公开(公告)号：US08659042B2

公开(公告)日：2014-02-25

申请号：US12974575

申请日：2010-12-21

申请人： John S. Paschkewitz ,  Eric Shrader

发明人： John S. Paschkewitz ,  Eric Shrader

IPC分类号： H01L33/00

CPC分类号： F21V29/51 ,  F21V7/10 ,  F21V29/505 ,  F21V29/773 ,  F21Y2115/10 ,  F28D15/0233 ,  F28D15/0266 ,  F28F2255/00 ,  H01L23/427 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

摘要： A low-cost integrated reflector and heat spreader for high-density high power solid-state (e.g., LED) lighting arrays includes a base structure onto which is applied a sacrificial material. A relatively thick thermal spray coating is applied over the base structure and sacrificial material. The sacrificial material is removed. A channel(s) is thereby provided within the thermal spray coating layer and in physical contact with the base structure. The channel may be filled with a cooling fluid. A pulsating heat pipe heat spreader may thereby be provided. A reflective material may be provided either over another surface of the base structure or alternatively over the thermal spray coating layer to provide a surface for reflecting and directing light emitted from a solid state light source that may be secured to the integrated reflector and heat spreader.

摘要翻译： 用于高密度高功率固态（例如LED）照明阵列的低成本集成反射器和散热器包括在其上施加牺牲材料的基底结构。 在基础结构和牺牲材料上施加相对较厚的热喷涂。 牺牲材料被去除。 因此，在热喷涂层内设置通道并与基体结构物理接触。 通道可以填充有冷却流体。 由此可以设置脉动热管散热器。 反射材料可以设置在基底结构的另一个表面上，或者可选地设置在热喷涂涂层上，以提供用于反射和引导可固定到集成反射器和散热器的固态光源发射的光的表面。

公开(公告)号：US20120153325A1

公开(公告)日：2012-06-21

申请号：US12974575

申请日：2010-12-21

申请人： John S. Paschkewitz ,  Eric Shrader

发明人： John S. Paschkewitz ,  Eric Shrader

IPC分类号： H01L33/60 ,  H01L21/50 ,  C23C4/02 ,  C23C4/12 ,  C23C4/06

CPC分类号： F21V29/51 ,  F21V7/10 ,  F21V29/505 ,  F21V29/773 ,  F21Y2115/10 ,  F28D15/0233 ,  F28D15/0266 ,  F28F2255/00 ,  H01L23/427 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

摘要： A low-cost integrated reflector and heat spreader for high-density high power solid-state (e.g., LED) lighting arrays includes a base structure onto which is applied a sacrificial material. A relatively thick thermal spray coating is applied over the base structure and sacrificial material. The sacrificial material is removed. A channel(s) is thereby provided within the thermal spray coating layer and in physical contact with the base structure. The channel may be filled with a cooling fluid. A pulsating heat pipe heat spreader may thereby be provided. A reflective material may be provided either over another surface of the base structure or alternatively over the thermal spray coating layer to provide a surface for reflecting and directing light emitted from a solid state light source that may be secured to the integrated reflector and heat spreader.

摘要翻译： 用于高密度高功率固态（例如LED）照明阵列的低成本集成反射器和散热器包括在其上施加牺牲材料的基底结构。 在基础结构和牺牲材料上施加相对较厚的热喷涂。 牺牲材料被去除。 因此，在热喷涂层内设置通道并与基体结构物理接触。 通道可以填充有冷却流体。 由此可以设置脉动热管散热器。 反射材料可以设置在基底结构的另一表面上，或者另外设置在热喷涂涂层上，以提供用于反射和引导可固定到集成反射器和散热器的固态光源发出的光的表面。

公开(公告)号：US20120145356A1

公开(公告)日：2012-06-14

申请号：US12965616

申请日：2010-12-10

申请人： John S. Paschkewitz ,  Eric Shrader ,  David Mathew Johnson ,  John Stuart Fitch

发明人： John S. Paschkewitz ,  Eric Shrader ,  David Mathew Johnson ,  John Stuart Fitch

IPC分类号： F28D15/04 ,  B21D53/06

CPC分类号： B21D53/06 ,  B21C37/08 ,  B21C37/0803 ,  B21C37/083 ,  B21D15/02 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/046 ,  F28F1/025 ,  H01L2924/0002 ,  H01L2924/00

摘要： A hybrid pin-fin micro heat pipe heat sink comprises a plurality of heat pipes secured to a base. The heat pipes have a generally hollow cross-section which transitions from a first cross-sectional shape (e.g., circular) to a second cross-sectional shape (e.g., triangular). A heat transfer medium (e.g., saturated steam) is sealed within the heat pipes. Cooling plates may be disposed over the base with the heat pipes in physical contact with and passing through the cooling plates. The method of manufacturing the heat pipes comprises passing a heat transfer medium through a pipe section having a first cross-sectional shape while transitioning to a second cross-sectional shape (e.g., by way of a rolling die press), then crimping the ends closed to seal the heat transfer medium therein.

摘要翻译： 混合销翅微型热管散热器包括固定到基座的多个热管。 热管具有从第一横截面形状（例如圆形）向第二横截面形状（例如，三角形）转变的大致中空的横截面。 传热介质（例如饱和蒸汽）被密封在热管内。 冷却板可以设置在基座上方，热管与冷却板物理接触并通过冷却板。 制造热管的方法包括使传热介质通过具有第一横截面形状的管段，同时过渡到第二横截面形状（例如，通过压模），然后将端部压紧 以密封其中的传热介质。

公开(公告)号：US08695687B2

公开(公告)日：2014-04-15

申请号：US12965616

申请日：2010-12-10

申请人： John S. Paschkewitz ,  Eric Shrader ,  David Mathew Johnson ,  John Stuart Fitch

发明人： John S. Paschkewitz ,  Eric Shrader ,  David Mathew Johnson ,  John Stuart Fitch

IPC分类号： F28D15/00 ,  H01L23/427

CPC分类号： B21D53/06 ,  B21C37/08 ,  B21C37/0803 ,  B21C37/083 ,  B21D15/02 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/046 ,  F28F1/025 ,  H01L2924/0002 ,  H01L2924/00

摘要： A hybrid pin-fin micro heat pipe heat sink consists of a plurality of heat pipes secured to a base. The heat pipes have a generally hollow cross-section which transitions from a first cross-sectional shape (e.g., circular) to a second cross-sectional shape (e.g., triangular). A heat transfer medium (e.g., saturated steam) is sealed within the heat pipes. Cooling plates may be disposed over the base with the heat pipes in physical contact with and passing through the cooling plates. The method of manufacturing the heat pipes consists of passing a heat transfer medium through a pipe section having a first cross-sectional shape while transitioning to a second cross-sectional shape (e.g., by way of a rolling die press), then crimping the ends closed to seal the heat transfer medium therein.

摘要翻译： 混合针鳍微热管散热器由固定到基座的多个热管组成。 热管具有从第一横截面形状（例如圆形）向第二横截面形状（例如，三角形）转变的大致中空的横截面。 传热介质（例如饱和蒸汽）被密封在热管内。 冷却板可以设置在基座上方，热管与冷却板物理接触并通过冷却板。 制造热管的方法包括将传热介质通过具有第一横截面形状的管段，同时过渡到第二横截面形状（例如，通过压模），然后将端部 封闭以密封其中的传热介质。

公开(公告)号：US08419157B2

公开(公告)日：2013-04-16

申请号：US12714031

申请日：2010-02-26

申请人： John S. Paschkewitz ,  Eric J. Shrader

发明人： John S. Paschkewitz ,  Eric J. Shrader

IPC分类号： B41J29/377 ,  B41J2/175

CPC分类号： B41J2/17593

摘要： An apparatus controls dissipation of heat from melted ink within a component storing melted ink within a solid ink imaging device. The apparatus includes a housing, a passage within the housing that is configured to store melted ink, and a temperature control connector mechanically coupled to the housing and passage, the temperature control connector being configured to mitigate void formation in melted ink as the melted ink cools in the passage.

摘要翻译： 一种装置控制在固体油墨成像装置内存储熔融油墨的部件内的熔融油墨的散热。 该装置包括壳体，壳体内的通道，其构造成存储熔化的油墨;以及温度控制连接器，其机械地联接到壳体和通道，该温度控制连接器构造为当熔融油墨冷却时，缓和熔融油墨中的空隙形成 在通道中。

公开(公告)号：US08525353B2

公开(公告)日：2013-09-03

申请号：US13330316

申请日：2011-12-19

申请人： Eugene M. Chow ,  Eric J. Shrader ,  John S. Paschkewitz

发明人： Eugene M. Chow ,  Eric J. Shrader ,  John S. Paschkewitz

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/36 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/473 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06519 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/1161 ,  H01L2224/11618 ,  H01L2224/11825 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/1401 ,  H01L2224/14051 ,  H01L2224/16225 ,  H01L2224/17519 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/81902 ,  H01L2224/81903 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01024 ,  H01L2924/0104 ,  H01L2924/014 ,  H01L2924/00

摘要： In a system for providing temporary or permanent connection of an integrated circuit die to a base substrate using electrical microsprings, a thermal element is provided that assists with cooling of the pad structure during use. The thermal element may be formed of the same material and my similar processes as the microsprings. The thermal element may be one or more block structures or one or more thermal microsprings. The thermal element may be provided with channels to contain and/or direct the flow of a thermal transfer fluid. Cooling of components associated with the pad structure (e.g., ICs) may be provided.

摘要翻译： 在使用电子微弹簧将集成电路管芯临时或永久连接到基底基板的系统中，提供了一种热元件，其有助于在使用期间对焊盘结构进行冷却。 热元件可以由与微弹簧相同的材料和我类似的方法形成。 热元件可以是一个或多个块结构或一个或多个热微型弹簧。 热元件可以设置有容纳和/或引导热传递流体的流动的通道。 可以提供与衬垫结构（例如，IC）相关联的部件的冷却。

公开(公告)号：US08506063B2

公开(公告)日：2013-08-13

申请号：US13022278

申请日：2011-02-07

申请人： Scott Limb ,  John S. Paschkewitz ,  Eric J. Shrader

发明人： Scott Limb ,  John S. Paschkewitz ,  Eric J. Shrader

IPC分类号： B41J2/175

CPC分类号： B41J2/17593 ,  B41J2/17503

摘要： A print head assembly for an ink jet printer includes an ink flow path configured to allow passage of a phase-change ink. A pressure unit is fluidically coupled to the ink flow path to apply a pressure to the ink. The applied pressure is controlled by a control unit during a time that the ink in the ink flow path is undergoing a phase change. During the phase change, a portion of the ink in a first region of the ink flow path is in liquid phase and another portion of the ink in another region of the ink flow path is in solid phase. A constant or variable pressure can be applied at least to the liquid phase portion of the ink during a phase transition from a liquid phase to a solid phase or from a solid phase to a liquid phase.

摘要翻译： 用于喷墨打印机的打印头组件包括配置为允许相变墨水通过的墨流路。 压力单元流体耦合到油墨流动路径以向油墨施加压力。 所施加的压力由油墨流路中的油墨经历相变的时间由控制单元控制。 在相变期间，油墨流路的第一区域中的油墨的一部分处于液相，油墨流路的另一区域中的油墨的另一部分是固相的。 在从液相到固相或从固相到液相的相转变期间，至少可以将油压的恒定或可变压力施加到油墨的液相部分。

公开(公告)号：US08556372B2

公开(公告)日：2013-10-15

申请号：US13022381

申请日：2011-02-07

申请人： John S. Paschkewitz

发明人： John S. Paschkewitz

IPC分类号： B41J29/377 ,  B41J2/175

CPC分类号： B41J2/17593

摘要： The Niyama number of a flow path for phase change ink is the ratio of cooling rate of the ink to the thermal gradient of the ink along the ink flow path. Print head assemblies can be designed and configured to achieve ink flow paths having Niyama numbers that are greater than a critical Niyama value. These designs reduce entrapment of air in the ink as the ink is changing phase and provide optimal bubble and void mitigation for phase change ink. The thermal gradient of the ink flow path can be achieved using passive and/or active thermal elements disposed along the ink flow path.

摘要翻译： 用于相变油墨的流动路径的Niyama数是油墨的冷却速率与墨水流动路径上的墨水的热梯度的比率。 打印头组件可以被设计和配置成实现具有大于关键Niyama值的Niyama数量的油墨流动路径。 这些设计减少墨水中空气的捕获，因为墨水正在改变相位，并为相变墨水提供最佳的气泡和空隙。 油墨流动路径的热梯度可以使用沿墨水流动路径设置的被动和/或有源热元件来实现。

公开(公告)号：US20110211010A1

公开(公告)日：2011-09-01

申请号：US12714031

申请日：2010-02-26

申请人： John S. Paschkewitz ,  Eric J. Shrader

发明人： John S. Paschkewitz ,  Eric J. Shrader

IPC分类号： B41J29/377 ,  B41J2/175

CPC分类号： B41J2/17593

摘要： An apparatus controls dissipation of heat from melted ink within a component storing melted ink within a solid ink imaging device. The apparatus includes a housing, a passage within the housing that is configured to store melted ink, and a temperature control connector mechanically coupled to the housing and passage, the temperature control connector being configured to mitigate void formation in melted ink as the melted ink cools in the passage.

摘要翻译： 一种装置控制在固体油墨成像装置内存储熔融油墨的部件内的熔融油墨的散热。 该装置包括壳体，壳体内的通道，其构造成存储熔化的油墨;以及温度控制连接器，其机械地联接到壳体和通道，该温度控制连接器构造为当熔融油墨冷却时，缓和熔融油墨中的空隙形成 在通道中。

公开(公告)号：US20130154127A1

公开(公告)日：2013-06-20

申请号：US13330316

申请日：2011-12-19

申请人： Eugene M. Chow ,  Eric J. Shrader ,  John S. Paschkewitz

发明人： Eugene M. Chow ,  Eric J. Shrader ,  John S. Paschkewitz

IPC分类号： H01L23/498 ,  H05K7/20

CPC分类号： H01L23/36 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/473 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06519 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/1161 ,  H01L2224/11618 ,  H01L2224/11825 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/1401 ,  H01L2224/14051 ,  H01L2224/16225 ,  H01L2224/17519 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/81902 ,  H01L2224/81903 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01024 ,  H01L2924/0104 ,  H01L2924/014 ,  H01L2924/00

摘要： In a system for providing temporary or permanent connection of an integrated circuit die to a base substrate using electrical microsprings, a thermal element is provided that assists with cooling of the pad structure during use. The thermal element may be formed of the same material and my similar processes as the microsprings. The thermal element may be one or more block structures or one or more thermal microsprings. The thermal element may be provided with channels to contain and/or direct the flow of a thermal transfer fluid. Cooling of components associated with the pad structure (e.g., ICs) may be provided.

摘要翻译： 在使用电子微弹簧将集成电路管芯临时或永久连接到基底基板的系统中，提供了一种热元件，其有助于在使用期间对焊盘结构进行冷却。 热元件可以由与微弹簧相同的材料和我类似的方法形成。 热元件可以是一个或多个块结构或一个或多个热微型弹簧。 热元件可以设置有容纳和/或引导热传递流体的流动的通道。 可以提供与衬垫结构（例如，IC）相关联的部件的冷却。