公开(公告)号：JP6353276B2

公开(公告)日：2018-07-04

申请号：JP2014107759

申请日：2014-05-26

申请人： ハネウェル・インターナショナル・インコーポレーテッド ,  Honeywell International Inc.

发明人： ドナルド・ホークハイマー ,  ポール・エス・フェチュナー ,  デーヴィッド・エス・ウィリッツ

IPC分类号： G01N27/416 ,  G01N27/414

CPC分类号： G01N27/414 ,  B32B37/1292 ,  C03C27/00 ,  G01N27/4148 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/29499 ,  H01L2224/3003 ,  H01L2224/30051 ,  H01L2224/3015 ,  H01L2224/30505 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/35 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

公开(公告)号：JP5373832B2

公开(公告)日：2013-12-18

申请号：JP2011025214

申请日：2011-02-08

申请人： インターナショナル レクティフィアー コーポレイション

发明人： チェアー チュアン ,  エイ ブリエール マイケル

IPC分类号： H01L21/338 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/522 ,  H01L27/095 ,  H01L29/778 ,  H01L29/812 ,  H05K3/28 ,  H05K3/34

CPC分类号： H01L29/41758 ,  H01L23/293 ,  H01L23/4824 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L27/088 ,  H01L29/2003 ,  H01L29/201 ,  H01L29/205 ,  H01L29/4175 ,  H01L29/452 ,  H01L29/7787 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05022 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05555 ,  H01L2224/05556 ,  H01L2224/05563 ,  H01L2224/05567 ,  H01L2224/056 ,  H01L2224/05639 ,  H01L2224/0603 ,  H01L2224/0615 ,  H01L2224/0616 ,  H01L2224/06177 ,  H01L2224/131 ,  H01L2224/29005 ,  H01L2224/29014 ,  H01L2224/29023 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/3003 ,  H01L2224/3015 ,  H01L2224/30177 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/14 ,  H01L2924/19041 ,  H02M3/158 ,  H01L2924/01028 ,  H01L2924/00

公开(公告)号：JP2006517348A

公开(公告)日：2006-07-20

申请号：JP2006503178

申请日：2004-01-30

申请人： フリースケール セミコンダクター インコーポレイテッド

发明人： ダンビル、ジャニス ,  デバニー、キャサリン ,  ヤラ、ナディア

IPC分类号： H05K3/28 ,  H01L21/60 ,  H05K3/30 ,  H05K3/34 ,  H05K7/10

CPC分类号： H05K3/305 ,  H01L2224/29012 ,  H01L2224/29015 ,  H01L2224/3015 ,  H01L2224/30155 ,  H01L2224/32058 ,  H01L2224/73103 ,  H01L2224/73203 ,  H05K3/3436 ,  H05K7/1053 ,  H05K2201/0129 ,  H05K2201/09909 ,  H05K2201/10734 ,  H05K2203/0191 ,  Y02P70/613 ,  H01L2924/00012

摘要： A self supported underfill film ( 18 ) adhesively bonds surface mount integrated circuit packages ( 14 ) to a printed circuit board ( 10 ). The printed circuit board has conductive traces ( 12 ) and exposed conductive pads ( 13 ) on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads ( 16 ) on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

公开(公告)号：JP5012239B2

公开(公告)日：2012-08-29

申请号：JP2007156818

申请日：2007-06-13

申请人： 株式会社デンソー

发明人： 信之 加藤 ,  真一朗 宮原 ,  徹次 近藤 ,  和弘 鶴田

IPC分类号： H01L21/52

CPC分类号： H01L24/32 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/27505 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29084 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/3012 ,  H01L2224/30131 ,  H01L2224/3015 ,  H01L2224/30155 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/743 ,  H01L2224/83205 ,  H01L2224/83424 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83986 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/00014

摘要： PROBLEM TO BE SOLVED: To provide a joining method and a joining element that are advantageous for joining a large area and can suppress an increase in manufacturing costs. SOLUTION: In the joining method, metal paste in which a metal nanoparticle is dispersed in an organic solvent is interposed between a first junction section made of metal in a first member and a second junction section made of metal in a second member, the metal nanoparticle is sintered by heating at least the metal paste, and the first junction section is joined to the second one as a joining member having a void inside. In the joining method, at least one of the configuration condition of the metal paste and the sintering condition of the metal nanoparticle is adjusted, thus laminating and forming a plurality of types of junction layers having mutually different porosity, namely the occupation ratio of the void, as the joining member between the first and second junction sections so that the porosity differs between adjacent junction layers. COPYRIGHT: (C)2009,JPO&INPIT

公开(公告)号：JP2011187946A

公开(公告)日：2011-09-22

申请号：JP2011025214

申请日：2011-02-08

申请人： Internatl Rectifier Corp ,  インターナショナル レクティフィアー コーポレイション

发明人： CHEAH CHUAN ,  BRIERE MICHAEL A

IPC分类号： H01L21/338 ,  H01L21/3205 ,  H01L23/52 ,  H01L27/095 ,  H01L29/778 ,  H01L29/812 ,  H05K3/28 ,  H05K3/34

CPC分类号： H01L29/41758 ,  H01L23/293 ,  H01L23/4824 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L27/088 ,  H01L29/2003 ,  H01L29/201 ,  H01L29/205 ,  H01L29/4175 ,  H01L29/452 ,  H01L29/7787 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05022 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05555 ,  H01L2224/05556 ,  H01L2224/05563 ,  H01L2224/05567 ,  H01L2224/056 ,  H01L2224/05639 ,  H01L2224/0603 ,  H01L2224/0615 ,  H01L2224/0616 ,  H01L2224/06177 ,  H01L2224/131 ,  H01L2224/29005 ,  H01L2224/29014 ,  H01L2224/29023 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/3003 ,  H01L2224/3015 ,  H01L2224/30177 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/14 ,  H01L2924/19041 ,  H02M3/158 ,  H01L2924/01028 ,  H01L2924/00

摘要： PROBLEM TO BE SOLVED: To provide some exemplary embodiments of a III-nitride power device including a HEMT with multiple interconnect metal layers and a solderable front metal structure using solder bars for external circuit connections. SOLUTION: The solderable front metal structures 140a and 140b include a tri-metal such as TiNiAg, and are configured to expose source and drain contacts of the HEMT as alternating elongated digits or bars. Additionally, a single package may integrate a plurality of such HEMTs in which the front metal structures 140a and 140b expose alternating interdigitated source and drain contacts. This configuration may be advantageous for DC-DC power conversion circuit designs using III-nitride devices. By using solder bars for external circuit connections, lateral conduction is enabled, thereby reducing on-resistance Rdson of the device. COPYRIGHT: (C)2011,JPO&INPIT

摘要翻译： 要解决的问题：为了提供包括具有多个互连金属层的HEMT和使用用于外部电路连接的焊料条的可焊接前金属结构的III族氮化物功率器件的一些示例性实施例。 解决方案：可焊接的前金属结构140a和140b包括诸如TiNiAg的三金属，并且被配置为将HEMT的源极和漏极触点暴露为交替的细长数字或条。 另外，单个封装可以集成多个这样的HEMT，其中前部金属结构140a和140b暴露交替的叉指源极和漏极触点。 这种配置对于使用III族氮化物器件的DC-DC功率转换电路设计可能是有利的。 通过使用焊条进行外部电路连接，可以进行横向导通，从而降低器件的导通电阻Rdson。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2008311371A

公开(公告)日：2008-12-25

申请号：JP2007156818

申请日：2007-06-13

申请人： Denso Corp ,  株式会社デンソー

发明人： MIYAHARA SHINICHIRO ,  TSURUTA KAZUHIRO ,  KATO NOBUYUKI ,  KONDO TETSUJI

IPC分类号： H01L21/52

CPC分类号： H01L24/32 ,  H01L24/29 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/27505 ,  H01L2224/29 ,  H01L2224/29012 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/29084 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/3012 ,  H01L2224/30131 ,  H01L2224/3015 ,  H01L2224/30155 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/743 ,  H01L2224/83205 ,  H01L2224/83424 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83986 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/00014

摘要： PROBLEM TO BE SOLVED: To provide a joining method and a joining element that are advantageous for joining a large area and can suppress an increase in manufacturing costs. SOLUTION: In the joining method, metal paste in which a metal nanoparticle is dispersed in an organic solvent is interposed between a first junction section made of metal in a first member and a second junction section made of metal in a second member, the metal nanoparticle is sintered by heating at least the metal paste, and the first junction section is joined to the second one as a joining member having a void inside. In the joining method, at least one of the configuration condition of the metal paste and the sintering condition of the metal nanoparticle is adjusted, thus laminating and forming a plurality of types of junction layers having mutually different porosity, namely the occupation ratio of the void, as the joining member between the first and second junction sections so that the porosity differs between adjacent junction layers. COPYRIGHT: (C)2009,JPO&INPIT

摘要翻译： 要解决的问题：提供有利于接合大面积的接合方法和接合元件，并且可以抑制制造成本的增加。 解决方案：在接合方法中，将金属纳米颗粒分散在有机溶剂中的金属糊料介于第一构件中由金属制成的第一接合部分和第二构件中由金属制成的第二接合部分之间， 金属纳米颗粒通过至少加热金属膏而烧结，并且第一接合部与作为内部具有空隙的接合构件的第二接合部接合。 在接合方法中，调整金属糊料的配置状态和金属纳米粒子的烧结条件中的至少一种，从而层叠并形成多个孔隙率相互不同的接合层，即空隙的占有率 作为第一和第二接合部之间的接合部件，使得相邻的接合层之间的孔隙率不同。 版权所有（C）2009，JPO＆INPIT