摘要:
Disclosed herein is a semiconductor package substrate including: a substrate for package having connection pads; and a solder resist layer formed on one surface or both surfaces of the substrate for package and having openings exposing the connection pads, wherein the solder resist layer includes a roughness layer formed thereon.
摘要:
Disclosed is an apparatus for manufacturing a printed circuit board. The apparatus for manufacturing the printed circuit board includes: a supplier for supplying a substrate of a sheet type; a first printer for printing paste on the substrate supplied from the supplier to thereby form preliminary bumps; a provisional dryer which is arranged on one side of the first printer and provisional-dries the preliminary bumps; a second printer which is arranged on one side of the provisional dryer to be in series to the first printer and prints paste on the preliminary bumps; a dryer which is arranged on one side of the second printer and dries and cures the preliminary bumps to thereby form bumps; and a penetrator which is arranged on one side of the dryer, and allows the bump to pass through prepreg and bonds the prepreg and the substrate together.
摘要:
A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.
摘要:
A printed circuit board using paste bumps and manufacturing method thereof are disclosed. The method of manufacturing a printed circuit board using paste bumps, includes: (a) perforating a core board to form at least one via hole, (b) filling the at least one via hole by fill-plating and forming a circuit pattern on at least one surface of the core board, (c) stacking a paste bump board on at least one surface of the core board, and (d) forming an outer layer circuit on a surface of the paste bump board, a structurally stable all-layer IVH structure can be implemented due to increased strength in the BVH's of the plated core boards, the manufacture time can be reduced due to parallel processes and collective stacking, implementing micro circuits can be made easy due to the copper foils of the paste bump boards stacked on the outermost layers, the manufacture costs can be reduced as certain plating and drilling processes may be omitted, the interlayer connection area is increased between circuit patterns for improved connection reliability, and dimple coverage can be obtained.
摘要:
Disclosed herein is a method of manufacturing a package substrate with a fine circuit pattern using anodic oxidation. By anodizing a metal core which is opened through a masking process, oxidation layers are formed in open areas of the metal core to insulate portions of circuit pattern from each other. Further, by electroplating portions provided between the oxidation layers with copper or filling conductive paste between the oxidation layers using a screen, a package substrate having a fine circuit pattern is achieved.
摘要:
Disclosed herein are a printed circuit board including a first low-viscosity solder resist layer formed on one surface of a substrate having circuit patterns formed thereon and a second high-viscosity solder resist layer stacked on the first solder resist layer, thereby being advantageous in controlling the deviation in application thickness of solder resist (SR), while having excellent adhesion to the substrate, and a manufacturing method thereof.
摘要:
An apparatus and a method for coating are disclosed. The coating apparatus of the present invention, which include: a transporting part configured to transport a substrate; a coating part configured to coat a coating material on the substrate; and a squeegee installed to remove an excessive coating material after the substrate passes through the coating part and being moveable along a transporting path of the substrate, can carry out the coating operation and the squeegeeing operation together, thereby reducing the lead time of the coating operation of the substrate and increasing the productivity. By integrating the conventional coating device and squeegeeing device, the space required for installation can be saved, and the quality of coating can be improved because conditions for coating can be adjusted.
摘要:
A core substrate using paste bumps, the core substrate including a first paste bump board having a plurality of first paste bumps joined to a surface thereof; a second paste bump board having a plurality of second paste bumps facing the first paste bumps joined thereto; and an insulation element placed between the first paste bump board and the second paste bump board. In the core substrate, the first paste bumps and the second paste bumps are electrically interconnected.
摘要:
A core substrate using paste bumps, the core substrate including a first paste bump board having a plurality of first paste bumps joined to a surface thereof; a second paste bump board having a plurality of second paste bumps facing the first paste bumps joined thereto; and an insulation element placed between the first paste bump board and the second paste bump board. In the core substrate, the first paste bumps and the second paste bumps are electrically interconnected.
摘要:
A core substrate and multilayer printed circuit board using paste bumps and manufacturing method thereof are disclosed. With the method of manufacturing a core substrate using paste bumps comprising: (a) aligning a pair of paste bump boards, each of which has a plurality of paste bumps joined to its surface, such that the paste bumps face each other, and (b) pressing the pair of paste bump boards together, where an insulation element is placed between the pair of paste bump boards, it is easier to implement interlayer electrical interconnection between circuit patterns, the thickness of the core substrate can readily be adjusted by adjusting the thickness of the insulation layer, the stiffness is improved as a pair of paste bump boards are pressed from the top and bottom, and high-density wiring can be formed more easily as the paste bumps are connected in pairs so that the diameters of the paste bumps formed on the paste bump boards can be reduced.