公开(公告)号：US20140318709A1

公开(公告)日：2014-10-30

申请号：US14363894

申请日：2012-12-10

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke Sato ,  Ryosuke Odaka

IPC: C09J9/02 ,  C09J4/00 ,  C09J133/14 ,  H01B13/00

CPC classification number: C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J7/22 ,  C09J7/35 ,  C09J9/02 ,  C09J11/04 ,  C09J133/14 ,  C09J2433/00 ,  H01B1/22 ,  H01B13/00 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0425

Abstract: There are provided an electrically conductive adhesive agent capable of providing good electrical continuity to a substrate to which a preflux treatment has been applied, and a method for connecting electronic components. The electrically conductive adhesive agent to be used includes a polymerizable acrylic compound, an organic peroxide, and the solder particles, the organic peroxide having a one minute half-life temperature lower than the solidus temperature of the solder particles. At the time of thermocompression bonding, the solder particles are crushed and an oxide film is removed, and a preflux layer on the surface of a bump is also removed by melting and flowing thereof, whereby electrical continuity is secured, and then an adhesive component is completely cured.

Abstract translation: 提供了一种导电粘合剂，其能够提供对已经施加了前处理的基底的良好的电连续性，以及用于连接电子部件的方法。 所使用的导电性粘合剂包括可聚合丙烯酸类化合物，有机过氧化物和焊料颗粒，有机过氧化物的半衰期比钎料的固相线温度低1分钟。 在热压接时，焊料颗粒被粉碎并除去氧化物膜，并且通过熔化和流动也可以消除凸起表面上的预过流层，从而确保电连续性，然后将粘合剂组分 完全治愈

公开(公告)号：US09752058B2

公开(公告)日：2017-09-05

申请号：US14363894

申请日：2012-12-10

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke Sato ,  Ryosuke Odaka

IPC: C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/32 ,  H05K3/36 ,  C09J133/14 ,  H01B13/00 ,  C09J7/02

CPC classification number: C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J7/22 ,  C09J7/35 ,  C09J9/02 ,  C09J11/04 ,  C09J133/14 ,  C09J2433/00 ,  H01B1/22 ,  H01B13/00 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0425

Abstract: There are provided an electrically conductive adhesive agent capable of providing good electrical continuity to a substrate to which a preflux treatment has been applied, and a method for connecting electronic components. The electrically conductive adhesive agent to be used includes a polymerizable acrylic compound, an organic peroxide, and the solder particles, the organic peroxide having a one minute half-life temperature lower than the solidus temperature of the solder particles. At the time of thermocompression bonding, the solder particles are crushed and an oxide film is removed, and a preflux layer on the surface of a bump is also removed by melting and flowing thereof, whereby electrical continuity is secured, and then an adhesive component is completely cured.

公开(公告)号：US09426896B2

公开(公告)日：2016-08-23

申请号：US14278810

申请日：2014-05-15

Applicant: Dexerials Corporation

Inventor： Daisuke Sato ,  Junichi Nishimura ,  Ryosuke Odaka

IPC: H05K3/30 ,  C09J7/02 ,  C09J163/00 ,  H01L23/00 ,  C08K3/00

CPC classification number: H05K3/30 ,  C08K3/01 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/134 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29366 ,  H01L2224/29386 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K3/305 ,  H05K2201/0195 ,  H05K2201/0209 ,  Y02P70/613 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: To provide an insulating resin film, which contains: a first adhesive layer; and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.

Abstract translation: 提供绝缘树脂膜，其包含：第一粘合剂层; 和第二粘合剂层，其中所述绝缘树脂膜被构造成将基板和电子部件结合在一起，并且所述第一粘合层设置在所述基板的一侧，并且所述第二粘合层设置在所述电子部件的一侧 其中，所述第一粘合剂层和所述第二粘合剂层各自含有无机填料，其中所述第二粘合剂层具有比所述第一粘合剂层的DSC放热峰值温度高的DSC放热峰值温度，并且其中所述第一粘合剂的厚度 层是绝缘树脂膜的总厚度的50％至90％。

公开(公告)号：US20140352888A1

公开(公告)日：2014-12-04

申请号：US14364026

申请日：2012-12-10

Applicant: DEXERIALS CORPORATION

Inventor： Ryosuke Odaka ,  Daisuke Sato

IPC: C09J4/00

CPC classification number: C09J4/00 ,  C08F220/32 ,  C09J4/06 ,  C09J163/10 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221

Abstract: Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent including a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C. or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal.

Abstract translation: 提供一种能够对已经施加了前路处理的基板提供足够的电连续性的粘合剂和用于连接电子部件的方法。 使用包含一分子中具有环氧基的（甲基）丙烯酸酯和1分钟半衰期为110℃以上的自由基聚合引发剂的粘合剂。 端子之间的多余的粘合剂成分流动，由此从外表面除去预流中的咪唑成分，与环氧基丙烯酸酯的环氧基结合的成分。