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公开(公告)号：JP2010141204A
公开(公告)日：2010-06-24
申请号：JP2008317410
申请日：2008-12-12
Applicant: Shinko Electric Ind Co Ltd , 新光電気工業株式会社
Inventor： KANEKO KENTARO
IPC: H01L23/12
CPC classification number: H01L23/13 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L25/105 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2225/1058 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/3511 , H05K1/183 , H05K3/205 , H05K3/4682 , H05K3/4697 , H05K2201/09472 , H05K2201/09481 , H05K2201/10674 , H05K2203/0369 , H05K2203/0376 , Y10T156/10 , H01L2924/00012 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To improve connection reliability by enabling POP (package-on-package) connection to be easily made, and to contribute to miniaturization and thinning. SOLUTION: A wiring board (package) 10 has a cavity CV formed in an outermost insulating layer 12 on one surface side of the wiring board at a position corresponding to a chip mounting area, and includes a pad P1 exposed on a surface of the insulating layer 12 in the cavity CV and a pad P2 exposed on the surface of the insulating layer 12 at a periphery of the cavity CV. Then a chip 31 is flip-chip connected to the pad P1 in the cavity CV of the package 10, and another package 40 is connected to the pad P2 at the periphery of the cavity CV to constitute a semiconductor device 30 having a POP structure. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：通过使POP（封装封装）连接容易进行，并且有助于小型化和减薄，从而提高连接的可靠性。 解决方案：布线板（封装）10在与芯片安装区域对应的位置处在布线板的一个表面侧上的最外层绝缘层12中形成有空腔CV，并且包括在表面上露出的焊盘P1 的空腔CV中的绝缘层12和在空腔CV的周边处露出在绝缘层12的表面上的焊盘P2。 然后将芯片31倒装芯片连接到封装10的腔CV中的焊盘P1，另一封装40连接到腔CV周围的焊盘P2，以构成具有POP结构的半导体器件30。 版权所有（C）2010，JPO＆INPIT
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62.发明专利Printed circuit board comprising metal bump and method of manufacturing the same 审中-公开印刷电路板包含金属保险丝及其制造方法
公开(公告)号：JP2010135720A
公开(公告)日：2010-06-17
申请号：JP2009052541
申请日：2009-03-05
Applicant: Samsung Electro-Mechanics Co Ltd , 三星電機株式会社
Inventor： AN JIN-YONG , KIM KI HWAN
CPC classification number: H05K3/4007 , H05K3/061 , H05K3/243 , H05K3/4644 , H05K3/4682 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2201/096 , H05K2203/054 , H05K2203/1536
Abstract: PROBLEM TO BE SOLVED: To provide a structure of a printed circuit board comprising a metal bump having fine pitches and uniform height, and a method of manufacturing the same.
SOLUTION: The printed circuit board includes: metal bumps 900 having constant diameters and protruding over an insulation layer 300; a circuit layer 530 formed beneath the insulation layer 300; and vias 510 passing through the insulation layer 300 to electrically connect the metal bumps 900 with the circuit layer 530.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供一种包括具有细间距和均匀高度的金属凸块的印刷电路板的结构及其制造方法。 解决方案：印刷电路板包括：具有恒定直径并突出在绝缘层300上的金属凸块900; 形成在绝缘层300下方的电路层530; 和通孔510穿过绝缘层300以将金属凸块900与电路层530电连接。版权所有（C）2010，JPO＆INPIT
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63.发明专利Interconnection line wiring device, image display device and method of manufacturing interconnection line wiring device 有权互连线接线装置，图像显示装置及制造互连线接线装置的方法
公开(公告)号：JP2010072256A
公开(公告)日：2010-04-02
申请号：JP2008238676
申请日：2008-09-17
Applicant: Nec Lcd Technologies Ltd , Nec液晶テクノロジー株式会社
Inventor： YAJIMA AKIHIRO
IPC: G02F1/1345
CPC classification number: H05K1/117 , G02F1/1345 , H05K1/0263 , H05K2201/0784 , H05K2201/09263 , H05K2201/09481 , H05K2201/09727 , Y10T29/49147
Abstract: PROBLEM TO BE SOLVED: To sufficiently uniformize resistance values of a plurality of interconnection lines 26. SOLUTION: An interconnection line wiring device has an insulating layer 24 for electrical insulation, a connection portion 32 provided penetrating the insulating layer 24, an external connection terminal 28 formed on one surface of the insulating layer 24, and the interconnection line 26 formed on the other surface of the insulating layer 24. Then the connection portion 32 connects the external connection terminal 28 and interconnection line 26 to each other. Further, one end of the interconnection line 26 is connected to a conductor 27. The other end of the interconnection line 26 is connected to the external connection terminal 28 by the connection portion 32 at a position predetermined distance from a first end of the external connection terminal 28 on the side of the conductor 27. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：为了使多条互连线26的电阻值均匀化。解决方案：布线布线装置具有用于电绝缘的绝缘层24，穿过绝缘层24的连接部分32 ，形成在绝缘层24的一个表面上的外部连接端子28和形成在绝缘层24的另一个表面上的互连线26.然后，连接部32将外部连接端子28和互连线26彼此连接 。 此外，互连线26的一端连接到导体27.互连线26的另一端通过连接部32在与外部连接的第一端预定距离的位置处连接到外部连接端子28 端子28在导体27的一侧。版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JPWO2008041484A1
公开(公告)日：2010-02-04
申请号：JP2008537447
申请日：2007-09-19
Applicant: アルプス電気株式会社
IPC: H01L21/60
CPC classification number: H01R43/0214 , H01L23/49811 , H01L24/12 , H01L24/16 , H01L24/81 , H01L24/83 , H01L2224/13099 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/81201 , H01L2224/81206 , H01L2224/81222 , H01L2224/81234 , H01L2224/81385 , H01L2224/81464 , H01L2224/81801 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19042 , H01R13/2421 , H05K3/326 , H05K3/4015 , H05K3/42 , H05K2201/0311 , H05K2201/0367 , H05K2201/09481 , H05K2201/10265 , H05K2201/10378 , H05K2201/10734 , Y10T156/10 , H01L2924/01083 , H01L2924/00014 , H01L2224/83851 , H01L2924/00
Abstract: 【課題】 ICパッケージなどの電子部品の接続電極との間の接合強度を高める弾性接触子および金属端子間の接合方法を提供する。【解決手段】ハンダで形成された電子部品側の接続電極42と弾性接触子20の先端部22bとが接触部Oで接触している。弾性接触子20は先端部22bに抵抗層が形成されており、先端部22bが誘導コイル50の隙間51内に配置されている。前記誘導コイル50に所定の高周波電流を流すと、前記抵抗部が電磁誘導によって発熱し、接続電極42のハンダが溶けて前記弾性接触子20の先端部22bに流れ込むため、弾性接触子20の先端部22bと接続電極42との間を、前記接触部Oの一点で強固に接合することができる。【選択図】図4
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公开(公告)号：JP2009295989A
公开(公告)日：2009-12-17
申请号：JP2009138546
申请日：2009-06-09
Inventor： KIM TAE-JOON
CPC classification number: H05K1/118 , G02B6/0068 , G02B6/0083 , G02F1/133615 , H05K3/28 , H05K3/363 , H05K3/4046 , H05K2201/09481 , H05K2201/0979 , H05K2201/10106 , H05K2201/10386
Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed circuit board the lamp of which can be lit, even if breakage part occurs at an end part of a power source applying wire to be connected to the lamp. SOLUTION: The flexible printed circuit board has a base film formed by an insulating substance; a power source applying wire arranged on one surface of the base film, a bypass wire arranged on the other surface of the base film in opposition to the one surface; a first connection wire to electrically connect the power source applying wire and the bypass wire; a second connection wire, to electrically connect the power source applying wire and the bypass wire and arranged so as to be separated from the first connection wire; and a first cover film that is arranged on the one surface of the base film and the power source applying wire, which covers the second connecting wire and exposes the first connecting wire. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：即使在要连接到灯的电源施加导线的端部处发生断裂部分，也可以提供其灯点亮的柔性印刷电路板。 解决方案：柔性印刷电路板具有由绝缘物质形成的基膜; 布置在所述基膜的一个表面上的电源施加线，与所述一个表面相对布置在所述基膜的另一个表面上的旁路线; 用于将电源施加线和旁路线电连接的第一连接线; 第二连接线，用于电连接所述电源施加线和所述旁路线，并且被布置成与所述第一连接线分离; 以及布置在基膜的一个表面上的第一覆盖膜和覆盖第二连接线并暴露第一连接线的电源施加电线。 版权所有（C）2010，JPO＆INPIT
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Patent Agency Ranking66.发明专利Printed-circuit board, method of forming frame ground of printed-circuit board, and electronic apparatus 审中-公开印刷电路板，印刷电路板的框架形成方法和电子设备
公开(公告)号：JP2009212124A
公开(公告)日：2009-09-17
申请号：JP2008050691
申请日：2008-02-29
Applicant: Toshiba Corp , Toshiba Misawa Media Kiki Kk , 東芝三沢メディア機器株式会社 , 株式会社東芝
Inventor： ISHII NORIHIRO , HOSODA KUNIYASU , AIUCHI MASAYA
CPC classification number: H05K1/116 , H05K1/0215 , H05K3/325 , H05K3/3484 , H05K2201/09481 , H05K2201/0979 , H05K2201/10409 , H05K2203/043
Abstract: PROBLEM TO BE SOLVED: To provide a printed-circuit board with a frame ground part thin-formed.
SOLUTION: The printed-circuit board includes: the frame ground parts 11 with conductive patterns 13a, 13b formed in the periphery of installation holes 12 for fixing; and a plurality of through-holes 14 provided in the periphery of the installation holes 12 of the frame ground part 11. The method of forming the printed-circuit board includes the steps of: applying the cream solder 15 to the through-holes 14 in a cream solder printing step in a component mounting step; melting the cream solder 15 in a reflow step; introducing a part of the melted cream solder 15 into the through-holes 14; attaching them to the conductive patterns 13a, 13b of the through-holes 14 and their periphery; and forming the solder film.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供一种薄型化的框架接地部的印刷电路板。 解决方案：印刷电路板包括：框架接地部分11，其具有形成在用于固定的安装孔12的周围的导电图案13a，13b; 以及设置在框架接地部11的安装孔12的周边的多个通孔14.形成印刷电路板的方法包括以下步骤：将膏状焊料15施加到通孔14中 在部件安装步骤中的膏状焊料印刷步骤; 在回流步骤中熔化膏状焊料15; 将熔融的奶油焊料15的一部分引入到通孔14中; 将它们连接到通孔14的导电图案13a，13b及其周边; 并形成焊料膜。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JPWO2007123190A1
公开(公告)日：2009-09-03
申请号：JP2008512156
申请日：2007-04-20
Applicant: イビデン株式会社
IPC: H05K3/34
CPC classification number: B23K3/0623 , H01L2224/05568 , H01L2224/05573 , H01L2224/11334 , H01L2924/00014 , H05K3/3478 , H05K3/4644 , H05K2201/09481 , H05K2203/0195 , H05K2203/0557 , H05K2203/082 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , Y10T29/53204 , Y10T29/53209 , Y10T29/53213 , H01L2224/05599
Abstract: 【課題】微細な半田ボールをパッドに搭載でき、リフローする際にバンプへボイドの入らない半田ボール搭載装置を提供する。【解決手段】不活性ガスを供給し、ボール整列用マスク16の上方に位置させた搭載筒24から不活性ガスを吸引することで、半田ボール78sを集合させる。搭載筒24を水平方向に移動させることで、集合させた半田ボール78sをボール整列用マスク16の上に転動させ、ボール整列用マスク16の開口16aを介して、半田ボール78sを多層プリント配線板10の接続パッド75へ落下させる。不活性ガス雰囲気中で半田ボール78sを搭載させることで、半田ボール表面の酸化を防ぎ、リフローの際のボイドの混入を防ぐ。【選択図】図4
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68.发明专利
公开(公告)号：JP2009182197A
公开(公告)日：2009-08-13
申请号：JP2008020598
申请日：2008-01-31
Applicant: Shinko Electric Ind Co Ltd , 新光電気工業株式会社
Inventor： HARUHARA MASAHIRO , MURAYAMA HIROSHI
CPC classification number: H01H37/52 , H01H11/00 , H01L2224/73204 , H01L2924/15311 , H05K1/0201 , H05K1/16 , H05K3/4092 , H05K3/4602 , H05K2201/0397 , H05K2201/068 , H05K2201/09036 , H05K2201/09481 , H05K2201/10053 , H05K2203/308
Abstract: PROBLEM TO BE SOLVED: To achieve size reduction and cost reduction of a mounting board by avoiding trouble caused by a rise in temperature of a mounted electronic component and decreasing the number of external components. SOLUTION: The wiring board 30 mounted with the electronic component 40 has a switch element portion 21 interposed in a signal transmission line including a wiring layer 13 connecting with an electrode terminal 41 of the electronic component 40. The switch element portion 21 has a structure changing in shape depending upon temperature, and blocks the signal transmission line when the temperature exceeds a predetermined temperature. On a bottom portion of a cavity CV formed on an electronic component mounting surface side of the wiring board 30, a conductor layer 22 is formed which forms a portion of the signal transmission line. One end of the switch element portion 21 is fixedly connected to the wiring layer 13, and the other end is in contact with the conductor layer 22 when the temperature is below a predetermined temperature. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：通过避免安装的电子部件的温度上升引起的故障并减少外部部件的数量，来实现安装板的尺寸减小和成本降低。 解决方案：安装有电子部件40的布线板30具有插入到包括与电子部件40的电极端子41连接的布线层13的信号传输线中的开关元件部21.开关元件部21具有 结构根据温度变化的结构，并且当温度超过预定温度时阻挡信号传输线。 在形成在布线基板30的电子部件安装面侧的空腔CV的底部形成有形成信号传输线的一部分的导体层22。 开关元件部分21的一端固定地连接到布线层13，并且当温度低于预定温度时，另一端与导体层22接触。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP3152077U
公开(公告)日：2009-07-16
申请号：JP2009002911
申请日：2009-05-01
Applicant: 敏理投資股▲ふん▼有限公司
CPC classification number: G06F3/045 , G06F3/0416 , H05K3/361 , H05K3/4069 , H05K2201/09481
Abstract: 【課題】電子装置の表示器及びタッチパネルにおいて、フレーム上へ容易に、かつ確実に取り付けられる平坦面を有し、可視領域が増加する平坦なタッチパネルを提供する。【解決手段】タッチパネル1は、第一基板10、第二基板13、上部透明導電フィルム11、下部透明導電フィルム12、多数のスペーサ、2つのX軸導電線110、2つのY軸導電線130、2つの第一引き出し線111、2つの第二引き出し線131a、131b、及び柔軟なプリント回路板14を有する。【選択図】図1
Abstract translation: 本发明提供一种显示装置和电子设备的触摸面板，容易在框架上，肯定具有安装平面，提供了一种平板可见区域增加。 的触摸面板1中，第一基板10，第二基板13，上侧透明导电膜11，下透明导电膜12，多个间隔件，两个X Jikushirube线110，两个Y Jikushirube线130， 具有两个第一引线111,21秒引线131A，131B，和一个柔性的印刷电路板14。 点域1
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公开(公告)号：JP4276881B2
公开(公告)日：2009-06-10
申请号：JP2003125676
申请日：2003-04-30
Applicant: 日本圧着端子製造株式会社
CPC classification number: H01R12/721 , H01R12/774 , H01R12/79 , H05K3/365 , H05K2201/0367 , H05K2201/09163 , H05K2201/09481
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