摘要:
In a system for providing temporary or permanent connection of an integrated circuit die to a base substrate using electrical microsprings, a thermal element is provided that assists with cooling of the pad structure during use. The thermal element may be formed of the same material and my similar processes as the microsprings. The thermal element may be one or more block structures or one or more thermal microsprings. The thermal element may be provided with channels to contain and/or direct the flow of a thermal transfer fluid. Cooling of components associated with the pad structure (e.g., ICs) may be provided.
摘要:
A print head assembly for an ink jet printer includes an ink flow path configured to allow passage of a phase-change ink. A pressure unit is fluidically coupled to the ink flow path to apply a pressure to the ink. The applied pressure is controlled by a control unit during a time that the ink in the ink flow path is undergoing a phase change. During the phase change, a portion of the ink in a first region of the ink flow path is in liquid phase and another portion of the ink in another region of the ink flow path is in solid phase. A constant or variable pressure can be applied at least to the liquid phase portion of the ink during a phase transition from a liquid phase to a solid phase or from a solid phase to a liquid phase.
摘要:
An apparatus controls dissipation of heat from melted ink within a component storing melted ink within a solid ink imaging device. The apparatus includes a housing, a passage within the housing that is configured to store melted ink, and a temperature control connector mechanically coupled to the housing and passage, the temperature control connector being configured to mitigate void formation in melted ink as the melted ink cools in the passage.
摘要:
A hybrid pin-fin micro heat pipe heat sink consists of a plurality of heat pipes secured to a base. The heat pipes have a generally hollow cross-section which transitions from a first cross-sectional shape (e.g., circular) to a second cross-sectional shape (e.g., triangular). A heat transfer medium (e.g., saturated steam) is sealed within the heat pipes. Cooling plates may be disposed over the base with the heat pipes in physical contact with and passing through the cooling plates. The method of manufacturing the heat pipes consists of passing a heat transfer medium through a pipe section having a first cross-sectional shape while transitioning to a second cross-sectional shape (e.g., by way of a rolling die press), then crimping the ends closed to seal the heat transfer medium therein.
摘要:
In a system for providing temporary or permanent connection of an integrated circuit die to a base substrate using electrical microsprings, a thermal element is provided that assists with cooling of the pad structure during use. The thermal element may be formed of the same material and my similar processes as the microsprings. The thermal element may be one or more block structures or one or more thermal microsprings. The thermal element may be provided with channels to contain and/or direct the flow of a thermal transfer fluid. Cooling of components associated with the pad structure (e.g., ICs) may be provided.
摘要:
The Niyama number of a flow path for phase change ink is the ratio of cooling rate of the ink to the thermal gradient of the ink along the ink flow path. Print head assemblies can be designed and configured to achieve ink flow paths having Niyama numbers that are greater than a critical Niyama value. These designs reduce entrapment of air in the ink as the ink is changing phase and provide optimal bubble and void mitigation for phase change ink. The thermal gradient of the ink flow path can be achieved using passive and/or active thermal elements disposed along the ink flow path.
摘要:
A hybrid pin-fin micro heat pipe heat sink comprises a plurality of heat pipes secured to a base. The heat pipes have a generally hollow cross-section which transitions from a first cross-sectional shape (e.g., circular) to a second cross-sectional shape (e.g., triangular). A heat transfer medium (e.g., saturated steam) is sealed within the heat pipes. Cooling plates may be disposed over the base with the heat pipes in physical contact with and passing through the cooling plates. The method of manufacturing the heat pipes comprises passing a heat transfer medium through a pipe section having a first cross-sectional shape while transitioning to a second cross-sectional shape (e.g., by way of a rolling die press), then crimping the ends closed to seal the heat transfer medium therein.
摘要:
An apparatus controls dissipation of heat from melted ink within a component storing melted ink within a solid ink imaging device. The apparatus includes a housing, a passage within the housing that is configured to store melted ink, and a temperature control connector mechanically coupled to the housing and passage, the temperature control connector being configured to mitigate void formation in melted ink as the melted ink cools in the passage.
摘要:
A low-cost integrated reflector and heat spreader for high-density high power solid-state (e.g., LED) lighting arrays includes a base structure onto which is applied a sacrificial material. A relatively thick thermal spray coating is applied over the base structure and sacrificial material. The sacrificial material is removed. A channel(s) is thereby provided within the thermal spray coating layer and in physical contact with the base structure. The channel may be filled with a cooling fluid. A pulsating heat pipe heat spreader may thereby be provided. A reflective material may be provided either over another surface of the base structure or alternatively over the thermal spray coating layer to provide a surface for reflecting and directing light emitted from a solid state light source that may be secured to the integrated reflector and heat spreader.
摘要:
A low-cost integrated reflector and heat spreader for high-density high power solid-state (e.g., LED) lighting arrays includes a base structure onto which is applied a sacrificial material. A relatively thick thermal spray coating is applied over the base structure and sacrificial material. The sacrificial material is removed. A channel(s) is thereby provided within the thermal spray coating layer and in physical contact with the base structure. The channel may be filled with a cooling fluid. A pulsating heat pipe heat spreader may thereby be provided. A reflective material may be provided either over another surface of the base structure or alternatively over the thermal spray coating layer to provide a surface for reflecting and directing light emitted from a solid state light source that may be secured to the integrated reflector and heat spreader.