公开(公告)号：US20090008792A1

公开(公告)日：2009-01-08

申请号：US12232019

申请日：2008-09-10

申请人： Cheng-Ta Ko ,  Su Tsai Lu

发明人： Cheng-Ta Ko ,  Su Tsai Lu

IPC分类号： H01L23/538 ,  H05K7/20

CPC分类号： H01L23/5389 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/73259 ,  H01L2224/8203 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00

摘要： The 3D chip-stack package comprises a component-embedded plate and a side IC. The PCB has a plurality of conductive contacts. The component-embedded plate comprises a dielectric layer; an active component embedded in the dielectric layer, one surface of each active component exposed outside the dielectric layer, the active components having a plurality of TSVs (Through Silicon Via), one ends of the TSVs exposed outside the exposed surface, the other ends of the TSVs corresponding to the conductive contacts of the PCB; and an electrical circuit on the dielectric layer and in electrical connection between the other ends of the TSVs of the active component and the corresponding conductive contacts of the PCB, respectively. The side IC has a plurality of pads. The pads are electrically connected with the exposed ends of the TSVs of the active component.

摘要翻译： 3D芯片堆叠封装包括部件嵌入板和侧面IC。 PCB具有多个导电触点。 部件嵌入板包括电介质层; 嵌入电介质层中的有源元件，暴露在电介质层外部的每个有源元件的一个表面，有源元件具有多个TSV（透硅通孔），暴露在暴露表面外的TSV的一端，另一端 对应于PCB的导电触头的TSV; 以及电介质层上的电路，并且分别在有源部件的TSV的另一端和PCB的对应导电触点之间电连接。 侧面IC具有多个焊盘。 焊盘与有源部件的TSV的暴露端电连接。

公开(公告)号：US20080295878A1

公开(公告)日：2008-12-04

申请号：US11956325

申请日：2007-12-13

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu ,  Cheng-Ta Ko ,  Tsung-Chieh Cheng

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu ,  Cheng-Ta Ko ,  Tsung-Chieh Cheng

IPC分类号： H01L35/34 ,  H01L35/02

CPC分类号： H01L35/30 ,  H01L35/32 ,  H02S10/10

摘要： An integrated package structure having a solar cell and a thermoelectric element includes a substrate, a first solar cell and a thermoelectric element. The substrate has a first surface. The first solar cell has a second surface, a first electrode disposed on the second surface and a second electrode disposed on the second surface. The second surface faces the first surface. The thermoelectric element has a third electrode and a fourth electrode. The thermoelectric element is disposed between the first surface and the second surface. The first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode respectively. A method of fabricating the integrated package structure having the solar cell and the thermoelectric element is also provided.

摘要翻译： 具有太阳能电池和热电元件的集成封装结构包括衬底，第一太阳能电池和热电元件。 衬底具有第一表面。 第一太阳能电池具有第二表面，设置在第二表面上的第一电极和设置在第二表面上的第二电极。 第二表面面向第一表面。 热电元件具有第三电极和第四电极。 热电元件设置在第一表面和第二表面之间。 第一电极和第二电极分别电连接到第三电极和第四电极。 还提供了一种制造具有太阳能电池和热电元件的集成封装结构的方法。

公开(公告)号：US20120313133A1

公开(公告)日：2012-12-13

申请号：US13224607

申请日：2011-09-02

申请人： KUAN-NENG CHEN ,  CHENG-TA KO ,  WEI-CHUNG LO

发明人： KUAN-NENG CHEN ,  CHENG-TA KO ,  WEI-CHUNG LO

IPC分类号： H01L33/62 ,  H01L33/48

CPC分类号： H01L33/62 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/167 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/1162 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/17517 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00013 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00012

摘要： A heterostructure contains an IC and an LED. An IC and an LED are initially provided. The IC has at least one first electric-conduction block and at least one first connection block. The IC electrically connects with the first electric-conduction block. The first face of the LED has at least one second electric-conduction block and at least one second connection block. The LED electrically connects to the second electric-conduction block. Subsequently, the first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block. The first electric-conduction block is electrically connected with the second electric-conduction block and forms a heterostructure. The system simultaneously provides functions of heat radiation and electric communication for the IC and LED resulting in a high-density, multifunctional heterostructure.

摘要翻译： 异质结构包含IC和LED。 最初提供IC和LED。 IC具有至少一个第一导电块和至少一个第一连接块。 IC与第一导电块电连接。 LED的第一面具有至少一个第二导电块和至少一个第二连接块。 LED电连接到第二导电块。 随后，第一导电块和第一连接块分别连接到第二导电块和第二连接块。 第一导电块与第二导电块电连接并形成异质结构。 该系统同时提供IC和LED的散热和电通信功能，从而产生高密度多功能异质结构。

公开(公告)号：US08048716B2

公开(公告)日：2011-11-01

申请号：US12382526

申请日：2009-03-18

申请人： Shou-Lung Chen ,  Cheng-Ta Ko

发明人： Shou-Lung Chen ,  Cheng-Ta Ko

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/8203 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and setting several active components on the molding plate as first. A dielectric layer covers the molding plate to cap the active components. An electric circuit is formed on the dielectric layer, in contact with the active components. Finally, the structure with embedded active components is released from the molding plate.

摘要翻译： 提供嵌入式有源元件的结构及其制造方法。 制造步骤包括提供模制板，并且首先在模制板上设置若干活性组分。 电介质层覆盖模制板以盖住活性组分。 在电介质层上形成与有源元件接触的电路。 最后，嵌入式有源元件的结构从成型板上释放出来。

公开(公告)号：US08008573B2

公开(公告)日：2011-08-30

申请号：US11956325

申请日：2007-12-13

申请人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu ,  Cheng-Ta Ko ,  Tsung-Chieh Cheng

发明人： Ming-Ji Dai ,  Chun-Kai Liu ,  Chih-Kuang Yu ,  Cheng-Ta Ko ,  Tsung-Chieh Cheng

IPC分类号： H01L31/024 ,  H01L31/058

CPC分类号： H01L35/30 ,  H01L35/32 ,  H02S10/10

摘要： An integrated package structure having a solar cell and a thermoelectric element includes a substrate, a first solar cell and a thermoelectric element. The substrate has a first surface. The first solar cell has a second surface, a first electrode disposed on the second surface and a second electrode disposed on the second surface. The second surface faces the first surface. The thermoelectric element has a third electrode and a fourth electrode. The thermoelectric element is disposed between the first surface and the second surface. The first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode respectively. A method of fabricating the integrated package structure having the solar cell and the thermoelectric element is also provided.

摘要翻译： 具有太阳能电池和热电元件的集成封装结构包括衬底，第一太阳能电池和热电元件。 衬底具有第一表面。 第一太阳能电池具有第二表面，设置在第二表面上的第一电极和设置在第二表面上的第二电极。 第二表面面向第一表面。 热电元件具有第三电极和第四电极。 热电元件设置在第一表面和第二表面之间。 第一电极和第二电极分别电连接到第三电极和第四电极。 还提供了一种制造具有太阳能电池和热电元件的集成封装结构的方法。

公开(公告)号：US08304666B2

公开(公告)日：2012-11-06

申请号：US12468058

申请日：2009-05-19

申请人： Cheng-Ta Ko ,  Min-Lin Lee ,  Wei-Chung Lo ,  Shur-Fen Liu ,  Jinn-Shing King ,  Shinn-Juh Lai ,  Yu-Hua Chen

发明人： Cheng-Ta Ko ,  Min-Lin Lee ,  Wei-Chung Lo ,  Shur-Fen Liu ,  Jinn-Shing King ,  Shinn-Juh Lai ,  Yu-Hua Chen

IPC分类号： H05K1/11

CPC分类号： H05K1/0222 ,  H05K3/429 ,  H05K2201/09636 ,  H05K2201/09645 ,  H05K2201/09809

摘要： A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.

摘要翻译： 多个同轴引线在电路基板中的单个通孔内形成，以增强垂直互连的密度，以便匹配在衬底的顶层电路层和底层电路层之间的较高密度多层电路互连的需求。 同轴引线在单个通孔中提供多个同轴引线之间的电磁干扰屏蔽。

公开(公告)号：US20110195273A1

公开(公告)日：2011-08-11

申请号：US12774731

申请日：2010-05-06

申请人： Kuan-Neng Chen ,  Wei-Chung Lo ,  Cheng-Ta Ko

发明人： Kuan-Neng Chen ,  Wei-Chung Lo ,  Cheng-Ta Ko

IPC分类号： B32B15/04 ,  B32B15/01 ,  B32B37/12

CPC分类号： B32B9/04 ,  B32B3/08 ,  B32B7/04 ,  B32B7/12 ,  B32B9/00 ,  B32B15/01 ,  B32B27/283 ,  B32B2307/714 ,  Y10T156/10 ,  Y10T428/12771 ,  Y10T428/31678

摘要： A bonding structure and a method of fabricating the same are provided. A first substrate having a first bonding element and a second substrate having a second bonding element are provided, wherein at least one of the first bonding element and the second bonding element is formed with an alloy. A bonding process is performed to bond the first bonding element with the second bonding element, wherein a diffusion liner is generated at the exposed, non-bonded surface of the bonding structure.

摘要翻译： 提供了一种接合结构及其制造方法。 提供具有第一接合元件的第一基板和具有第二接合元件的第二基板，其中第一接合元件和第二接合元件中的至少一个由合金形成。 进行接合处理以将第一接合元件与第二接合元件接合，其中在接合结构的暴露的非接合表面处产生扩散衬垫。

公开(公告)号：US20090173529A1

公开(公告)日：2009-07-09

申请号：US12189206

申请日：2008-08-11

申请人： Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

发明人： Yuan-Chang Lee ,  Yu-Hua Chen ,  Ying-Ching Shih ,  Cheng-Ta Ko

IPC分类号： H05K1/11 ,  H05K3/10 ,  H05K1/00

CPC分类号： H05K1/0283 ,  H05K1/185 ,  H05K3/222 ,  H05K2201/0355 ,  H05K2201/10287 ,  H05K2203/0271 ,  Y10T29/49162

摘要： A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second end, wherein the first end and the second end are respectively connected to different pads, and the position of the intermediate segment is higher than the positions of the first end and the second end. Since the connection manner of the wires and the pads has 3-D freedoms, the circuit structure can withstand both horizontal and vertical deformations and has an outstanding reliability.

摘要翻译： 一种电路结构及其制造方法，其使用多条电线将多个焊盘串联连接以形成可拉伸电路。 每个电线具有位于第一端和第二端之间的第一端，第二端和中间段，其中第一端和第二端分别连接到不同的焊盘，并且中间段的位置更高 比第一端和第二端的位置。 由于电线和焊盘的连接方式具有3-D自由度，所以电路结构可以承受水平和垂直变形，并且具有突出的可靠性。

公开(公告)号：US08536613B2

公开(公告)日：2013-09-17

申请号：US13224607

申请日：2011-09-02

申请人： Kuan-Neng Chen ,  Cheng-Ta Ko ,  Wei-Chung Lo

发明人： Kuan-Neng Chen ,  Cheng-Ta Ko ,  Wei-Chung Lo

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/167 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/1162 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1319 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/17517 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00013 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00012

摘要： A heterostructure contains an IC and an LED. An IC and an LED are initially provided. The IC has at least one first electric-conduction block and at least one first connection block. The IC electrically connects with the first electric-conduction block. The first face of the LED has at least one second electric-conduction block and at least one second connection block. The LED electrically connects to the second electric-conduction block. Subsequently, the first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block. The first electric-conduction block is electrically connected with the second electric-conduction block and forms a heterostructure. The system simultaneously provides functions of heat radiation and electric communication for the IC and LED resulting in a high-density, multifunctional heterostructure.

摘要翻译： 异质结构包含IC和LED。 最初提供IC和LED。 IC具有至少一个第一导电块和至少一个第一连接块。 IC与第一导电块电连接。 LED的第一面具有至少一个第二导电块和至少一个第二连接块。 LED电连接到第二导电块。 随后，第一导电块和第一连接块分别连接到第二导电块和第二连接块。 第一导电块与第二导电块电连接并形成异质结构。 该系统同时提供IC和LED的散热和电通信功能，从而产生高密度多功能异质结构。

公开(公告)号：US20100163296A1

公开(公告)日：2010-07-01

申请号：US12468058

申请日：2009-05-19

申请人： Cheng-Ta Ko ,  Min-Lin Lee ,  Wei-Chung Lo ,  Shur-Fen Liu ,  Jinn-Shing King ,  Shinn-Juh Lai ,  Yu-Hua Chen

发明人： Cheng-Ta Ko ,  Min-Lin Lee ,  Wei-Chung Lo ,  Shur-Fen Liu ,  Jinn-Shing King ,  Shinn-Juh Lai ,  Yu-Hua Chen

IPC分类号： H05K1/11 ,  B44C1/22

CPC分类号： H05K1/0222 ,  H05K3/429 ,  H05K2201/09636 ,  H05K2201/09645 ,  H05K2201/09809

摘要： A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.

摘要翻译： 多个同轴引线在电路基板中的单个通孔内形成，以增强垂直互连的密度，以便匹配在衬底的顶层电路层和底层电路层之间的较高密度多层电路互连的需求。 同轴引线在单个通孔中的多个同轴引线之间提供电磁干扰屏蔽。