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    High frequency module
    91.
    发明专利
    High frequency module 有权
    高频模块

    公开(公告)号：JP2013236166A

    公开(公告)日：2013-11-21

    申请号：JP2012105974

    申请日：2012-05-07

    Applicant: Murata Mfg Co Ltd ,  株式会社村田製作所

    Inventor： UEJIMA TAKANORI

    IPC: H01P1/15 ,  H01Q1/50 ,  H04B1/40

    CPC classification number: H01Q1/50 ,  H04B1/0458 ,  H04B1/18 ,  H05K1/0243 ,  H05K1/025 ,  H05K2201/09227

    Abstract: PROBLEM TO BE SOLVED: To provide a high frequency module capable of realizing an excellent passage characteristic while conforming an impedance in a wide frequency band.SOLUTION: A high frequency module 10 comprises a switch IC 11, and a conformity circuit 12. The high frequency module 10 is provided with a laminate 100. The switch IC 11 and an inductor AL 1 of the conformity circuit 12 are mounted on a top surface of the laminate 100. A top surface land electrode on which a common terminal Pcom of the switch IC 11 is mounted is connected to one end of a wiring conductor 201 through a via conductor. The other end of the wiring conductor 201 is connected to the top surface land electrode on which a terminal electrode on one end of the inductor AL 1 is mounted through the via conductor. The end of the inductor AL 1 on a side connected to the common terminal Pcom of the switch IC 10 is arranged at a position proximate to the common terminal Pcom of the switch IC 10, and therefore, length of the wiring conductor 201 is made shorter than a conventional constitution, and a parasitic capacitor is reduced.

    Abstract translation: 要解决的问题：提供一种能够实现良好的通过特性同时符合宽频带中的阻抗的高频模块。解决方案：高频模块10包括开关IC 11和一致性电路12.高频 模块10设置有层压体100.开关IC 11和一体电路12的电感器AL 1安装在层叠体100的上表面上。顶表面焊盘电极，开关IC 11的公共端子Pcom 通过通孔导体连接到布线导体201的一端。 布线导体201的另一端通过通孔导体连接到其上安装有电感器AL1的一端上的端子电极的顶表面焊盘电极。 连接到开关IC 10的公共端子Pcom的一侧上的电感器AL 1的端部布置在靠近开关IC 10的公共端子Pcom的位置，因此布线导体201的长度变短 比传统的结构，并且减少了寄生电容器。

    Wiring board and manufacturing method of the same
    92.
    发明专利
    Wiring board and manufacturing method of the same 有权
    接线板及其制造方法

    公开(公告)号：JP2013219191A

    公开(公告)日：2013-10-24

    申请号：JP2012088642

    申请日：2012-04-09

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： FURUICHI JUN ,  TATEIWA AKIHIKO ,  KOIZUMI NAOYUKI

    IPC: H05K3/46

    CPC classification number: H05K1/115 ,  H01L23/145 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H05K1/0298 ,  H05K3/002 ,  H05K3/4605 ,  H05K3/4694 ,  H05K2201/09227

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring board including a core board where through electrodes having different diameters are formed.SOLUTION: A core board 21 of a wiring board 20 includes: first and second core boards 30, 40; a first insulation member 23; and a second insulation member 24. A first through electrode 33 is formed in a first through hole 32 that is formed having a predetermined hole diameter (a first diameter) at a first glass board 31 of the first core board 30. Further, a second through electrode 43 is formed in a second through hole 42 that is formed having a hole diameter (a second diameter) larger compared to the first through hole 32 at a second glass board 41 of the second core board 40. The first and second core boards 30, 40 are arranged parallel with each other in a plane direction so as to be spaced away from each other through the first insulation member 23 formed in a gap 22 between the core boards 30, 40.

    Abstract translation: 要解决的问题：提供一种包括形成具有不同直径的贯通电极的芯板的布线基板。解决方案：布线板20的芯板21包括：第一和第二芯板30,40; 第一绝缘构件23; 和第二绝缘构件24.第一通孔33形成在第一通孔32中，第一通孔32在第一芯板30的第一玻璃板31处形成为具有预定孔直径（第一直径）。此外，第二通孔 通孔电极43形成在第二通孔42中，第二通孔42在第二芯板40的第二玻璃板41处形成有与第一通孔32相比更大的孔直径（第二直径）。第一和第二芯板 30,40在平面方向上彼此平行地布置成通过形成在芯板30,40之间的间隙22中的第一绝缘构件23彼此间隔开。

    Signal transmission circuit
    93.
    发明专利
    Signal transmission circuit 有权

    公开(公告)号：JP5324619B2

    公开(公告)日：2013-10-23

    申请号：JP2011091408

    申请日：2011-04-15

    Applicant: 株式会社日立製作所

    Inventor： 康浩 池田 ,  裕 植松 ,  諭 村岡

    IPC: H04L25/02 ,  H05K1/02

    CPC classification number: H05K1/0243 ,  H05K1/0251 ,  H05K1/115 ,  H05K2201/09227 ,  H05K2201/09772 ,  H05K2201/10545 ,  H05K2201/10689

    Abstract: Provided is a signal transfer circuit which uses a low cost circuit board with a high packing density but is capable of reducing a crosstalk noise between signal lines and also reducing a reflection noise due to a stub. A signal transfer circuit of the present invention is configured such that lead terminals of electronic components and through-hole vias are connected to each other by surface wirings, respectively, to allow no branching from the middle of the through-hole vias. Further, first wirings connecting a first electronic component are each arranged between a corresponding pair of second wirings connecting a second electronic component, and signals are transmitted through the first wirings and the second wirings by interleaved transmission.

    Laminated sintered ceramic wiring board and semiconductor package including the same
    95.
    发明专利
    Laminated sintered ceramic wiring board and semiconductor package including the same 审中-公开
    层压烧结陶瓷接线板及其半导体封装

    公开(公告)号：JP2013048211A

    公开(公告)日：2013-03-07

    申请号：JP2012121088

    申请日：2012-05-28

    Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

    Inventor： TANI MAKOTO ,  HIRAI TAKAMI ,  YANO SHINSUKE ,  TANABE DAISHI

    IPC: H01L23/12 ,  H01L23/13 ,  H05K3/46

    CPC classification number: H05K3/4629 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5283 ,  H01L2924/0002 ,  H05K1/0242 ,  H05K3/4623 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/098 ,  H05K2201/09827 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a laminated sintered wiring board which has a low open failure rate and also excellent high temperature and high humidity reliability regardless of having a fine wiring layer.SOLUTION: At least a part of an in-plane conductor is formed in a fine line and a cross-sectional shape of the in-plane conductor formed in the fine line is made in a trapezoid, and a height a of the trapezoidal cross section, a length c of the lower base, a length d of the upper base, and a space b between trapezoidal cross sectional lower bases of the in-plate conductor adjacent to each other in a plane parallel to the main surface of a substrate satisfy a specific relation.

    Abstract translation: 要解决的问题：提供一种具有低开放故障率和优异的高温和高湿度可靠性的层压烧结布线板，而不管具有精细的布线层。 解决方案：在细线中形成面内导体的至少一部分，并且形成在细线中的面内导体的横截面形状形成为梯形，并且高度a为 梯形截面，下基座的长度c，上基座的长度d，以及板平面导体的梯形横截面下基座之间的空间b，该基座在与 底物满足特定关系。 版权所有（C）2013，JPO＆INPIT

    Electronic component module
    99.
    发明专利
    Electronic component module 审中-公开
    电子元件模块

    公开(公告)号：JP2010232314A

    公开(公告)日：2010-10-14

    申请号：JP2009076586

    申请日：2009-03-26

    Applicant: Tdk Corp ,  Tdk株式会社

    Inventor： FURUKAWA HIROTADA ,  ISHIBASHI MITSURU

    IPC: H01L25/00 ,  H01L23/12

    CPC classification number: H05K1/113 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/14 ,  H05K1/0203 ,  H05K1/185 ,  H05K3/3442 ,  H05K2201/09227 ,  H05K2201/09627 ,  H05K2201/1003 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component module capable of suppressing propagation to a passive component of a heat generated in a substrate. SOLUTION: In a module 1 for a DC-DC converter as the electronic component module, a through-hole 16a formed on a substrate 3 as a wiring L1 for electrically connecting a terminal 2c as a voltage output terminal for an IC 2 and a terminal 42a for an inductor component 4 and a through-hole 16b formed on the substrate as a wiring L2 for electrically connecting a terminal 2b as a switching terminal for the IC 2 and a terminal 42b for the inductor component 4 are opposed in a direction crossing with a direction (that is, the longitudinal direction of the substrate and the inductor component 4) in which the terminal 42a and the terminal 42b face each other in the inductor component. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种能够抑制在基板中产生的热量向无源部件传播的电子部件模块。 解决方案：在作为电子部件模块的DC-DC转换器的模块1中，形成在作为用于IC2的电压输出端子的端子2c电连接的布线L1的基板3上的通孔16a 并且形成在基板上的用于电感器部件4的端子42a和形成在作为用于IC 2的开关端子的端子2b和用于电感器部件4的端子42b的布线L2的基板上的通孔16b在 方向（即，基板和电感器部件4的纵向方向）交叉，其中端子42a和端子42b在电感器部件中彼此面对。 版权所有（C）2011，JPO＆INPIT

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