公开(公告)号：US20120038033A1

公开(公告)日：2012-02-16

申请号：US13285896

申请日：2011-10-31

申请人： Akira OGA ,  Yoshihiro Tomita ,  Masanori Minamio

发明人： Akira OGA ,  Yoshihiro Tomita ,  Masanori Minamio

IPC分类号： H01L23/495

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45147 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/206

摘要： A semiconductor device includes a first semiconductor chip 1, a second semiconductor chip 4, a first lead frame 3 including a first die pad 9 on which the first semiconductor chip 1 is mounted, and a second lead frame 5 including a second die pad 11 on which the second semiconductor chip 4 is mounted. A sealing structure 6 covers the first semiconductor chip 1 and the second semiconductor chip 4. A noise shield 7 is disposed between the first semiconductor chip 1 and the second semiconductor chip 4.

摘要翻译： 半导体器件包括第一半导体芯片1，第二半导体芯片4，第一引线框架3，第一引线框架3和第二引线框架3，第一引线框架3包括安装有第一半导体芯片1的第一管芯焊盘9和第二引线框架5， 第二半导体芯片4被安装。 密封结构6覆盖第一半导体芯片1和第二半导体芯片4.噪声屏蔽7设置在第一半导体芯片1和第二半导体芯片4之间。

公开(公告)号：US06984880B2

公开(公告)日：2006-01-10

申请号：US10702603

申请日：2003-11-07

申请人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

IPC分类号： H01L23/495 ,  H01L23/28

CPC分类号： H01L21/568 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68318 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01083 ,  H01L2924/00

摘要： A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).

公开(公告)号：US06225146B1

公开(公告)日：2001-05-01

申请号：US09361404

申请日：1999-07-27

申请人： Yukio Yamaguchi ,  Akira Oga ,  Toru Nomura ,  Masanori Minamio

发明人： Yukio Yamaguchi ,  Akira Oga ,  Toru Nomura ,  Masanori Minamio

IPC分类号： H01L2144

CPC分类号： H01L23/3121 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49558 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a lead frame, inside inner leads are supported by supporting leads through an insulator. The inside inner leads and outside inner leads are separated from one another and are doubly arranged. In manufacturing a semiconductor device by using this lead frame, a semiconductor chip is mounted on the insulator, and the semiconductor chip is connected with the inside inner leads and the outside inner leads through metal wires, and the resultant is sealed with a resin. Thus, projections provided on the bottoms of the inside inner leads and the outside inner leads can work as external terminals. Since the external terminals can be disposed two-dimensionally on the bottom the lead frame is applicable to high density packaging and multi-pin devices, and can additionally provide a so-called burr-less structure free from uncut waste of the resin.

摘要翻译： 在引线框架中，内部引线由支撑引线穿过绝缘体支撑。 内部内部引线和外部内部引线彼此分离并且被双重布置。 在使用这种引线框制造半导体器件时，半导体芯片安装在绝缘体上，半导体芯片通过金属线与内部内部引线和外部内部引线连接，并且用树脂密封。 因此，设置在内部内部引线和外部内部引线的底部的突起可以作为外部端子。 由于外部端子可以在底部二维地设置，所以引线框架可应用于高密度封装和多针装置，并且可以另外提供所谓的无毛刺结构，而不会产生未切割的树脂浪费。

公开(公告)号：US5708295A

公开(公告)日：1998-01-13

申请号：US638043

申请日：1996-04-26

申请人： Akira Oga ,  Yukio Yamaguchi ,  Toru Nomura ,  Masanori Minamio

发明人： Akira Oga ,  Yukio Yamaguchi ,  Toru Nomura ,  Masanori Minamio

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/49503 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14

摘要： In a space surrounded by outer frames formed in the shape of as rectangle is disposed a die pad in the shape of a square for mounting a semiconductor chip having electrodes. Each of the outer frames is connected with a plurality of outer leads respectively continuous with inner leads which are used for electrical connection and extended toward the die pad. Each inner lead is extended to the vicinity of a position where each electrode of the semiconductor chip is to be formed. The corners of the die pad are respectively provided with support members extending to positions away from a dam bar by a predetermined distance. The support members are connected with the inner leads via a square ring-shaped insulating member. Thus, the die pad is supported by the outer frames via the support members. Since there is no need to provide a die pad lead, the space at the corner conventionally occupied by the die pad lead can be utilized for wiring, and the leads can be easily led in.

摘要翻译： 在被形成为矩形形状的外框包围的空间中，设置有用于安装具有电极的半导体芯片的正方形的芯片焊盘。 每个外框架与分别与用于电连接并朝向管芯垫延伸的内引线连续的多个外引线连接。 每个内引线延伸到要形成半导体芯片的每个电极的位置附近。 模具垫的角部分别设置有延伸到远离坝条的位置预定距离的支撑构件。 支撑构件通过方形环形绝缘构件与内部引线连接。 因此，管芯垫通过支撑构件由外框架支撑。 由于不需要提供芯片焊盘引线，通常由芯片焊盘引线占据的角落的空间可用于布线，并且引线可以容易地引入。

公开(公告)号：US06720207B2

公开(公告)日：2004-04-13

申请号：US09971731

申请日：2001-10-09

申请人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Fumihiko Kawai ,  Masahiko Ohiro ,  Masanori Koichi ,  Yoshinori Satoh ,  Akira Oga ,  Toshiyuki Fukuda

IPC分类号： H01L2150

CPC分类号： H01L21/568 ,  H01L21/4821 ,  H01L21/4828 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/28 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68318 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01083 ,  H01L2924/00

摘要： A leadframe includes: a frame rail; a die pad, disposed inside the frame rail, for mounting a semiconductor chip thereon; and a plurality of internal inner leads, which are disposed to surround the die pad and each of which has a convex portion on the bottom thereof. The frame rail and the internal inner leads are retained by a lead retaining member on their upper and/or lower surface(s).

公开(公告)号：US5977615A

公开(公告)日：1999-11-02

申请号：US997651

申请日：1997-12-23

申请人： Yukio Yamaguchi ,  Akira Oga ,  Toru Nomura ,  Masanori Minamio

发明人： Yukio Yamaguchi ,  Akira Oga ,  Toru Nomura ,  Masanori Minamio

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/28

CPC分类号： H01L23/3121 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49558 ,  H01L24/32 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181

摘要： In a lead frame, inside inner leads are supported by supporting leads through an insulator. The inside inner leads and outside inner leads are separated from one another and are doubly arranged. In manufacturing a semiconductor device by using this lead frame, a semiconductor chip is mounted on the insulator, and the semiconductor chip is connected with the inside inner leads and the outside inner leads through metal wires, and the resultant is sealed with a resin. Thus, projections provided on the bottoms of the inside inner leads and the outside inner leads can work as external terminals. Since the external terminals can be disposed two-dimensionally on the bottom, the lead frame is applicable to high density packaging and multi-pin devices, and can additionally provide a so-called burr-less structure free from uncut waste of the resin.

摘要翻译： 在引线框架中，内部引线由支撑引线穿过绝缘体支撑。 内部内部引线和外部内部引线彼此分离并且被双重布置。 在使用这种引线框制造半导体器件时，半导体芯片安装在绝缘体上，半导体芯片通过金属线与内部内部引线和外部内部引线连接，并且用树脂密封。 因此，设置在内部内部引线和外部内部引线的底部的突起可以作为外部端子。 由于外部端子可以二维地设置在底部上，所以引线框架可应用于高密度封装和多针装置，并且可以另外提供所谓的无毛刺结构，而不会产生未切割的树脂浪费。

公开(公告)号：US20080081161A1

公开(公告)日：2008-04-03

申请号：US11898971

申请日：2007-09-18

申请人： Yoshihiro Tomita ,  Masanori Minamio ,  Toshiyuki Fukuda

发明人： Yoshihiro Tomita ,  Masanori Minamio ,  Toshiyuki Fukuda

IPC分类号： B32B3/10

CPC分类号： H05K3/3452 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0133 ,  H01L2924/15173 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/285 ,  H05K2201/068 ,  H05K2203/1572 ,  Y10T428/24917 ,  Y10T428/24926 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides a wiring board which may be warped only by a reduced amount when the wiring board is thin and has wiring patterns of different shapes on the opposite surfaces thereof and which enables a thin, small, and reliable semiconductor device to be implemented. The wiring board includes a planar resin base material 12, a first resin film 26 provided on the first surface of the resin base material 12 and shaped to expose the element connection terminals 14, and a second resin film 28 provided on the second surface of the resin base material and shaped to expose the external connection terminals 16, wherein the first resin film 26 and the second resin film 28 are different in at least one of a glass transition point, cure shrinkage, and a thermal expansion coefficient.

摘要翻译： 本发明提供了一种布线基板，其在布线板薄且仅在其相对表面上具有不同形状的布线图案时可能仅通过减少的量翘曲，并且能够实现薄而小的可靠的半导体器件。 布线板包括平面树脂基材12，设置在树脂基材12的第一表面上并成形为暴露元件连接端子14的第一树脂膜26和设置在第二表面上的第二树脂膜28 树脂基材，成形为露出外部连接端子16，其中第一树脂膜26和第二树脂膜28在玻璃化转变点，固化收缩率和热膨胀系数中的至少一个方面不同。

公开(公告)号：US20070217476A1

公开(公告)日：2007-09-20

申请号：US11708478

申请日：2007-02-21

申请人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

发明人： Noriyuki Yoshikawa ,  Masanori Minamio ,  Hisanori Ishiguro ,  Hideyuki Nakanishi ,  Hiroyuki Ishida ,  Yoshihiro Tomita ,  Toshiyuki Fukuda

IPC分类号： H01S3/06

CPC分类号： H01S5/02272 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L33/20 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32057 ,  H01L2224/48 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/157 ,  H01L2924/3511 ,  H01S5/0071 ,  H01S5/0207 ,  H01S5/02216 ,  H01S5/0224 ,  H01S5/02292 ,  H01S5/02476 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An optical semiconductor device includes a semiconductor laser chip, a base for mounting the semiconductor laser chip and a solder layer sandwiched between the top surface of the base and the bottom surface of the semiconductor laser chip. The semiconductor laser chip is warped in upward convex shape.

摘要翻译： 光半导体器件包括半导体激光器芯片，用于安装半导体激光器芯片的基座和夹在基底的顶表面和半导体激光器芯片的底表面之间的焊料层。 半导体激光芯片翘曲成向上凸出的形状。

公开(公告)号：US07915697B2

公开(公告)日：2011-03-29

申请号：US12404923

申请日：2009-03-16

申请人： Masanori Minamio ,  Yoshihiro Tomita

发明人： Masanori Minamio ,  Yoshihiro Tomita

IPC分类号： G01L9/00

CPC分类号： H01L21/67248 ,  H01L21/67063

摘要： The sensor device includes: a converter body made of silicon in the shape of a rhombus in plan, the converter body having an opening in the shape of a hexagon in plan; a substrate for holding the converter body; a movable film formed on the opening; a converter electrode formed on the converter body; and a substrate electrode formed on the substrate, the substrate electrode being electrically connected with the converter electrode. The opening is placed so that four of the six sides of the hexagon extend along the four sides of the rhombus of the converter body.

摘要翻译： 该传感器装置包括：平面内呈菱形形状的硅转换体，该转换体具有平面形状的六边形开口; 用于保持转换器主体的基板; 形成在开口上的可动膜; 形成在所述转换器主体上的转换器电极; 以及形成在所述基板上的基板电极，所述基板电极与所述转换器电极电连接。 放置开口使得六边形的六个边中的四个沿着转换器主体的菱形的四边延伸。

公开(公告)号：US20090238394A1

公开(公告)日：2009-09-24

申请号：US12396010

申请日：2009-03-02

申请人： Masanori Minamio ,  Yoshihiro Tomita ,  Koji Nomura

发明人： Masanori Minamio ,  Yoshihiro Tomita ,  Koji Nomura

IPC分类号： H04R1/00 ,  H04R31/00

CPC分类号： H04R31/00 ,  Y10T29/49005

摘要： A microphone includes: a substrate including a tone hole and having a top surface on which a substrate electrode is provided; a converter provided on the top surface of the substrate and including a main body having a back space, a diaphragm provided at the bottom of the back space of the main body, and a converter electrode provided on a region of a bottom surface of the main body facing the substrate electrode; and a bump connecting the substrate electrode and the converter electrode to each other. The diaphragm vibrates in response to sound entering from the tone hole. The converter converts sound into a signal.

摘要翻译： 麦克风包括：包括音孔并具有其上设置有基板电极的顶表面的基板; 设置在所述基板的上表面上的转换器，具有设置在所述主体的后部空间的底部的隔膜，设置在所述主体的后部空间的底部的隔膜以及设置在所述主体的底面的区域的转换电极 身体面向衬底电极; 以及将基板电极和转换器电极彼此连接的凸块。 响应于从音孔进入的声音，隔膜振动。 转换器将声音转换为信号。