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公开(公告)号：US10347562B1
公开(公告)日：2019-07-09
申请号：US15663024
申请日：2017-07-28
发明人： Louis W. Nicholls , Roger D. St. Amand , Jin Seong Kim , Woon Kab Jung , Sung Jin Yang , Robert F. Darveaux
IPC分类号： H01L23/48
摘要： A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.
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2.发明申请公开(公告)号：US20170162510A1
公开(公告)日：2017-06-08
申请号：US15357551
申请日：2016-11-21
发明人： Jin Seong Kim , Ye Sul Ahn , Cha Gyu Song
IPC分类号： H01L23/538 , H01L21/48 , H01L23/31 , H01L21/56
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/486 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/49816 , H01L23/5384 , H01L23/5385 , H01L23/5386 , H01L24/81 , H01L25/105 , H01L2224/131 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2225/1076 , H01L2924/12042 , H01L2924/15321 , H01L2924/15331 , H01L2924/00 , H01L2924/014
摘要： A semiconductor device having an embedded semiconductor die and substrate-to-substrate interconnects is disclosed and may include a substrate with a top surface and a bottom surface, a semiconductor die bonded to the top surface of the substrate, a first mold material encapsulating the semiconductor die and at least a portion of the top surface of the substrate, and a first conductive bump that is on the top surface of the substrate and is at least partially encapsulated by the first mold material. An extended substrate may be coupled to the substrate utilizing the first conductive bump. A second conductive bump may be formed on the bottom surface of the substrate, and a second mold material may encapsulate at least a portion of the second conductive bump and at least a portion of the bottom surface of the substrate. A third mold material may be formed between the first mold material and the extended substrate.
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公开(公告)号：US20160358007A1
公开(公告)日：2016-12-08
申请号：US15144565
申请日：2016-05-02
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
CPC分类号： H01L23/15 , G06K9/00053 , H01L21/561 , H01L23/3121 , H01L23/4952 , H01L23/49805 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/02166 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48165 , H01L2224/48227 , H01L2224/48992 , H01L2224/48997 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15313 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2924/00015 , H01L2924/00012
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
摘要翻译： 指纹传感器装置和制造指纹传感器装置的方法。 作为非限制性示例，本公开的各个方面提供各种指纹传感器装置及其制造方法，其包括互连结构，例如接合线，其至少一部分延伸到用于安装 和/或包括在从该半导体芯片横向偏离的位置处从该半导体管芯向上延伸的互连结构。
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4.发明申请SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-TO-SUBSTRATE INTERCONNECTS 有权具有嵌入式半导体器件的半导体器件和衬底到衬底互连公开(公告)号：US20150108643A1
公开(公告)日：2015-04-23
申请号：US14522572
申请日：2014-10-23
发明人： Jin Seong Kim , Ye Sul Ahn , Cha Gyu Song
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/486 , H01L21/565 , H01L23/3114 , H01L23/3128 , H01L23/49816 , H01L23/5384 , H01L23/5385 , H01L23/5386 , H01L24/81 , H01L25/105 , H01L2224/131 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2225/1076 , H01L2924/12042 , H01L2924/15321 , H01L2924/15331 , H01L2924/00 , H01L2924/014
摘要： A semiconductor device having an embedded semiconductor die and substrate-to-substrate interconnects is disclosed and may include a substrate with a top surface and a bottom surface, a semiconductor die bonded to the top surface of the substrate, a first mold material encapsulating the semiconductor die and at least a portion of the top surface of the substrate, and a first conductive bump that is on the top surface of the substrate and is at least partially encapsulated by the first mold material. An extended substrate may be coupled to the substrate utilizing the first conductive bump. A second conductive bump may be formed on the bottom surface of the substrate, and a second mold material may encapsulate at least a portion of the second conductive bump and at least a portion of the bottom surface of the substrate. A third mold material may be formed between the first mold material and the extended substrate.
摘要翻译： 公开了一种具有嵌入式半导体管芯和衬底至衬底互连的半导体器件，其可包括具有顶表面和底表面的衬底，与衬底顶表面结合的半导体管芯，封装半导体 模具和衬底的顶表面的至少一部分，以及位于衬底的顶表面上并且被第一模具材料至少部分地包封的第一导电凸块。 可以利用第一导电凸块将延伸的衬底耦合到衬底。 第二导电凸块可以形成在衬底的底表面上，并且第二模具材料可以封装第二导电凸块的至少一部分和衬底的底表面的至少一部分。 可以在第一模具材料和延伸的基板之间形成第三模具材料。
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公开(公告)号：US10714408B2
公开(公告)日：2020-07-14
申请号：US16373357
申请日：2019-04-02
发明人： Louis W. Nicholls , Roger D. St. Amand , Jin Seong Kim , Woon Kab Jung , Sung Jin Yang , Robert F. Darveaux
IPC分类号： H01L23/48 , H01L23/498 , H01L21/48 , H01L23/31 , H01L23/538
摘要： A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.
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公开(公告)号：US10672676B2
公开(公告)日：2020-06-02
申请号：US15988940
申请日：2018-05-24
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： H01L23/15 , H01L23/00 , G06K9/00 , H01L23/498 , H01L23/495 , H01L23/31 , H01L21/56
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US10090230B2
公开(公告)日：2018-10-02
申请号：US14496764
申请日：2014-09-25
发明人： Jae Yun Kim , Gi Tae Lim , Woon Kab Jung , Ju Hoon Yoon , Dong Joo Park , Byong Woo Cho , Gyu Wan Han , Ji Young Chung , Jin Seong Kim , Do Hyun Na
IPC分类号： H01L23/00 , H01L23/498 , H01L23/31 , H01L21/50 , H01L23/538
摘要： A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
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公开(公告)号：US20180269121A1
公开(公告)日：2018-09-20
申请号：US15988940
申请日：2018-05-24
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： H01L23/15 , H01L23/00 , G06K9/00 , H01L23/498 , H01L23/495 , H01L23/31 , H01L21/56
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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公开(公告)号：US20180138155A1
公开(公告)日：2018-05-17
申请号：US15871617
申请日：2018-01-15
发明人： Jin Seong Kim , Edwin J. Adlam , Ludovico E. Bancod , Gi Jung Kim , Robert Lanzone , Jae Ung Lee , Yung Woo Lee , Mi Kyeong Choi
IPC分类号： H01L25/065 , H01L25/00 , H01L23/552
CPC分类号： H01L25/0657 , H01L23/49811 , H01L23/552 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0652 , H01L25/50 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06537 , H01L2225/06558 , H01L2225/06572 , H01L2924/15153 , H01L2924/15159 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2224/83 , H01L2224/81 , H01L2224/85 , H01L2924/00
摘要： A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof
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公开(公告)号：US09728476B2
公开(公告)日：2017-08-08
申请号：US15144565
申请日：2016-05-02
发明人： Ji Young Chung , Dong Joo Park , Jin Seong Kim , Jae Sung Park , Se Hwan Hong
IPC分类号： G06K9/00 , H01L23/15 , H01L23/00 , H01L23/498 , H01L23/495 , H01L23/31 , H01L21/56
CPC分类号： H01L23/15 , G06K9/00053 , H01L21/561 , H01L23/3121 , H01L23/4952 , H01L23/49805 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/02166 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2919 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48105 , H01L2224/48165 , H01L2224/48227 , H01L2224/48992 , H01L2224/48997 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15313 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2924/00015 , H01L2924/00012
摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
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