公开(公告)号：US09727828B2

公开(公告)日：2017-08-08

申请号：US12830004

申请日：2010-07-02

Applicant: David Sun ,  Kwok Cheung ,  But-Chung Chiu ,  Xing Wang ,  Ying Xiao ,  Kee Mok ,  Mike Yao

Inventor： David Sun ,  Kwok Cheung ,  But-Chung Chiu ,  Xing Wang ,  Ying Xiao ,  Kee Mok ,  Mike Yao

IPC: H02J3/38 ,  G06Q10/04 ,  G06Q10/06 ,  G06Q50/06

CPC classification number: G06Q10/04 ,  G06Q10/06375 ,  G06Q50/06 ,  Y04S10/54 ,  Y04S10/60

Abstract: A method is provided for evaluating operational and financial performance for dispatchers in power grid control centers associated with utility systems. A comprehensive operating plan is provided that applies after the fact analysis for performance metrics, root-cause impacts and process re-engineering. after the fact analysis of past events and practices is performed. Actual system and resource conditions are captured. the system and resource conditions are supplied to a relational database. A scheduler engine receives the actual system and resource conditions from the relational database and processes it to calculate system performance. At least one of the following is displayed, transmission evaluation application displays, reference and scenario cases and associations between them, results presented with a graphical or tabular displays, comparison results between scenario cases and a reference case, a family of curves where each curve is a performance metric, comparison of scenario input data, study results and statistical analysis and historical data.

公开(公告)号：US20160013075A1

公开(公告)日：2016-01-14

申请号：US13618509

申请日：2012-09-14

Applicant: Geraldine Tsui Yee LIN ,  Walter de MUNNIK ,  Kin Pui KWAN ,  Wing Him LAU ,  Kwok Cheung TSANG ,  Chun Ho FAN ,  Neil McLELLAN

Inventor： Geraldine Tsui Yee LIN ,  Walter de MUNNIK ,  Kin Pui KWAN ,  Wing Him LAU ,  Kwok Cheung TSANG ,  Chun Ho FAN ,  Neil McLELLAN

IPC: H01L21/56 ,  H01L21/78

CPC classification number: H01L21/561 ,  H01L21/4828 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A process for fabricating an integrated circuit package includes selectively etching a leadframe strip to define a die attach pad and a plurality of contact pads. At least one side of the die attach pad has a plurality of spaced apart pad portions. A semiconductor die is mounted to the die attach pad and wires are bonded from the semiconductor die to respective ones of the contact pads. A first surface of the leadframe strip, including the semiconductor die and wire bonds, is encapsulated in a molding material such that at least one surface of the leadframe strip is exposed. The integrated circuit package is singulated from a remainder of the leadframe strip.

Abstract translation: 一种用于制造集成电路封装的工艺包括选择性地蚀刻引线框条以限定管芯附接焊盘和多个接触焊盘。 管芯附接垫的至少一侧具有多个间隔开的垫部分。 将半导体管芯安装到管芯附接焊盘，并且将导线从半导体管芯接合到相应的接触焊盘。 包括半导体管芯和引线接合的引线框条的第一表面被封装在模制材料中，使得引线框带的至少一个表面被暴露。 集成电路封装从引线框条的其余部分分离。

公开(公告)号：US08779598B2

公开(公告)日：2014-07-15

申请号：US13170820

申请日：2011-06-28

Applicant: Fan Yeung ,  Raymond (Kwok Cheung) Tsang ,  Edward Law

Inventor： Fan Yeung ,  Raymond (Kwok Cheung) Tsang ,  Edward Law

IPC: H01L21/00 ,  H01L21/30 ,  H01L21/4763 ,  H01L23/52

CPC classification number: H01L21/6835 ,  H01L21/4857 ,  H01L23/145 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments described herein provide a method of manufacturing integrated circuit (IC) devices. The method includes coupling a first surface of a first intermediate substrate to a first surface of a second intermediate substrate, forming a first plurality of patterned metal layers on a second surface of the first intermediate substrate to form a first substrate and a second plurality of patterned metal layers on a second surface of the second intermediate substrate to form a second substrate, and separating the first and second substrates. Each of the first substrate and the second substrate is configured to facilitate electrical interconnection between a respective IC die and a respective printed circuit board (PCB).

Abstract translation: 本文描述的实施例提供了一种制造集成电路（IC）装置的方法。 该方法包括将第一中间衬底的第一表面耦合到第二中间衬底的第一表面，在第一中间衬底的第二表面上形成第一多个图案化金属层以形成第一衬底和第二多个图案化 在第二中间基板的第二表面上的金属层，以形成第二基板，并分离第一和第二基板。 第一基板和第二基板中的每一个被配置为便于相应的IC管芯和相应的印刷电路板（PCB）之间的电互连。

公开(公告)号：US07482690B1

公开(公告)日：2009-01-27

申请号：US11071737

申请日：2005-03-03

Applicant: Chun Ho Fan ,  Kwok Cheung Tsang

Inventor： Chun Ho Fan ,  Kwok Cheung Tsang

IPC: H01L23/34

CPC classification number: H01L21/568 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2223/6644 ,  H01L2224/1134 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A process for fabricating an integrated circuit package includes establishing a plating mask on a first surface of a metal carrier. The plating mask defines a plurality of components including a die attach pad, at least one row of contact pads and at least one additional electronic component. A plurality of metallic layers is deposited on exposed portions of the first surface of the metal carrier. The plating mask is stripped from the metal carrier, leaving the plurality of metallic layers in the form of the plurality of components. A semiconductor die is mounted to die attach pad and pads of the semiconductor die are electrically connected to ones of the contact pads and to the additional electronic component. The first surface of the metal carrier is overmolded to encapsulate the plurality of components and the semiconductor die and the metal carrier is etched away.

Abstract translation: 一种用于制造集成电路封装的方法，包括在金属载体的第一表面上建立电镀掩模。 电镀掩模限定多个部件，包括管芯附接焊盘，至少一排接触焊盘和至少一个附加电子部件。 多个金属层沉积在金属载体的第一表面的暴露部分上。 电镀掩模从金属载体剥离，留下多个金属层以多个部件的形式。 半导体管芯安装到管芯附着焊盘，并且半导体管芯的焊盘电连接到接触焊盘和附加电子部件中的一个。 金属载体的第一表面被包覆成型以封装多个部件，半导体管芯和金属载体被蚀刻掉。

公开(公告)号：US07439099B1

公开(公告)日：2008-10-21

申请号：US10678417

申请日：2003-10-03

Applicant: Chun Ho Fan ,  Kwok Cheung Tsang ,  William Lap Keung Chow

Inventor： Chun Ho Fan ,  Kwok Cheung Tsang ,  William Lap Keung Chow

IPC: H01L21/48

CPC classification number: H01L23/3128 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit package is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. The substrate further has a cavity therein and a heat slug is fixed to the substrate and spans the cavity. A semiconductor die is mounted to the heat slug such that at least a portion of the semiconductor die is disposed in the cavity. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulating material encapsulates the wire bonds and the semiconductor die. A ball grid array is disposed on the first surface of the substrate. Bumps of the ball grid array are in electrical connection with ones of the conductive traces.

Abstract translation: 提供集成电路封装。 该封装包括具有第一和第二表面的基板和它们之间的多个导电迹线。 基板还在其中具有空腔，并且热块固定到基板并且跨越空腔。 将半导体管芯安装到加热块上，使半导体管芯的至少一部分设置在空腔中。 多个引线接合将半导体管芯与衬底的导电迹线连接，并且封装材料封装引线接合和半导体管芯。 球栅阵列设置在基板的第一表面上。 球栅阵列的凸起与导电迹线中的一个导电连接。

公开(公告)号：US07372151B1

公开(公告)日：2008-05-13

申请号：US10660611

申请日：2003-09-12

Applicant: Chun Ho Fan ,  Neil McLellan ,  Kwok Cheung Tsang

Inventor： Chun Ho Fan ,  Neil McLellan ,  Kwok Cheung Tsang

IPC: H01L23/48

CPC classification number: H01L21/561 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: A process for manufacturing an integrated circuit package includes forming a plurality of solder balls on a first surface of a substrate and mounting a semiconductor die to the substrate such that bumps of the semiconductor die are electrically connected to conductive traces of the substrate. The semiconductor die and the solder balls are encapsulated in an overmold material on the substrate such that portions of the solder balls are exposed. A ball grid array is formed such that bumps of the ball grid array are electrically connected to the conductive traces and the integrated circuit package is singulated.

Abstract translation: 一种用于制造集成电路封装的方法，包括在衬底的第一表面上形成多个焊球，并将半导体管芯安装到衬底上，使得半导体管芯的凸块与衬底的导电迹线电连接。 半导体管芯和焊球被封装在衬底上的包覆模制材料中，使得焊球的部分暴露。 形成球栅阵列，使得球栅阵列的凸块电连接到导电迹线，并且集成电路封装被分割。

公开(公告)号：US20070287516A1

公开(公告)日：2007-12-13

申请号：US11893835

申请日：2007-08-16

Applicant: Kwok Cheung ,  Peter Tong ,  C. Thomas

Inventor： Kwok Cheung ,  Peter Tong ,  C. Thomas

IPC: H04M1/00

CPC classification number: H04S1/00 ,  H04H20/61 ,  H04H20/72 ,  H04M1/0214 ,  H04M1/03 ,  H04M1/19 ,  H04M1/605 ,  H04M1/6091 ,  H04R1/403 ,  H04R25/405 ,  H04R25/554 ,  H04R27/00 ,  H04R2201/023 ,  H04R2201/401 ,  H04R2217/03 ,  H04R2225/55 ,  H04S3/00

Abstract: A wireless communication system based on a directional speaker is disclosed. The system can include an interface unit and a base unit. The audio signals from the speaker can be generated by transforming ultrasonic signals in air. This allows the production of directional audio signals even when the aperture of the speaker has dimensions in the order of a few centimeters. The audio signals from the speaker can be heard hands-free. Further, privacy protection is enhanced. In one embodiment, the interface unit can be attached or integrated to a piece of clothing at the shoulder of the user, with the audio signals from the speaker directed towards one of the user's ears. The wireless communication system can be applied to a number of different areas, including a communication device, such as a cell phone; a hearing aid; an entertainment system; and a computation system, such as a personal digital assistant or a computer. The wireless communication system can be personalized to the hearing characteristics of the user, or to the ambient noise level of the environment.

公开(公告)号：US20060192050A1

公开(公告)日：2006-08-31

申请号：US11364456

申请日：2006-02-28

Applicant: Kwok Cheung ,  Peter Tong ,  C. Thomas

Inventor： Kwok Cheung ,  Peter Tong ,  C. Thomas

IPC: B64D11/06

CPC classification number: B60N2/0292 ,  B60N2/06 ,  B60N2/22 ,  B64D11/00 ,  B64D11/0601 ,  B64D11/064

Abstract: A seating arrangement with improved seating comfort is disclosed. In one embodiment, the seating arrangement is for a transportation vehicle. The arrangement includes seats at least having two levels adjacent to single-level seats. The multi-level seats include at least a bottom row of seats and a top row of seats. In one embodiment, the bottom row seats are on a floor; and there is an imaginary horizontal plane that is parallel to the floor, and that at least a part of the top row seats and at least a part of the bottom row seats intersect. The single-level seats include at least two rows, with at least one seat in each row being adjacent to the aisle, to allow passengers to access the single-level seats. In another embodiment, a seating arrangement includes only multi-level seats. In yet another embodiment, a computer-implemented method is applicable to the seats, such as allowing the display of a visual representation of a top-row seat and a bottom-row seat.

Abstract translation: 公开了一种具有改善座椅舒适性的座椅装置。 在一个实施例中，座椅装置用于运输车辆。 该装置包括至少具有与单级座椅相邻的两个等级的座椅。 多层座椅至少包括一排座椅和一排座椅。 在一个实施例中，底排座位在地板上; 并且存在平行于地板的假想水平面，并且顶排座椅的至少一部分和底排座椅的至少一部分相交。 单级座椅包括至少两排，每排至少有一个座位与走道相邻，以允许乘客进入单一座椅。 在另一个实施例中，座椅装置仅包括多层座椅。 在另一个实施例中，计算机实现的方法适用于座椅，例如允许显示顶排座椅和底排座椅的视觉表示。

公开(公告)号：US07081403B1

公开(公告)日：2006-07-25

申请号：US11151469

申请日：2005-06-13

Applicant: Mohan Kirloskar ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan

Inventor： Mohan Kirloskar ,  Chun Ho Fan ,  Kwok Cheung Tsang ,  Kin Pui Kwan

IPC: H01L21/44

CPC classification number: H01L21/4832 ,  H01L21/6835 ,  H01L23/49575 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85001 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A leadless plastic chip carrier is fabricated by selectively etching a leadframe strip to reduce a thickness of the strip at a portion thereof. Selectively masking the surface of the leadframe strip using a mask, follows selectively etching, to provide exposed areas of the surface at the portion and contact pad areas on leadframe the strip. At least one layer of metal is deposited on the exposed areas to define a die attach pad on the portion of the leadframe strip with reduced thickness and to define contact pads on the surface of the strip. At least one semiconductor die is mounted to the die attach pad, followed by wire bonding the at least one semiconductor die to ones of the contact pads. The at least one semiconductor die, the wire bonds, and the contact pads are covered with an overmold material and the leadframe strip is etched to thereby remove the leadframe strip. The leadless plastic chip carrier is singulated from the leadframe strip.

公开(公告)号：US20050009583A1

公开(公告)日：2005-01-13

申请号：US10826529

申请日：2004-04-15

Applicant: Kwok Cheung ,  Peter Tong ,  C. Thomas

Inventor： Kwok Cheung ,  Peter Tong ,  C. Thomas

IPC: H04B1/38 ,  H04B3/00 ,  H04B5/00 ,  H04H1/00 ,  H04H20/61 ,  H04H20/72 ,  H04M1/00 ,  H04M1/02 ,  H04M1/03 ,  H04M1/19 ,  H04M1/60 ,  H04R1/02 ,  H04R1/40 ,  H04R9/06 ,  H04R25/00 ,  H04R27/00 ,  H04S1/00 ,  H04S3/00

CPC classification number: H04S1/00 ,  H04H20/61 ,  H04H20/72 ,  H04M1/0214 ,  H04M1/03 ,  H04M1/19 ,  H04M1/605 ,  H04M1/6091 ,  H04R1/403 ,  H04R25/405 ,  H04R25/554 ,  H04R27/00 ,  H04R2201/023 ,  H04R2201/401 ,  H04R2217/03 ,  H04R2225/55 ,  H04S3/00

Abstract: A wireless communication system based on a directional speaker is disclosed. The system can include an interface unit and a base unit. The audio signals from the speaker can be generated by transforming ultrasonic signals in air. This allows the production of directional audio signals even when the aperture of the speaker has dimensions in the order of a few centimeters. The audio signals from the speaker can be heard hands-free. Further, privacy protection is enhanced. In one embodiment, the interface unit can be attached or integrated to a piece of clothing at the shoulder of the user, with the audio signals from the speaker directed towards one of the user's ears. The wireless communication system can be applied to a number of different areas, including a communication device, such as a cell phone; a hearing aid; an entertainment system; and a computation system, such as a personal digital assistant or a computer. The wireless communication system can be personalized to the hearing characteristics of the user, or to the ambient noise level of the environment.

Abstract translation: 公开了一种基于定向扬声器的无线通信系统。 该系统可以包括接口单元和基本单元。 来自扬声器的音频信号可以通过在空气中转换超声信号来产生。 即使当扬声器的孔径尺寸为几厘米数量级时，也允许产生定向音频信号。 来自扬声器的音频信号可以免提听到。 此外，增强了隐私保护。 在一个实施例中，接口单元可以被附接或集成到用户肩膀处的一件衣服，来自扬声器的音频信号指向用户的耳朵之一。 无线通信系统可以应用于多个不同的区域，包括诸如蜂窝电话的通信设备; 助听器 娱乐系统; 以及诸如个人数字助理或计算机之类的计算系统。 无线通信系统可以根据用户的听觉特性或环境的环境噪声水平进行个性化。