公开(公告)号：US06930373B2

公开(公告)日：2005-08-16

申请号：US10649839

申请日：2003-08-27

申请人： Gerd Auerswald ,  Kurt Gross ,  Michael Kirchberger ,  Stefan Kulig ,  Hans Rappl

发明人： Gerd Auerswald ,  Kurt Gross ,  Michael Kirchberger ,  Stefan Kulig ,  Hans Rappl

IPC分类号： H01L23/36 ,  H01L25/16 ,  H01L29/201

CPC分类号： H01L25/162 ,  H01L23/36 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/13055 ,  H01L2924/19041 ,  H01L2224/45099

摘要： The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K1) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.

摘要翻译： 该电路具有功率级（LE），其中发热组件安装在至少一个组件上，该组件在内部区域中产生较少的热量。 发热部件与以电绝缘方式安装在冷却体（KK）上的至少一个导电金属体（K 1）连接，以冷却部件。 冷却体包围内部区域。

公开(公告)号：US06723926B2

公开(公告)日：2004-04-20

申请号：US10134929

申请日：2002-04-29

申请人： Kurt Gross ,  Volker Karrer ,  Michael Kirchberger ,  Stefan Kulig ,  Gunter Ludwig ,  Hans Rappl

发明人： Kurt Gross ,  Volker Karrer ,  Michael Kirchberger ,  Stefan Kulig ,  Gunter Ludwig ,  Hans Rappl

IPC分类号： H05K100

CPC分类号： H05K3/284 ,  H02K11/01 ,  H02K11/33 ,  H05K1/0298 ,  H05K1/182 ,  H05K1/184 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/326 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/10015 ,  H05K2203/168

摘要： A mounting configuration of electric and/or electronic components, in particular electrolytic capacitors, on a printed circuit board is described. The printed circuit board is formed by at least two metallic plates insulated electrically from one another by an insulating layer that preferably conducts heat well and has holes for the connecting pins of the electric and/or electronic components. Through which holes the connecting pins are plugged and connected electrically to the respectively associated metallic plate.

摘要翻译： 描述了印刷电路板上的电气和/或电子部件，特别是电解电容器的安装配置。 印刷电路板由至少两个金属板形成，所述至少两个金属板通过绝缘层彼此电绝缘，所述绝缘层优选地传导良好热量并且具有用于电气和/或电子部件的连接销的孔。 通过这些孔，连接销被插入并电连接到相应的金属板。

公开(公告)号：US06864579B2

公开(公告)日：2005-03-08

申请号：US10057154

申请日：2002-01-25

申请人： Kurt Gross ,  Hans Rappl

发明人： Kurt Gross ,  Hans Rappl

IPC分类号： H01L21/60 ,  H01L23/492 ,  H01L23/50 ,  H01L21/58 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L24/83 ,  H01L23/492 ,  H01L24/32 ,  H01L2224/04026 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07811

摘要： A carrier has a metal area that is essentially composed of copper. A chip has a rear side metallization layer. A buffer layer, essentially composed of nickel and having a thickness of between 5 μm and 10 μm, is arranged on the metal area. The chip does not have a chip housing and is arranged on the metal area, which has been provided with the buffer layer, such that only one connecting medium is arranged between the rear side metallization layer of the chip and the buffer layer.

摘要翻译： 载体具有基本上由铜组成的金属区域。 芯片具有后侧金属化层。 在金属区域上布置有基本上由镍构成的厚度为5μm和10μm之间的缓冲层。 芯片不具有芯片壳体，并且布置在已经设置有缓冲层的金属区域上，使得在芯片的后侧金属化层和缓冲层之间仅设置一个连接介质。

公开(公告)号：US07120033B2

公开(公告)日：2006-10-10

申请号：US10196027

申请日：2002-07-16

申请人： Kurt Gross ,  Hans Rappl

发明人： Kurt Gross ,  Hans Rappl

IPC分类号： H05K7/10

CPC分类号： H01L23/13 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/308 ,  H05K3/44 ,  H05K2201/1025 ,  H05K2201/10416 ,  H05K2201/1059 ,  Y10T29/49147 ,  Y10T29/49153 ,  H01L2924/00

摘要： An electrically conducting bonding connection (B) is produced between an electronic circuit (S) arranged on an electrically conducting support plate (1) and the support plate (1) by providing a hole (4, 5), into which an electrically conducting bonding element (2) with a bondable surface (3) is pressed in such a way that the support plate (1) and the bonding element (2) enter into an electrically conducting and frictional connection; the bonding connection is subsequently produced with the bonding element (2).

摘要翻译： 在布置在导电支撑板（1）的电子电路（S）和支撑板（1）之间通过提供一个孔（4,5）而产生导电接合连接（B） 具有可粘合表面（3）的元件（2）以支撑板（1）和接合元件（2）进入导电和摩擦连接的方式被按压; 随后用接合元件（2）产生接合连接。

公开(公告)号：US20070235732A1

公开(公告)日：2007-10-11

申请号：US11675962

申请日：2007-02-16

申请人： Silvia Gohlke ,  Sieglinde Kraus ,  Hans Rappl ,  Gunther Rauscher

发明人： Silvia Gohlke ,  Sieglinde Kraus ,  Hans Rappl ,  Gunther Rauscher

IPC分类号： H01L29/06

CPC分类号： H01L24/48 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L41/0475 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/78301 ,  H01L2224/83801 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85951 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/83205

摘要： An electrical arrangement has a first electrically conductive contact point (10) and a second electrically conductive contact point (20), the first and the second contact point being arranged at a distance (x) from one another and being electrically connected to one another via a wire connection arrangement (30), the wire connection arrangement (30) being formed by at least two wire connections (31-1, 31-2, . . . , 31-n-1, 31-n) which have respectively a first end (32-1, 32-1, 32-n-1, 32-n) and a second end (33-1, 33-2, . . . , 33-n-1, 33-3), and the first end of a wire connection (30-2, . . . , 30-n) and the second end of a preceding wire connection (30-1, . . . , 30-n-1) being in direct contact with one another.

摘要翻译： 电气布置具有第一导电接触点（10）和第二导电接触点（20），所述第一和第二接触点彼此间隔（x）设置并彼此电连接通过 电线连接装置（30），所述电线连接装置（30）由至少两个电线连接（31-1,31-2，...，31-n，31-n）形成，所述电线连接装置分别具有 第一端（32-1,32-1,32-n-1，32-n）和第二端（33-1,33-2，...，33-n-1,33-3）和 电线连接（30-2，...，30-n）的第一端和前一线连接（30-1，...，30-n-1）的第二端与一个 另一个。