公开(公告)号：EP1223612A1

公开(公告)日：2002-07-17

申请号：EP01930048.2

申请日：2001-05-11

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： ONO, Masahiro ,  SHIRAISHI, Tsukasa

IPC分类号： H01L21/60 ,  H01L23/29

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/13318 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13386 ,  H01L2224/1339 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/321 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24983 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29347 ,  H01L2224/29344 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29318 ,  H01L2224/29444 ,  H01L2224/05599

摘要： The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device and breakage of the interconnections when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of the substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load in comparison with structures using conventional anisotropic conductive films and the like, so that heat-press bonding mounting with a high productivity and a low cost can be applied.

摘要翻译： 本发明旨在提供当半导体器件封装在电路基片在半导体器件和互连的破损的特性，其防止劣化的半导体封装结构。 在具有安装在电路基板上的半导体器件的封装结构，凹凸的半导体装置的电极放置在电路基板的输入/输出端电极，并且电和与其通过与导电性粘接剂接合机械连接，和半导体器件是 由树脂薄膜形成的基片的表面上，以前粘接固定到电路基板。 结构确实的半导体功能部分和互连无损伤，并且允许在使用传统的各向异性导电膜和结构等相比较低的负荷安装，所以也热压粘合具有高的生产率和低成本可以安装 被应用。

公开(公告)号：EP1223612A4

公开(公告)日：2005-06-29

申请号：EP01930048

申请日：2001-05-11

申请人： MATSUSHITA ELECTRIC IND CO LTD

发明人： ONO MASAHIRO ,  SHIRAISHI TSUKASA

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/498 ,  H05K3/32 ,  H01L23/29

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/13318 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13386 ,  H01L2224/1339 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81101 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/321 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24983 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29347 ,  H01L2224/29344 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29318 ,  H01L2224/29444 ,  H01L2224/05599

摘要： A semiconductor mounting structure which does not cause characteristic degradation of semiconductor devices, wire breakage of wiring, or the like during mounting of semiconductor devices on circuit boards. A mounting structure comprising a circuit board with a semiconductor device mounted thereon, wherein a projecting electrode of the semiconductor device is arranged on the input/output terminal electrode of the circuit board and bonded thereto for electric and mechanical connection by a conductive adhesive, and the semiconductor device and circuit board are fixedly bonded by a resin film preformed on the board surface. This enables mounting without causing damage to the semiconductor functional parts or wiring and with lower load than in the conventional anisotropic conductive film; therefore, high-productivity low-cost thermo-compression bonding mounting can be applied.

公开(公告)号：EP3103567A1

公开(公告)日：2016-12-14

申请号：EP14881854.5

申请日：2014-02-04

申请人： Senju Metal Industry Co., Ltd

发明人： KAWASAKI Hiroyoshi ,  ROPPONGI Takahiro ,  SOMA Daisuke ,  SATO Isamu

IPC分类号： B22F1/00 ,  B22F9/08 ,  B22F9/14 ,  B23K35/14 ,  H01L21/60 ,  B23K1/00

CPC分类号： B23K35/0244 ,  B22F1/0003 ,  B22F1/0048 ,  B22F1/025 ,  B22F9/08 ,  B22F9/082 ,  B22F9/14 ,  B22F2009/0848 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2998/10 ,  B22F2999/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/0623 ,  B23K35/302 ,  B23K35/3033 ,  B23K2201/42 ,  C22C9/00 ,  C22C19/03 ,  C22F1/08 ,  C22F1/10 ,  H01L23/49816 ,  H01L23/556 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13117 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13124 ,  H01L2224/13138 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13149 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13163 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/1317 ,  H01L2224/13171 ,  H01L2224/13172 ,  H01L2224/13173 ,  H01L2224/13176 ,  H01L2224/13178 ,  H01L2224/13179 ,  H01L2224/1318 ,  H01L2224/13181 ,  H01L2224/13183 ,  H01L2224/13184 ,  H01L2224/132 ,  H01L2224/13211 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13305 ,  H01L2224/13309 ,  H01L2224/13317 ,  H01L2224/13318 ,  H01L2224/1332 ,  H01L2224/13323 ,  H01L2224/13324 ,  H01L2224/13338 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13349 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13363 ,  H01L2224/13364 ,  H01L2224/13366 ,  H01L2224/13369 ,  H01L2224/1337 ,  H01L2224/13371 ,  H01L2224/13372 ,  H01L2224/13373 ,  H01L2224/13376 ,  H01L2224/13378 ,  H01L2224/13379 ,  H01L2224/1338 ,  H01L2224/13381 ,  H01L2224/13383 ,  H01L2224/13384 ,  H01L2224/1339 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1369 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/81011 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/041 ,  B22F2202/13 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01051 ,  H01L2924/01032 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/01082 ,  H01L2924/01079 ,  H01L2924/01092 ,  H01L2924/0109 ,  H01L2924/01033 ,  H01L2924/00014 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01048 ,  H01L2924/01016 ,  H01L2924/01013 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/0106 ,  H01L2924/01071 ,  H01L2924/01069 ,  H01L2924/01021 ,  H01L2924/01068 ,  H01L2924/01059 ,  H01L2924/01067 ,  H01L2924/01066 ,  H01L2924/01065 ,  H01L2924/01064 ,  H01L2924/01061 ,  H01L2924/01057 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/0107 ,  H01L2924/01058 ,  H01L2924/01038 ,  H01L2924/01056 ,  H01L2924/01052 ,  H01L2924/01076 ,  H01L2924/01072 ,  H01L2924/01043 ,  H01L2924/01004

摘要： Produced is a metal ball which suppresses an emitted α dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb or Bi content or a total content of Pb and Bi of 1 ppm or more, and the pure metal having the boiling point higher than the boiling point at atmospheric pressure of the impurity to be removed; and sphering the molten pure metal in a ball.

摘要翻译： 产生的是一种抑制发射±剂量的金属球。 包括通过在高于要除去的杂质的沸点的温度下加热纯金属，高于纯金属的熔点并低于纯金属的沸点来熔化纯金属的步骤 金属，含有5ppb以下的U含量，5ppb以下的Th含量，99.9％以上且99.995％以下的纯度的纯金属，以及Pb或Bi含量或Pb和Bi的总含量 1ppm以上的纯金属，沸点高于除去杂质的大气压下的沸点的纯金属; 并将熔融的纯金属球磨成球。

公开(公告)号：EP2787799A4

公开(公告)日：2015-07-29

申请号：EP12854222

申请日：2012-11-14

申请人： FUJIKURA LTD

发明人： ITOI KAZUHISA ,  OKAMOTO MASAHIRO

IPC分类号： H05K3/46 ,  H01L23/367

CPC分类号： H05K3/10 ,  H01L21/4857 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/08237 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11416 ,  H01L2224/11418 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13316 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/1336 ,  H01L2224/1339 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73201 ,  H01L2224/73251 ,  H01L2224/73253 ,  H01L2224/80203 ,  H01L2224/80447 ,  H01L2224/80903 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8185 ,  H01L2224/81862 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8349 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/9221 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15153 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/186 ,  H05K3/0061 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0969 ,  H05K2201/10674 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/80 ,  H01L2224/16 ,  H01L2224/08 ,  H01L2224/32 ,  H01L2924/00

摘要： A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/ in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer.

摘要翻译： 阿部件内置基板包括堆叠在其中一个的具有布线图案的印刷电路基质多元以及通过在树脂基材上形成的/它们的，和内置在于此电子部件的包括，worin至少的打印的多个部分 布线的碱包括在所述配线图案的热布线，并通过包括热经由的印刷布线碱基的多个的至少一个具有形成于其中的开口，其中所述电子部件是内置的，并具有形成在其中的热传导层 并在相对的一侧紧密附着到表面上，以在内置于开口的电子部件的电极形成面，以及所述电子部件通过形成的孔固定在堆叠在热传导层上粘合层中的开口通过， 的区域中面对到热传导层的开口。

公开(公告)号：EP3103567A4

公开(公告)日：2017-11-01

申请号：EP14881854

申请日：2014-02-04

申请人： SENJU METAL INDUSTRY CO

发明人： KAWASAKI HIROYOSHI ,  ROPPONGI TAKAHIRO ,  SOMA DAISUKE ,  SATO ISAMU

IPC分类号： B22F1/00 ,  B22F1/02 ,  B22F9/08 ,  B22F9/14 ,  B23K1/00 ,  B23K1/008 ,  B23K3/06 ,  B23K35/02 ,  B23K35/14 ,  B23K35/30 ,  B23K101/42 ,  C22C9/00 ,  C22C19/03 ,  C22F1/08 ,  C22F1/10 ,  H01L21/60 ,  H01L23/00 ,  H01L23/498 ,  H01L23/556 ,  H05K3/34

CPC分类号： B23K35/0244 ,  B22F1/0003 ,  B22F1/0048 ,  B22F1/025 ,  B22F9/08 ,  B22F9/082 ,  B22F9/14 ,  B22F2009/0848 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2998/10 ,  B22F2999/00 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/0623 ,  B23K35/302 ,  B23K35/3033 ,  B23K2201/42 ,  C22C9/00 ,  C22C19/03 ,  C22F1/08 ,  C22F1/10 ,  H01L23/49816 ,  H01L23/556 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13117 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13124 ,  H01L2224/13138 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13149 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13163 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/1317 ,  H01L2224/13171 ,  H01L2224/13172 ,  H01L2224/13173 ,  H01L2224/13176 ,  H01L2224/13178 ,  H01L2224/13179 ,  H01L2224/1318 ,  H01L2224/13181 ,  H01L2224/13183 ,  H01L2224/13184 ,  H01L2224/132 ,  H01L2224/13211 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13305 ,  H01L2224/13309 ,  H01L2224/13317 ,  H01L2224/13318 ,  H01L2224/1332 ,  H01L2224/13323 ,  H01L2224/13324 ,  H01L2224/13338 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13349 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13363 ,  H01L2224/13364 ,  H01L2224/13366 ,  H01L2224/13369 ,  H01L2224/1337 ,  H01L2224/13371 ,  H01L2224/13372 ,  H01L2224/13373 ,  H01L2224/13376 ,  H01L2224/13378 ,  H01L2224/13379 ,  H01L2224/1338 ,  H01L2224/13381 ,  H01L2224/13383 ,  H01L2224/13384 ,  H01L2224/1339 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/1369 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/041 ,  H01L2924/01092 ,  H01L2924/0109 ,  B22F2202/13 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0106 ,  H01L2924/01032 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01071 ,  H01L2924/01051 ,  H01L2924/01069 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01026 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/01059 ,  H01L2924/01079 ,  H01L2924/01067 ,  H01L2924/01066 ,  H01L2924/01065 ,  H01L2924/01064 ,  H01L2924/01061 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/0102 ,  H01L2924/01063 ,  H01L2924/0107 ,  H01L2924/01058 ,  H01L2924/00014 ,  H01L2924/01038 ,  H01L2924/01056 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01043 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01048 ,  H01L2924/01052 ,  H01L2924/01004 ,  H01L2924/01016 ,  H01L2924/01076 ,  H01L2924/01013 ,  H01L2924/01012 ,  H01L2924/01022 ,  H01L2924/01025

摘要： Produced is a metal ball which suppresses an emitted ± dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal, and lower than a boiling point of the pure metal, the pure metal containing a U content of 5 ppb or less, a Th content of 5 ppb or less, purity of 99.9% or more and 99.995% or less, and a Pb or Bi content or a total content of Pb and Bi of 1 ppm or more, and the pure metal having the boiling point higher than the boiling point at atmospheric pressure of the impurity to be removed; and sphering the molten pure metal in a ball.

公开(公告)号：EP2787799A1

公开(公告)日：2014-10-08

申请号：EP12854222.2

申请日：2012-11-14

申请人： Fujikura Ltd.

发明人： ITOI, Kazuhisa ,  OKAMOTO, Masahiro

IPC分类号： H05K3/46

CPC分类号： H05K3/10 ,  H01L21/4857 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/02311 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05569 ,  H01L2224/08237 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11416 ,  H01L2224/11418 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13316 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/1336 ,  H01L2224/1339 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73201 ,  H01L2224/73251 ,  H01L2224/73253 ,  H01L2224/80203 ,  H01L2224/80447 ,  H01L2224/80903 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8185 ,  H01L2224/81862 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8349 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/9221 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/15153 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/186 ,  H05K3/0061 ,  H05K3/4602 ,  H05K3/4614 ,  H05K2201/0969 ,  H05K2201/10674 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/80 ,  H01L2224/16 ,  H01L2224/08 ,  H01L2224/32 ,  H01L2924/00

摘要： A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/ in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer.