公开(公告)号：EP1059668A3

公开(公告)日：2007-07-18

申请号：EP00302599.6

申请日：2000-03-29

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Shimizu, Hisashi ,  Ota, Susumu ,  Kobayashi, Yoshiyuki

IPC: H01L25/075 ,  A01G9/00 ,  A01G7/00

CPC classification number: H01L25/0753 ,  F21V29/00 ,  H01L24/97 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern (15,16) covered with Ni is formed on a metal substrate (11). Light emitting diodes (10) are mounted on the pattern in the form of a series circuit. Metal substrates (11) in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens (37) is formed for each of the light emitting diodes (10), whereby the emission efficiency can be further improved.
When a circuit is configured in one region of a hybrid integrated circuit substrate, a position recognition mark (53) and a flow stop (57) are disposed in the open region. Also the region is covered with Ni so as to function as reflecting means.

Abstract translation: 在将发光元件贴附到印刷电路板的光照射装置中，散热性能得到提高，并且实现了发光效率的提高和尺寸和重量的减小。 在金属基板（11）上形成被Ni覆盖的Cu图案（15,16）。 发光二极管（10）以串联电路的形式安装在图案上。 其中形成有串联连接的金属基板（11）彼此并联连接。 由于Ni具有优异的耐腐蚀性和高反射效率，所以基板本身的表面可以用作反射板。 为每个发光二极管（10）形成透镜（37），由此可以进一步改善发射效率。 当在混合集成电路基板的一个区域中配置电路时，位置识别标记（53）和流动停止（57）被设置在开放区域中。 而且该区域被Ni覆盖以用作反射装置。

公开(公告)号：EP1199746B1

公开(公告)日：2007-02-14

申请号：EP01302527.5

申请日：2001-03-20

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Okada, Yukio ,  Igarashi, Yusuke ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/31 ,  H01L23/433 ,  H01L21/56

CPC classification number: H01L24/32 ,  G11B5/4853 ,  H01L21/4832 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10416 ,  H05K2201/10727 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

公开(公告)号：EP1162669A3

公开(公告)日：2006-07-05

申请号：EP01304820.2

申请日：2001-05-31

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Maehara, Eiju ,  Takahashi, Kouji ,  Sakamoto, Junji ,  Mashimo, Shigeaki ,  Okawa, katsumi

IPC: H01L33/00

CPC classification number: H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light irradiating device (68) having the good radiation characteristic comprises a plurality of conductive paths (51) that are electrically separated, a photo semiconductor chips (65) fixed onto desired conductive path (51), and a resin (67) for covering the photo semiconductor chips (65) to support the conductive paths (51) integrally.

Abstract translation: 具有良好辐射特性的光照射装置（68）包括电分离的多个导电路径（51），固定在所需导电路径（51）上的光电半导体芯片（65）和用于覆盖 一体地支撑导电路径（51）的光电半导体芯片（65）。

公开(公告)号：EP1195813A3

公开(公告)日：2005-01-05

申请号：EP01302542.4

申请日：2001-03-20

Applicant: Sanyo Electric Co., Ltd.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Okada, Yukio ,  Igarashi, Yusuke ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/31 ,  H01L21/68

CPC classification number: H01L24/32 ,  G11B5/4853 ,  H01L21/4832 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68377 ,  H01L2224/02166 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/10416 ,  H05K2201/10727 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01046 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A heat radiation electrode (15) is exposed from the back surface of an insulating resin (13), and a metal plate (23) is affixed to the heat radiation electrode (15). The back surface of this metal plate (23) and the back surface of a first supporting member (11) are substantially within a same plane, so that it is readily affixed to a second supporting member (24). Accordingly, the heat generated by the semiconductor chip can be efficiently dissipated via the heat radiation electrode (15), the metal plate (23) and the second supporting member (24).

公开(公告)号：EP1187204A3

公开(公告)日：2004-05-06

申请号：EP01302580.4

申请日：2001-03-20

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Mashimo, Shigeaki ,  Okawa, Katsumi ,  Maehara, Eiju ,  Takahashi, Kouji ,  Fukuda, Hirokazu ,  Etou, Hiroki

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/68

CPC classification number: H01L24/40 ,  H01L21/4821 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8485 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/06 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: After a trench 54 is formed in a conductive foil 60, a circuit element is mounted in a flip chip method. Then, an insulating resin 50 is covered on the conductive foil 60 as a support substrate. After reversion, the conductive foil 60 is polished over the insulating resin 50 as a support substrate at this time to separate the conductive paths. Accordingly, a circuit device having the conductive paths 51 and the circuit elements 52 supported by the insulating resin 50 can be produced without employing the support substrate.

公开(公告)号：EP1143509A3

公开(公告)日：2004-04-07

申请号：EP00308481.1

申请日：2000-09-27

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Mashimo, Shigeaki ,  Okawa, Katsumi ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/31 ,  H01L21/68 ,  H01L21/48

CPC classification number: H05K1/188 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K3/20 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2224/45147

Abstract: After a trench 54 is formed in a first conductive foil 60A, the circuit elements are mounted, and the insulating resin is applied on the laminated conductive foil 60 as the support substrate. After being inverted, a second conductive foil 60B is etched on the insulating resin 50 as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths 51 and the circuit elements 52 are supported by the insulating resin 50, without the use of the support substrate. And the interconnects L1 to L3 for the circuit are formed, and can be prevented from slipping because of the curved structure and a visor 58.

公开(公告)号：EP1280211A2

公开(公告)日：2003-01-29

申请号：EP02016661.7

申请日：2002-07-25

Applicant: Sanyo Electric Co., Ltd.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki

IPC: H01L33/00

CPC classification number: H01L33/647 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: A lighting device using a light-emitting device with improved heat dissipation is offered. A lighting device with a light-emitting device mounted on a metal substrate (71) is offered. The light-emitting device consists of a plurality of conductive passages (51A, 51B) electrically separated from each other, an optical semiconductor element (25) attached to a desired conductive passage (51A, 51B) and a transparent resin (67) covering the optical semiconductor element. (25) and supporting the conductive passages (51A, 51B) in one piece. The method provides a light-emitting device consisting of a plurality of conductive passages (51A, 51B) electrically separated from each other, an optical semiconductor element (25) attached to a desired conductive passage (51B) and a transparent resin (67) covering the optical semiconductor element (25) and supporting the conductive passages (51A, 51B) in one piece.

公开(公告)号：EP1191590A2

公开(公告)日：2002-03-27

申请号：EP01302974.9

申请日：2001-03-29

Applicant: Sanyo Electric Co., Ltd.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Mashimo, Sigeaki ,  Okawa, Katsumi ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L24/05 ,  H01L21/4821 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: A semiconductor device is provided wherein conductive paths 40, formed of crystal that grows better along the X-Y axis than along the Z axis, are embedded in an insulating resin 44, and the back surface of the conductive path 40 is exposed through the insulating resin 44 and sealed. With this arrangement, fractures of the conductive paths 40 embedded in the insulating resin 44 are suppressed.

Abstract translation: 半导体芯片电连接到由沿着Z轴具有比沿着X和Y轴的晶体长大的导电材料制成的导电路径（32-34）。 涂覆在半导体芯片上的绝缘树脂和导电路径的上表面被填充到具有暴露背面的导电路径之间的分离槽中。 半导体模块包含独立的权利要求。

公开(公告)号：EP1184900A2

公开(公告)日：2002-03-06

申请号：EP01302533.3

申请日：2001-03-20

Applicant: SANYO ELECTRIC Co., Ltd.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Fukuda, Hirokazu ,  Etou, Hiroki ,  Takahashi, Kouji

IPC: H01L21/60

CPC classification number: H01L23/3107 ,  H01L21/4832 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A protection circuit device using a MOSFET has a plural of conductive paths separated electrically, a MOSFET chip integrating two power MOSFETs in one chip where a gate electrode and a source electrode are fixed on the desired conductive path, conductive material provided on a common drain electrode of the MOSFET, and insulating resin covering said MOSFET and supporting said conductive path in one body. Removing a drawing-around of the common drain electrode and fixing the source electrode directly on the conductive path, low ON-state resistance is realized.

Abstract translation: 使用MOSFET的保护电路装置具有多个电气分离的导电路径，在一个芯片中集成两个功率MOSFET的MOSFET芯片，其中栅极电极和源极电极固定在期望的导电路径上，设置在公共漏电极上的导电材料 的MOSFET，以及覆盖所述MOSFET并且将所述导电路径支撑在一个主体中的绝缘树脂。 除去普通漏电极的引出线，将源电极直接固定在导电路径上，实现低导通状态电阻。

公开(公告)号：EP1154473A2

公开(公告)日：2001-11-14

申请号：EP00308679.0

申请日：2000-10-03

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Sakamoto, Noriaki ,  Kobayashi, Yoshiyuki ,  Sakamoto, Junji ,  Mashimo, Shigeaki ,  Okawa, Katsumi ,  Maehara, Eiju ,  Takahashi, Kouji

IPC: H01L21/98 ,  H01L23/538

CPC classification number: H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/566 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In the present invention there is formed a sheet-like board member 50 having conductive coating films, such as first pads 55 and die pads 59, formed thereon or a sheet-like board member 50 which has been half-etched by using conductive coating films such as first pads 55 and die pads 59. A hybrid IC can be manufactured by means of utilization of post-processing processes of a semiconductor manufacturer. Further, a hybrid IC can be manufactured without adoption of a support board, and hence there can be manufactured a hybrid IC which is of lower profile and has superior heat dissipation characteristics.

Abstract translation: 在本发明中，形成有具有导电性涂膜的片状基板部件50，例如形成在其上的第一焊盘55和焊盘59，或者通过使用导电性涂膜半刻蚀的片状基板部件50 例如第一焊盘55和管芯焊盘59.可以通过利用半导体制造商的后处理工艺来制造混合IC。 此外，可以在不采用支撑板的情况下制造混合IC，因此可以制造具有较低轮廓并具有优异散热特性的混合IC。