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公开(公告)号：US20120012949A1
公开(公告)日：2012-01-19
申请号：US12835111
申请日：2010-07-13
申请人： Bernhard Winkler , Rainer Leuschner , Horst Theuss
发明人： Bernhard Winkler , Rainer Leuschner , Horst Theuss
IPC分类号： H01L29/84 , B29C70/68 , H01L31/0203
CPC分类号： B81B7/0058 , B81B2201/025 , B81B2201/0264 , B81B2207/012 , B81B2207/015 , B81C2203/0154 , G01L9/0054 , G01L15/00 , G01L19/141 , G01L19/148 , H01L29/84 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/1461 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Embodiments relate to integrated circuit (IC) sensors and sensing systems and methods. In an embodiment, an IC sensor device includes at least one sensing element; a framing element disposed around the at least one sensing element at a wafer-level; and a package having at least one port predefined at the wafer-level by the framing element, the at least one port configured to expose at least a portion of the at least one sensing element to an ambient environment.
摘要翻译： 实施例涉及集成电路（IC）传感器和感测系统和方法。 在一个实施例中，IC传感器装置包括至少一个感测元件; 在晶片级周围设置在所述至少一个感测元件周围的成帧元件; 以及封装，其具有通过框架元件在晶片级预定义的至少一个端口，所述至少一个端口被配置为将所述至少一个感测元件的至少一部分暴露于周围环境。
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公开(公告)号：US08618620B2
公开(公告)日：2013-12-31
申请号：US12835111
申请日：2010-07-13
申请人： Bernhard Winkler , Rainer Leuschner , Horst Theuss
发明人： Bernhard Winkler , Rainer Leuschner , Horst Theuss
IPC分类号： H01L29/84
CPC分类号： B81B7/0058 , B81B2201/025 , B81B2201/0264 , B81B2207/012 , B81B2207/015 , B81C2203/0154 , G01L9/0054 , G01L15/00 , G01L19/141 , G01L19/148 , H01L29/84 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/1461 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Embodiments relate to integrated circuit (IC) sensors and sensing systems and methods. In an embodiment, an IC sensor device includes at least one sensing element; a framing element disposed around the at least one sensing element at a wafer-level; and a package having at least one port predefined at the wafer-level by the framing element, the at least one port configured to expose at least a portion of the at least one sensing element to an ambient environment.
摘要翻译： 实施例涉及集成电路（IC）传感器和感测系统和方法。 在一个实施例中，IC传感器装置包括至少一个感测元件; 在晶片级周围设置在所述至少一个感测元件周围的框架元件; 以及封装，其具有通过框架元件在晶片级预定义的至少一个端口，所述至少一个端口被配置为将所述至少一个感测元件的至少一部分暴露于周围环境。
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3.发明授权Apparatus comprising and a method for manufacturing an embedded MEMS device 有权装置包括一种用于制造嵌入式MEMS装置的方法公开(公告)号：US08872288B2
公开(公告)日：2014-10-28
申请号：US13571263
申请日：2012-08-09
申请人： Edward Fuergut , Horst Theuss , Rainer Leuschner
发明人： Edward Fuergut , Horst Theuss , Rainer Leuschner
IPC分类号： H01L29/84
CPC分类号： B81B7/0041 , B81B3/0021 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00253 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H04R19/005 , H04R31/006 , H04R2201/003 , H01L2924/00
摘要： A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.
摘要翻译： 公开了一种用于形成封装的MEMS器件的系统和方法。 在一个实施例中，封装的MEMS器件包括具有第一主表面的MEMS器件，第一主表面具有沿着第一方向的第一区域和第二方向，设置在MEMS器件的第一主表面上的膜和邻近膜的背板。 封装的MEMS器件还包括封装MEMS器件并且限定后部体积的封装材料，后部体积具有沿第一方向和第二方向的第二区域，其中第一区域小于第二区域。
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公开(公告)号：US20140042565A1
公开(公告)日：2014-02-13
申请号：US13571263
申请日：2012-08-09
申请人： Edward Fuergut , Horst Theuss , Rainer Leuschner
发明人： Edward Fuergut , Horst Theuss , Rainer Leuschner
CPC分类号： B81B7/0041 , B81B3/0021 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00253 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/24137 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H04R19/005 , H04R31/006 , H04R2201/003 , H01L2924/00
摘要： A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.
摘要翻译： 公开了一种用于形成封装的MEMS器件的系统和方法。 在一个实施例中，封装的MEMS器件包括具有第一主表面的MEMS器件，第一主表面具有沿着第一方向的第一区域和第二方向，设置在MEMS器件的第一主表面上的膜和邻近膜的背板。 封装的MEMS器件还包括封装MEMS器件并且限定后部体积的封装材料，后部体积具有沿第一方向和第二方向的第二区域，其中第一区域小于第二区域。
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公开(公告)号：US09021887B2
公开(公告)日：2015-05-05
申请号：US13329618
申请日：2011-12-19
申请人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
发明人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
CPC分类号： B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02
摘要： Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
摘要翻译： 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置，所述压阻感测装置被布置成感测扰动电感测信号的机械应力，并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。
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公开(公告)号：US20130152696A1
公开(公告)日：2013-06-20
申请号：US13329618
申请日：2011-12-19
申请人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
发明人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
IPC分类号： G01B7/16
CPC分类号： B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02
摘要： Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
摘要翻译： 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置，所述压阻感测装置被布置成感测扰动电感测信号的机械应力，并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。
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公开(公告)号：US09076717B2
公开(公告)日：2015-07-07
申请号：US11608507
申请日：2006-12-08
申请人： Horst Theuss , Albert Auburger
发明人： Horst Theuss , Albert Auburger
CPC分类号： H01L27/22 , G01R33/0005 , G01R33/072 , G01R33/091 , H01L43/04 , H01L43/14
摘要： The invention relates to a semiconductor component (100) comprising a semiconductor chip (10) configured as a wafer level package, a magnetic field sensor (11) being integrated into said semiconductor chip.
摘要翻译： 本发明涉及一种包括半导体芯片（10）的半导体元件（100），其被配置为晶片级封装，一个集成在所述半导体芯片中的磁场传感器（11）。
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公开(公告)号：US08767983B2
公开(公告)日：2014-07-01
申请号：US11756737
申请日：2007-06-01
CPC分类号： H04R19/005 , B81B2201/0257 , B81C1/0023 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H01L2224/8592 , H01L2924/15151 , H01L2924/16151 , H01L2924/16195 , H01L2924/3025 , H04R1/02 , H04R1/04 , H01L2924/00014 , H01L2924/00
摘要： A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate.
摘要翻译： 公开了一种包括微电机麦克风的模块。 一个实施例提供了具有槽形凹部和微机电麦克风的基板。 微电机麦克风安装在基板的槽形凹部中。
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公开(公告)号：US20130187201A1
公开(公告)日：2013-07-25
申请号：US13358316
申请日：2012-01-25
申请人： Klaus Elian , Franz-Peter Kalz , Horst Theuss
发明人： Klaus Elian , Franz-Peter Kalz , Horst Theuss
CPC分类号： H01L29/84 , B81B2201/0235 , B81B2201/025 , B81B2201/0292 , B81B2203/0361 , B81C1/00246 , G01L1/20 , G01P15/124
摘要： A sensor device includes a semiconductor chip. The semiconductor chip has a sensing region sensitive to mechanical loading. A pillar is mechanically coupled to the sensing region.
摘要翻译： 传感器装置包括半导体芯片。 半导体芯片具有对机械负载敏感的感测区域。 支柱机械耦合到感测区域。
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公开(公告)号：US08399995B2
公开(公告)日：2013-03-19
申请号：US12355313
申请日：2009-01-16
申请人： Thorsten Scharf , Horst Theuss , Markus Leicht
发明人： Thorsten Scharf , Horst Theuss , Markus Leicht
CPC分类号： H01L21/561 , H01L23/3114 , H01L23/3185 , H01L24/28 , H01L24/73 , H01L2224/16105 , H01L2224/291 , H01L2224/29111 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/157 , H01L2924/181 , H01L2924/19043 , H01L2924/01023 , H01L2924/01028 , H01L2924/01083 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device includes a chip. The chip includes a single circuit element formed in a semiconductor substrate, a first metal layer on a first face of the semiconductor substrate, and a second metal layer on a second face of the semiconductor substrate opposite the first face. The first metal layer and the second metal layer are configured for accessing the single circuit element. A smaller of a first width of the first face of the semiconductor substrate and a second width of the first face of the semiconductor substrate perpendicular to the first width is less than or equal to a distance between an exposed face of the first metal layer parallel to the first face of the semiconductor substrate and an exposed face of the second metal layer parallel to the second face of the semiconductor substrate.
摘要翻译： 半导体器件包括芯片。 芯片包括形成在半导体衬底中的单个电路元件，在半导体衬底的第一面上的第一金属层和与第一面相对的第二面上的第二金属层。 第一金属层和第二金属层被配置为用于访问单个电路元件。 半导体衬底的第一面的第一宽度的较小值和垂直于第一宽度的半导体衬底的第一面的第二宽度小于或等于第一金属层的暴露面平行于 半导体衬底的第一面和第二金属层的暴露面平行于半导体衬底的第二面。
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