电子加热成本分配器（1）包括测量室内空气和加热器主体的温度的传感器（5,6），并且设置有导热和可弹性变形的元件（10,11）。

公开(公告)号：EP1037512B1

公开(公告)日：2005-09-07

申请号：EP00105207.5

申请日：2000-03-13

Applicant: MOLEX INCORPORATED

Inventor： Brunker, David L.

IPC: H05K1/02 ,  H01B7/08

CPC classification number: H05K1/0228 ,  H01B7/0876 ,  H05K1/0219 ,  H05K1/0245 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/097

公开(公告)号：EP1514327A2

公开(公告)日：2005-03-16

申请号：EP03731436.6

申请日：2003-05-28

Applicant: Decorp Americas, Inc.

Inventor： SEXTON, Robert, J. ,  McCURDY, Michael, W. ,  MURRAY, David ,  POTTER, James, M. ,  WALLING, Linda, Sue

IPC: H01P1/00

CPC classification number: H01P3/02 ,  H01P3/023 ,  H01P3/088 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/0245 ,  H05K2201/09263 ,  H05K2201/097 ,  H05K2201/09727

Abstract: A non-uniform transmission line includes at least one patterned conductive layer 8102, 104), a dielectric layer (103) adjacent to the patterned conductive layer(s) (102, 104), and insulating layer (101, 105) surrounding the patterned conductive layer(s) and the dielectric layer.

Abstract translation: 非均匀传输线包括至少一个图案化导电层8102,104），与图案化导电层（102,104）相邻的电介质层（103）以及围绕图案化导电层（102,104）的绝缘层（101,105） 导电层和介电层。

公开(公告)号：EP1376736A1

公开(公告)日：2004-01-02

申请号：EP03012278.2

申请日：2003-06-11

Applicant: HARRIS CORPORATION

Inventor： Rumpf, Raymond Charles ,  Killen, William Dean ,  Pike, Randy T.

IPC: H01P1/02

CPC classification number: H01P5/02 ,  H01P1/02 ,  H05K1/024 ,  H05K1/165 ,  H05K2201/0187 ,  H05K2201/09263 ,  H05K2201/09727

Abstract: A circuit for processing radio frequency signals. The circuit can include a substrate board that has at least one dielectric layer (100) having a first set of substrate properties over a first region (102). The first set of substrate properties can include a first permittivity and a first permeability. A second region (140) can be provided with a set of second substrate properties. The second region can have a second set of substrate properties including a second permittivity and a second permeability. The second permittivity can be different than the first permittivity and/or the second permeability can be different than the first permeability. A first transmission line (102) having at least one discontinuity can be coupled to the second region (108). The discontinuity can include a bend, corner, non-uniformity, break in the transmission line, or a junction between the first transmission line and a second transmission line.

Abstract translation: 一种用于处理射频信号的电路。 电路可以包括衬底板，其具有在第一区域（102）上具有第一组衬底特性的至少一个电介质层（100）。 第一组衬底特性可以包括第一介电常数和第一磁导率。 第二区域（140）可以具有一组第二基板特性。 第二区域可以具有包括第二介电常数和第二渗透率的第二组衬底特性。 第二介电常数可以不同于第一介电常数和/或第二磁导率可以不同于第一磁导率。 具有至少一个不连续性的第一传输线（102）可以耦合到第二区域（108）。 不连续性可以包括传输线中的弯曲，拐角，不均匀性，断裂或第一传输线与第二传输线之间的连接。

公开(公告)号：EP0940850B1

公开(公告)日：2003-08-13

申请号：EP99102664.2

申请日：1999-02-12

Applicant: Infineon Technologies AG

Inventor： Loeffler, Steffen

IPC: H01L25/065 ,  H05K1/14

CPC classification number: H05K1/14 ,  G11C5/04 ,  G11C5/063 ,  H05K1/0246 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10022 ,  H05K2201/10545 ,  H05K2201/10689 ,  H05K2203/1572