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1.发明申请公开(公告)号：US20130271920A1
公开(公告)日：2013-10-17
申请号：US13445385
申请日：2012-04-12
CPC分类号： H01L23/3672 , H01L2924/0002 , H05K7/2039 , H05K7/20409 , Y10T29/49826 , H01L2924/00
摘要： Electronic devices incorporating a heat dissipation feature include an enclosure, and at least one heat-generating component positioned within the enclosure. The heat dissipation feature is sufficiently coupled to the at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component. The heat dissipation feature includes a plurality of protrusions exposed externally to the enclosure. A thermally insulating material may be disposed on at least a tip portion of at least some of the protrusions. The thermally insulating material is selected to provide a touch temperature that is below a predetermined threshold. In some instances, the thermally insulating material can provide such a touch temperature by selecting the material to include properties for thermal conductivity (k), density (ρ), and specific heat (Cp) such that the product of k*ρ*Cp results in a value less than a product of k*ρ*Cp for human skin.
摘要翻译： 结合散热特征的电子设备包括外壳，以及至少一个定位在外壳内的发热元件。 散热特征与至少一个发热部件充分耦合，以便于来自发热部件的传导热传递。 散热特征包括暴露在外壳外部的多个突起。 绝热材料可以设置在至少一些突起的至少一个尖端部分上。 选择绝热材料以提供低于预定阈值的触摸温度。 在某些情况下，绝热材料可以通过选择材料来提供这样的触摸温度，以包括热导率（k），密度（rho）和比热（Cp）的性质，使得k * rho * Cp的结果结果 其值小于人皮肤的k * rho * Cp的乘积。
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2.发明授权公开(公告)号：US09165854B2
公开(公告)日：2015-10-20
申请号：US13445385
申请日：2012-04-12
IPC分类号： H05K7/20 , H01L23/373 , H01L23/367
CPC分类号： H01L23/3672 , H01L2924/0002 , H05K7/2039 , H05K7/20409 , Y10T29/49826 , H01L2924/00
摘要： Electronic devices incorporating a heat dissipation feature include an enclosure, and at least one heat-generating component positioned within the enclosure. The heat dissipation feature is sufficiently coupled to the at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component. The heat dissipation feature includes a plurality of protrusions exposed externally to the enclosure. A thermally insulating material may be disposed on at least a tip portion of at least some of the protrusions. The thermally insulating material is selected to provide a touch temperature that is below a predetermined threshold. In some instances, the thermally insulating material can provide such a touch temperature by selecting the material to include properties for thermal conductivity (k), density (ρ), and specific heat (Cp) such that the product of k*ρ*Cp results in a value less than a product of k*ρ*Cp for human skin.
摘要翻译： 结合散热特征的电子设备包括外壳，以及至少一个定位在外壳内的发热元件。 散热特征与至少一个发热部件充分耦合，以便于来自发热部件的传导热传递。 散热特征包括暴露在外壳外部的多个突起。 绝热材料可以设置在至少一些突起的至少一个尖端部分上。 选择绝热材料以提供低于预定阈值的触摸温度。 在一些情况下，绝热材料可以通过选择材料来提供这样的触摸温度，以包括热导率（k），密度（＆rgr）和比热（Cp）的性质，使得k *＆rgr; * Cp导致小于人类皮肤的k *＆rgr; * Cp的乘积的值。
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3.发明申请ENHANCED PACKAGE THERMAL MANAGEMENT USING EXTERNAL AND INTERNAL CAPACITIVE THERMAL MATERIAL 有权使用外部和内部电容热材料的增强型封装热管理公开(公告)号：US20130270721A1
公开(公告)日：2013-10-17
申请号：US13448711
申请日：2012-04-17
CPC分类号： H01L23/4275 , H01L23/4334 , H01L2224/16145 , H01L2224/16225 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311
摘要： An apparatus has external and/or internal capacitive thermal material for enhanced thermal package management. The apparatus includes an integrated circuit (IC) package having a heat generating device. The apparatus also includes a heat spreader having a first side that is attached to the IC package. The apparatus also includes capacitive thermal material reservoirs contacting the first side of the heat spreader. The capacitive thermal material reservoirs may be disposed laterally relative to the heat generating device.
摘要翻译： 一种具有用于增强热封装管理的外部和/或内部电容热材料的装置。 该装置包括具有发热装置的集成电路（IC）封装。 该装置还包括具有附接到IC封装的第一侧的散热器。 该装置还包括接触散热器第一侧的电容式热材料储存器。 电容热材料储存器可以相对于发热装置横向设置。
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公开(公告)号：US07778030B1
公开(公告)日：2010-08-17
申请号：US12471358
申请日：2009-05-23
申请人： Victor A. Chiriac
发明人： Victor A. Chiriac
CPC分类号： H05K7/20172 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A system (50) includes a material layer (52) having an opening (62) extending through it and a pumping device (54) positioned behind the layer (52). A target element (56) is positioned in front of the material layer (52). In a partial cooling mode (124), the pumping device (54) drives a jet (134) of coolant through the opening (62) toward the target (56). Transducers (58, 60), positioned at opposing ends of the opening (62), produce output signals (130, 132) that perturb the jet (134) to partially control its oscillation. The jet (134) spreads from a location (96) on the target element (56) in one direction (142) to provide uniform cooling over a portion (126) of the target element (56) in the direction (142), and the jet (134) non-uniformly spreads in another direction (144) to provide non-uniform cooling over a portion (128) of the target element (56) in the other direction (144).
摘要翻译： 系统（50）包括具有延伸穿过其的开口（62）的材料层（52）和位于层（52）之后的泵送装置（54）。 目标元件（56）位于材料层（52）的前面。 在部分冷却模式（124）中，泵送装置（54）通过开口（62）驱动冷却剂喷射器（134）朝向目标（56）。 定位在开口（62）的相对端的传感器（58,60）产生扰动射流（134）以部分地控制其振荡的输出信号（130,132）。 射流（134）在一个方向（142）上从目标元件（56）上的位置（96）扩散，以在目标元件（56）的方向（142）上的一部分（126）上均匀地冷却，以及 射流（134）在另一方向（144）上不均匀地展开，以在另一方向（144）上的目标元件（56）的一部分（128）上提供不均匀的冷却。
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公开(公告)号：US20100053894A1
公开(公告)日：2010-03-04
申请号：US12201932
申请日：2008-08-29
申请人： Victor A. Chiriac
发明人： Victor A. Chiriac
CPC分类号： G06F1/20 , G06F1/206 , H01L23/467 , H01L23/4735 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： A system (50) for cooling a target element (56) includes a structure (52) having an opening (62) extending through the layer (52), a pumping device (32) positioned behind the structure (52), and a target element (56) positioned in front of the structure (52). Transducers (58, 60) are positioned at opposing ends (74, 76) of the opening (62) between the structure (52) and the target element (56). The pumping device (32) drives a jet (70) of coolant through the opening (62) toward the target element (56). The transducers (58, 60) produce output signals (84, 86) that perturb the jet (70) to control oscillation of the jet (70) in order to stabilize the jet (70) for impingement with a predetermined location (96) on the target element (56). The jet (70) uniformly spreads from the location (96) to provide cooling over a surface (100) of the target element (56).
摘要翻译： 用于冷却目标元件（56）的系统（50）包括具有延伸穿过层（52）的开口（62）的结构（52），位于结构（52）后面的泵送装置（32） 元件（56）位于结构（52）的前面。 传感器（58,60）位于结构（52）和目标元件（56）之间的开口（62）的相对端（74,76）处。 泵送装置（32）通过开口（62）朝向目标元件（56）驱动冷却剂的喷射（70）。 换能器（58,60）产生扰动射流（70）以控制射流（70）的振荡的输出信号（84,86），以便稳定用于与预定位置（96）相撞的射流（70） 目标元件（56）。 射流（70）从位置（96）均匀地扩散，以在目标元件（56）的表面（100）上提供冷却。
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6.发明申请Methods and apparatus for a semiconductor device package with improved thermal performance 有权具有改善的热性能的半导体器件封装的方法和装置公开(公告)号：US20070284704A1
公开(公告)日：2007-12-13
申请号：US11450070
申请日：2006-06-09
IPC分类号： H01L23/495
CPC分类号： H01L23/36 , H01L21/568 , H01L23/3677 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/83 , H01L2224/04105 , H01L2224/24227 , H01L2224/2919 , H01L2224/32057 , H01L2224/48091 , H01L2224/48227 , H01L2224/73267 , H01L2224/83191 , H01L2224/83385 , H01L2224/838 , H01L2224/92 , H01L2224/92244 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15747 , H01L2924/181 , H01L2224/83 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package assembly 200 includes a semiconductor die (e.g., an RF power amplifier) 208 fixed within the cavity of a conductive leadframe 204 using a thermally and electrically-conductive adhesive material 209. The semiconductor die 209 has a first side and a second side, wherein the first side includes at least one active area, and the second side includes at least one contact region. The conductive leadframe (e.g., a copper leadframe) 204 has two planar surfaces and a cavity formed therein. The adhesive material 209 is configured to couple the semiconductor die 208 within the cavity of the conductive leadframe 204 such that the first side of the semiconductor die is substantially coplanar with the first surface of the conductive leadframe.
摘要翻译： 封装组件200包括使用导热粘合材料209固定在导电引线框架204的腔内的半导体管芯（例如，RF功率放大器）208。 半导体管芯209具有第一侧和第二侧，其中第一侧包括至少一个有效区域，而第二侧面包括至少一个接触区域。 导电引线框架（例如，铜引线框架）204具有两个平面表面和其中形成的空腔。 粘合剂材料209被配置为将半导体管芯208耦合在导电引线框架204的空腔内，使得半导体管芯的第一侧基本上与导电引线框架的第一表面共面。
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7.发明授权Structure and method of thermally protecting power devices for airbag deployment 有权用于安全气囊部署的热保护功率装置的结构和方法公开(公告)号：US06906900B2
公开(公告)日：2005-06-14
申请号：US10324219
申请日：2002-12-19
CPC分类号： B60R21/0173 , H02H5/044
摘要： System and method protects power drivers (10) and (12) that are used for airbag deployment. Temperature sensors (38) are strategically located on the integrated circuit (36) to detect temperature levels in power drivers (10) and (12). When the temperature in the power drivers (10) and (12) reaches a maximum level, an output is provided to logic block (26). Current detecting circuit (24) provides an output when the current flowing in power driver (10) reaches a desired level. Timing circuit (28) is activated when it receives the output from current detecting circuit (24). At the expiration of the time, timing circuit (28) provides an output to logic block (26). When logic block (26) receives both outputs, logic block (26) shuts drivers (10) and (12) down. When temperature sensors (38) detects that the temperature in integrated circuit (36) has reached a minimum level, logic block (26) reactivates drivers (10) and (12).
摘要翻译： 系统和方法保护用于安全气囊部署的电源驱动器（10）和（12）。 温度传感器（38）在策略上位于集成电路（36）上以检测电力驱动器（10）和（12）中的温度水平。 当功率驱动器（10）和（12）中的温度达到最大值时，向逻辑块（26）提供输出。 电流检测电路（24）在电力驱动器（10）中流动的电流达到期望水平时提供输出。 定时电路（28）在接收到电流检测电路（24）的输出时被激活。 在时间到期时，定时电路（28）向逻辑块（26）提供输出。 当逻辑块（26）接收到两个输出时，逻辑块（26）关闭驱动器（10）和（12）。 当温度传感器（38）检测到集成电路（36）中的温度已经达到最小值时，逻辑块（26）重启驱动器（10）和（12）。
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公开(公告)号：US06418016B1
公开(公告)日：2002-07-09
申请号：US09765182
申请日：2001-01-18
申请人： Victor A. Chiriac , Tien-Yu Tom Lee
发明人： Victor A. Chiriac , Tien-Yu Tom Lee
IPC分类号： H05K720
CPC分类号： G06F1/20 , Y10S165/908
摘要： A system and method for cooling are disclosed. The system for cooling includes an opening out of which a jet of coolant can flow, a target element, and a forcing device which causes the jet of coolant to flow out of the opening. The target element is positioned in front of the opening so that the jet of coolant, when flowing out of the opening, is directed toward the target element. The jet of coolant oscillates so that the jet of coolant sweeps across the target element and cools a variety of different locations along the target element.
摘要翻译： 公开了一种用于冷却的系统和方法。 用于冷却的系统包括冷却剂流可以流过的开口，目标元件和使冷却剂射流从开口流出的迫使装置。 目标元件位于开口的前面，使得当流出开口时冷却剂的射流朝向目标元件。 冷却剂喷射器振荡，使得喷射的冷却剂扫过目标元件并冷却沿着目标元件的各种不同位置。
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9.发明申请ON-CHIP THERMAL MANAGEMENT TECHNIQUES USING INTER-PROCESSOR TIME DEPENDENT POWER DENSITY DATA FOR INDENTIFICATION OF THERMAL AGGRESSORS 有权片上热管理技术使用相互处理器时间相关的功率密度数据来识别热老化机公开(公告)号：US20130079946A1
公开(公告)日：2013-03-28
申请号：US13290456
申请日：2011-11-07
CPC分类号： G06F1/3228 , G06F1/203 , G06F1/206 , G06F1/324 , G06F1/3287 , G06F1/329 , G06F9/5083 , G06F9/5094 , G06F11/3058 , G06F2209/508 , Y02D10/12 , Y02D10/126 , Y02D10/16 , Y02D10/171 , Y02D10/22 , Y02D10/24 , Y02D10/28
摘要： Various embodiments of methods and systems for controlling and/or managing thermal energy generation on a portable computing device are disclosed. Data discarded from one or more processing core registers may be monitored and analyzed to deduce individual workloads that have been processed by each of the cores over a unit of time. From the deduced workloads, the power consumed by each of the cores over the unit of time in order to process the workload can be calculated. Subsequently, a time dependent power density map can be created which reflects a historical and near real time power consumption for each core. Advantageously, because power consumption can be correlated to thermal energy generation, the TDPD map can be leveraged to identify thermal aggressors for targeted, fine grained application of thermal mitigation techniques. In some embodiments, workloads may be reallocated from the identified thermal aggressors to the identified underutilized processing components.
摘要翻译： 公开了用于在便携式计算设备上控制和/或管理热能产生的方法和系统的各种实施例。 可以监视和分析从一个或多个处理核心寄存器丢弃的数据，以推导出由单个时间段内的每个核处理的各个工作负载。 从推导的工作负载中，可以计算出每个核心在一段时间内消耗的功率以处理工作负载。 随后，可以创建反映每个核心的历史和接近实时功率消耗的时间依赖功率密度图。 有利的是，由于能量消耗可以与热能产生相关联，所以可以利用TDPD图来识别用于热缓解技术的目标细粒度应用的热攻击者。 在一些实施例中，工作负载可以从所识别的热攻击者重新分配到所识别的未充分利用的处理组件。
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公开(公告)号：US07821787B2
公开(公告)日：2010-10-26
申请号：US12201932
申请日：2008-08-29
申请人： Victor A. Chiriac
发明人： Victor A. Chiriac
CPC分类号： G06F1/20 , G06F1/206 , H01L23/467 , H01L23/4735 , H01L2924/0002 , Y10S165/908 , H01L2924/00
摘要： A system (50) for cooling a target element (56) includes a structure (52) having an opening (62) extending through the layer (52), a pumping device (32) positioned behind the structure (52), and a target element (56) positioned in front of the structure (52). Transducers (58, 60) are positioned at opposing ends (74, 76) of the opening (62) between the structure (52) and the target element (56). The pumping device (32) drives a jet (70) of coolant through the opening (62) toward the target element (56). The transducers (58, 60) produce output signals (84, 86) that perturb the jet (70) to control oscillation of the jet (70) in order to stabilize the jet (70) for impingement with a predetermined location (96) on the target element (56). The jet (70) uniformly spreads from the location (96) to provide cooling over a surface (100) of the target element (56).
摘要翻译： 用于冷却目标元件（56）的系统（50）包括具有延伸穿过层（52）的开口（62）的结构（52），位于结构（52）后面的泵送装置（32） 元件（56）位于结构（52）的前面。 传感器（58,60）位于结构（52）和目标元件（56）之间的开口（62）的相对端（74,76）处。 泵送装置（32）通过开口（62）朝向目标元件（56）驱动冷却剂的喷射（70）。 换能器（58,60）产生扰动射流（70）以控制射流（70）的振荡的输出信号（84,86），以便稳定用于与预定位置（96）相撞的射流（70） 目标元件（56）。 射流（70）从位置（96）均匀地扩散，以在目标元件（56）的表面（100）上提供冷却。
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