公开(公告)号：EP1280211A3

公开(公告)日：2006-09-20

申请号：EP02016661.7

申请日：2002-07-25

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki

IPC: H01L33/00

CPC classification number: H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: A lighting device using a light-emitting device with improved heat dissipation is offered. A lighting device with a light-emitting device mounted on a metal substrate (71) is offered. The light-emitting device consists of a plurality of conductive passages (51A, 51B) electrically separated from each other, an optical semiconductor element (25) attached to a desired conductive passage (51A, 51B) and a transparent resin (67) covering the optical semiconductor element. (25) and supporting the conductive passages (51A, 51B) in one piece. The method provides a light-emitting device consisting of a plurality of conductive passages (51A, 51B) electrically separated from each other, an optical semiconductor element (25) attached to a desired conductive passage (51B) and a transparent resin (67) covering the optical semiconductor element (25) and supporting the conductive passages (51A, 51B) in one piece.

Abstract translation: 提供了使用具有改善的散热的发光装置的照明装置。 提供了具有安装在金属基板（71）上的发光装置的照明装置。 发光装置由彼此电分离的多个导电通路（51A，51B）组成，附接到期望的导电通道（51A，51B）的光学半导体元件（25）和覆盖 光半导体元件。 （25），并且一体地支撑导电通路（51A，51B）。 该方法提供一种发光装置，其由彼此电分离的多个导电通路（51A，51B）组成，附接到期望的导电通道（51B）的光学半导体元件（25）和覆盖 光学半导体元件（25）并且一体地支撑导电通路（51A，51B）。

公开(公告)号：EP1162668A3

公开(公告)日：2006-07-05

申请号：EP01304772.5

申请日：2001-05-31

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Maehara, Eiju ,  Takahashi, Kouji ,  Sakamoto, Junji ,  Mashimo, Shigeaki ,  Okawa, Katsumi

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00

Abstract: There are provided the steps of preparing a conductive foil and then forming a plurality of conductive paths by forming isolation trenches, which are shallower than a thickness of the conductive foil, in the conductive foil except at least areas serving as the conductive paths, fixing respective photo semiconductor chips (65) to desired conductive paths, molding a light transparent resin (67) serving as a lens to cover respective photo semiconductor chips (65) individually and to fill the isolation trenches, and removing the conductive foil on the side on which the isolation trenches are not provided. Therefore, a light irradiating device (68), in which back surfaces of the conduction paths can be connected to the outside to thus eliminate through holes and which has the good radiation characteristic, can be implemented.

公开(公告)号：EP1191590A3

公开(公告)日：2004-04-14

申请号：EP01302974.9

申请日：2001-03-29

Applicant: Sanyo Electric Co., Ltd.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Mashimo, Sigeaki ,  Okawa, Katsumi ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L24/05 ,  H01L21/4821 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the insulating resin 44 and sealed. With this arrangement, fractures of the conductive paths 40 embedded in the insulating resin 44 are suppressed.

公开(公告)号：EP1122988A3

公开(公告)日：2004-03-24

申请号：EP00308680.8

申请日：2000-10-03

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Mashimo, Shigeaki ,  Okawa, Katsumi ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H05K1/00 ,  H05K3/20

CPC classification number: H01L21/6835 ,  H01L21/4846 ,  H01L2221/68377 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/045 ,  H05K3/06 ,  H05K3/107 ,  H05K3/202 ,  H05K2201/2072 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: After a isolation trench is formed in a conductive foil 70, insulating resin 50 is coated on the conducting foil 70 serving as a supporting board. The conductive foil 70 is turned upside down. Using the insulating resin 50 as another supporting board, the conductive foil is ground so that it is separated into the conductive passages. Thus, the mounting board can be constructed and manufactured using necessary and minimum material. The mounting board which can prevent the conductive passages from coming off can be realized by embedding the conductive passages 51 in the insulating resin to curve the side wall of each conductive passage 51 and/or make a visor coated on the conductive passage.

公开(公告)号：EP1199746A2

公开(公告)日：2002-04-24

申请号：EP01302527.5

申请日：2001-03-20

Applicant: SANYO ELECTRIC Co., Ltd.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Okada, Yukio ,  Igarashi, Yusuke ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/31 ,  H01L23/367

CPC classification number: H01L24/32 ,  G11B5/4853 ,  H01L21/4832 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10416 ,  H05K2201/10727 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

公开(公告)号：EP1195812A2

公开(公告)日：2002-04-10

申请号：EP01302532.5

申请日：2001-03-20

Applicant: Sanyo Electric Co., Ltd.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Okada, Yukio ,  Igarashi, Yusuke ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/367

CPC classification number: H05K1/021 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73257 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H05K1/0204 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10416 ,  H05K2201/10727 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The back surface of a semiconductor chip (16) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this semiconductor chip (16). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the metal plate (23) and the second supporting member (24).

公开(公告)号：EP1195746A2

公开(公告)日：2002-04-10

申请号：EP01302534.1

申请日：2001-03-20

Applicant: SANYO ELECTRIC Co., Ltd.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Okada, Yukio ,  Igarashi, Yusuke ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: G11B5/48

CPC classification number: H01L23/3135 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/4334 ,  H01L23/525 ,  H01L24/10 ,  H01L24/13 ,  H01L24/32 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/26175 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/10416 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a flexible sheet become substantially within a same plane, so that it is readily affixed to a second supporting member (24). In addition, the top surface of the heat radiation electrode (15) is made protrusive beyond the top surfaces of the pads (14) to reduce the distance between the semiconductor chip (16) and the heat radiation electrode (15). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) andthe second supporting member (24).

Abstract translation: 散热电极（15）从绝缘树脂（13）的背面露出，金属板（23）固定在该放热电极（15）上。 该金属板（23）的后表面和柔性片的后表面基本上在相同的平面内，从而容易地固定在第二支撑构件（24）上。 此外，散热电极（15）的上表面被突出超过焊盘（14）的顶表面，以减小半导体芯片（16）和散热电极（15）之间的距离。 因此，可以通过散热电极（15），金属板（23）和第二支撑构件（24）有效地散发由半导体芯片产生的热量。

公开(公告)号：EP1187204A2

公开(公告)日：2002-03-13

申请号：EP01302580.4

申请日：2001-03-20

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Mashimo, Shigeaki ,  Okawa, Katsumi ,  Maehara, Eiju ,  Takahashi, Kouji ,  Fukuda, Hirokazu ,  Etou, Hiroki

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L24/40 ,  H01L21/4821 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8485 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/06 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: After a trench 54 is formed in a conductive foil 60, a circuit element is mounted in a flip chip method. Then, an insulating resin 50 is covered on the conductive foil 60 as a support substrate. After reversion, the conductive foil 60 is polished over the insulating resin 50 as a support substrate at this time to separate the conductive paths. Accordingly, a circuit device having the conductive paths 51 and the circuit elements 52 supported by the insulating resin 50 can be produced without employing the support substrate.

Abstract translation: 在导电箔60中形成沟槽54之后，以倒装芯片方式安装电路元件。 然后，将绝缘树脂50覆盖在作为支撑基板的导电箔60上。 在回复之后，导电箔60此时作为支撑衬底在绝缘树脂50上抛光，以分离导电路径。 因此，可以在不使用支撑基板的情况下制造具有由绝缘树脂50支撑的导电路径51和电路元件52的电路装置。

公开(公告)号：EP1187205A3

公开(公告)日：2004-06-23

申请号：EP01302535.8

申请日：2001-03-20

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Okada, Yukio ,  Igarashi, Yusuke ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/498

CPC classification number: H01L24/32 ,  H01L21/4832 ,  H01L23/3121 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/26175 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2224/81 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Resin encapsulated chip-scale package in which contact pads (13) of a chip (12) are connected to respective conductive traces (11A-11D) that are formed on an insulating layer (AF) on the active face of the chip. Heat removal from the device is improved by providing a conductive pad (11D) on the insulating layer.

公开(公告)号：EP1199746A3

公开(公告)日：2004-04-21

申请号：EP01302527.5

申请日：2001-03-20

Applicant: SANYO ELECTRIC Co., Ltd.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Okada, Yukio ,  Igarashi, Yusuke ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/31 ,  H01L23/433 ,  H01L21/56

CPC classification number: H01L24/32 ,  G11B5/4853 ,  H01L21/4832 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10416 ,  H05K2201/10727 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor chip (16) is moulded in insulating resin (13). A heat radiation electrode (15) is exposed at the back surface of the insulating resin (13), and a metal plate (23) is affixed to this heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

Abstract translation: 散热电极（15）从绝缘树脂（13）的背面露出，金属板（23）固定在该放热电极（15）上。 该金属板（23）的后表面和第一支撑构件（11）的后表面基本上位于同一平面内，从而容易地固定在第二支撑构件（24）上。 因此，可以通过散热电极（15），金属板（23）和第二支撑构件（24）有效地散发由半导体芯片产生的热量。