公开(公告)号：US10940629B2

公开(公告)日：2021-03-09

申请号：US16191768

申请日：2018-11-15

Applicant: AGC Inc.

Inventor： Wataru Kasai ,  Kengo Kawahara

IPC: B29C48/885 ,  C08J5/18 ,  B29C48/08 ,  B29C48/305 ,  B29C48/88 ,  C08F210/02 ,  C08F214/26 ,  B29K627/18 ,  B29K23/00 ,  B29K27/18 ,  B29L7/00 ,  C08L27/18 ,  C08L23/08 ,  B29C48/00 ,  B29K627/12

Abstract: To provide an ETFE film which is unlikely to wrinkle when stretched and retracted, and a method for producing the same. It is an ethylene-tetrafluoroethylene copolymer film characterized in that the crystallinity obtained by the formula (1) from the peak area S20 in the vicinity of 2θ=20°, the peak area S19 in the vicinity of 2θ=19° and the peak area S17 in the vicinity of 2θ=17° in the diffraction intensity curve obtained by the X-ray diffraction method, is from 55 to 70%, and the proportion of the quasi-crystal layer obtained by the formula (2) is from 10 to 20%: crystallinity (%)=(S19+S2)/(S17+S19+S20)×100  (1) proportion of quasi-crystal layer (%)=S20/(S17+S19++S20)×100  (2).

公开(公告)号：US10807776B2

公开(公告)日：2020-10-20

申请号：US15909385

申请日：2018-03-01

Applicant: AGC Inc.

Inventor： Daisuke Taguchi ,  Wataru Kasai ,  Yoshiaki Higuchi

IPC: B65D59/02 ,  C08J5/18 ,  B65D39/00 ,  C09D123/08 ,  C08F214/26 ,  C08F210/02 ,  C08L23/08 ,  C08L27/18 ,  G01N25/48

Abstract: To provide a resin film which comprises an ethylene/tetrafluoroethylene copolymer and which is to be used as, for example, a rubber plug lamination film to prevent breakage at the time of producing a laminated rubber plug. The resin film comprises an ethylene/tetrafluoroethylene copolymer and is characterized in that the product of the value of the endothermic peak height ΔH (mW/mg) obtained by its DSC-analysis and the haze (%) measured at a thickness of 100 μm, is from 0.1 to 0.2 (mW/mg·%).

公开(公告)号：US12119142B2

公开(公告)日：2024-10-15

申请号：US17591755

申请日：2022-02-03

Applicant: AGC INC.

Inventor： Wataru Kasai ,  Tomoya Hosoda ,  Atsumi Mitsunaga ,  Tatsuya Terada ,  Sota Yuki

IPC: H01B3/30 ,  B32B7/025 ,  B32B15/08 ,  B32B15/20 ,  B32B37/24 ,  H01B1/02 ,  H01B3/44

CPC classification number: H01B3/306 ,  B32B7/025 ,  B32B15/08 ,  B32B15/20 ,  B32B37/24 ,  H01B1/026 ,  H01B3/445 ,  B32B2037/243 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/7265 ,  B32B2457/04

Abstract: A heat-resistant film that has high adhesion and low warping, a method for producing the film, and a metal-clad laminate and a coated metal conductor, using the film. The film includes an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.

公开(公告)号：US11632859B2

公开(公告)日：2023-04-18

申请号：US16911492

申请日：2020-06-25

Applicant: AGC Inc.

Inventor： Wataru Kasai ,  Tomoya Hosoda ,  Atsumi Yamabe

IPC: H05K1/03 ,  H05K1/09

Abstract: Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 μm thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 μm. Also provided are a method for producing the long laminate, and the printed wiring board.

公开(公告)号：US11370200B2

公开(公告)日：2022-06-28

申请号：US16660895

申请日：2019-10-23

Applicant: AGC Inc.

Inventor： Tomoya Hosoda ,  Tatsuya Terada ,  Atsumi Yamabe ,  Nobutaka Kidera ,  Wataru Kasai

IPC: B32B27/00 ,  C08F214/26 ,  C08J5/12 ,  C08J5/18 ,  C08J5/24 ,  H05K1/02 ,  H05K1/03 ,  H05K3/02

Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm2 of a second surface 10b thereof is measured by an atomic force microscope.

公开(公告)号：US10913183B2

公开(公告)日：2021-02-09

申请号：US15256957

申请日：2016-09-06

Applicant: AGC Inc.

Inventor： Wataru Kasai

IPC: B32B27/08 ,  B29C33/68 ,  B32B27/32 ,  H01L21/48 ,  B32B27/34 ,  B29C45/14 ,  B32B27/36 ,  B32B27/30 ,  H01L23/057 ,  B32B27/28 ,  B32B3/30 ,  B32B7/06 ,  B32B25/08 ,  H01L21/56 ,  B29C45/02 ,  B32B37/12 ,  H01L27/146 ,  B29K75/00 ,  B29K627/18 ,  B29L31/34

Abstract: To provide a process for producing a package for mounting a semiconductor element by using a mold, said a package for mounting a semiconductor element comprising a substrate having a mounting surface for mounting a semiconductor element and a packaging body formed from a cured product of a curable resin and having a frame-shaped portion surrounding the mounting surface, and the package has a concave portion formed by the mounting surface and the packaging body, which allows it to prevent resin burrs without occurrence of dents or damage of a substrate and failure in releasing from a mold, and to provide a mold release film to be suitably used for the production process.
A mold release film having a substantially constant thickness over the film, is disposed on the upper mold having a convex portion of which shape corresponds to the concave portion, the substrate is disposed on the lower portion, the upper mold and the lower mold are closed so as to be in close contact with the convex portion to the mounting portion of the substrate via the mold release film, a space formed between the upper mold and the lower mold is filled with a curable resin, followed by curing the curable resin, and the cured product is released together with the substrate, from the mold.

公开(公告)号：US10699916B2

公开(公告)日：2020-06-30

申请号：US15479577

申请日：2017-04-05

Applicant: AGC Inc.

Inventor： Wataru Kasai ,  Masami Suzuki

IPC: B29C70/70 ,  B29C33/68 ,  B32B27/00 ,  B32B27/30 ,  B32B27/18 ,  B32B7/12 ,  B32B27/20 ,  B32B27/06 ,  B32B25/08 ,  B32B3/30 ,  B32B25/20 ,  B32B27/32 ,  B32B27/16 ,  B32B27/34 ,  B32B27/08 ,  H01L21/56 ,  B32B27/28 ,  B32B25/04 ,  B32B27/36 ,  B29L31/34 ,  H01L23/00

Abstract: To provide a mold release film which has excellent mold releasing property and is capable of reducing contamination of a mold in a sealing step; a process for producing the mold release film; and a process for producing a semiconductor package by using the mold release film. The mold release film 1 is a mold release film to be disposed on a surface of a mold which is to be in contact with a curable resin, in the production of a semiconductor package by disposing a semiconductor element in the mold, and sealing it with the curable resin to form a resin sealed portion. This mold release film 1 comprises a resin-side mold release layer 2 to be in contact with the curable resin at the time of forming the resin sealed portion, and a gas barrier layer 3. The gas barrier layer 3 contains at least one polymer (I) selected from the group consisting of a polymer having vinyl alcohol units and a polymer having vinylidene chloride units, and the thickness of the gas barrier layer 3 is from 0.1 to 5 μm.

公开(公告)号：US12083767B2

公开(公告)日：2024-09-10

申请号：US17562167

申请日：2021-12-27

Applicant: AGC Inc.

Inventor： Wataru Kasai ,  Yuya Horiguchi ,  Seigo Kotera ,  Tomoya Hosoda

IPC: B32B9/00 ,  B32B15/082 ,  B32B27/30 ,  B32B27/32 ,  C08J5/18

CPC classification number: B32B15/082 ,  B32B27/30 ,  B32B27/322 ,  C08J5/18 ,  B32B2264/0228 ,  B32B2264/0257 ,  B32B2264/202 ,  B32B2264/303 ,  C08J2327/18 ,  C08J2427/12

Abstract: As an exemplary configuration, a long film is configured by thermomeltable polymers including a first unit based on tetrafluoroethylene and a second unit based on perfluoro (alkyl vinyl ether), including spherulites of the thermomeltable polymers, wherein radius of each spherulite is 10 μm or less. As another exemplary configuration, a long film is configured by tetrafluoroethylene polymers having a melt flow rate within a range of 5 to 40 g/10 min. The long film is heated at 180° C. for 30 minutes so as to measure the thermal expansion rate, and when letting thermal expansion rate in a first direction, which extends at a 45-degree angle to a melt flow direction be A, and thermal expansion rate in a second direction orthogonal to the first direction be B, A and B are respectively within the range of −2 to +1%, and |A−B| is 1% or less.

公开(公告)号：US20230227684A1

公开(公告)日：2023-07-20

申请号：US18115064

申请日：2023-02-28

Applicant: AGC INC.

Inventor： Mai Nishi ,  Tatsuya Terada ,  Tomoya Hosoda ,  Wataru Kasai

IPC: C09D127/18 ,  C09D7/65 ,  C09D7/45

CPC classification number: C09D127/18 ,  C09D7/65 ,  C09D7/45

Abstract: To provide a powder dispersion comprising a tetrafluoroethylene polymer, a particular polyoxyalkylene-modified polydimethylsiloxane and a liquid dispersion medium, and a composite having a baked product having physical properties intrinsic to the tetrafluoroethylene polymer. [Solution] The powder dispersion of the present invention comprises a powder of a tetrafluorethylene polymer, a liquid dispersion medium and a polyoxyalkylene-modified polydimethylsiloxane having a weight average molecular weight of at most 3,000 and an HLB value of from 1 to 18 calculated by Griffin's equation The composite of the present invention is produced by applying the powder dispersion of the present invention to the surface of a substrate and heating the powder dispersion.

公开(公告)号：US11535015B2

公开(公告)日：2022-12-27

申请号：US16808502

申请日：2020-03-04

Applicant: AGC Inc.

Inventor： Wataru Kasai ,  Tomoya Hosoda

IPC: B32B3/24 ,  B32B27/30 ,  B32B15/082 ,  C08J5/18 ,  H05K1/03 ,  H05K3/00 ,  H05K3/02 ,  B32B3/26

Abstract: To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.