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公开(公告)号：US08065794B2
公开(公告)日：2011-11-29
申请号：US12239306
申请日：2008-09-26
申请人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
发明人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.
摘要翻译： 本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔 并且可以实现高可靠性的导体连接而不退火。 本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属 层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀 以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。
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公开(公告)号：US20090145652A1
公开(公告)日：2009-06-11
申请号：US12239306
申请日：2008-09-26
申请人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
发明人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.
摘要翻译： 本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔 并且可以实现高可靠性的导体连接而不退火。 本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属 层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀 以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。
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公开(公告)号：US07827680B2
公开(公告)日：2010-11-09
申请号：US10751428
申请日：2004-01-06
申请人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
发明人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
IPC分类号： H05K3/20
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10-12 seconds.
摘要翻译： 描述了对导电基板进行电镀的电镀工艺。 该工艺包括通过在阴极和阳极之间重复施加电压并使阴极和阳极之间的电压中断，在阳极和阴极之间以恒定电压将衬底表面作为阴极和电镀金属作为阳极间歇地电镀到预定的镀层厚度 交替应用。 描述了电压时间/中断时间比为0.1至1.0，电压时间不长于10秒，并且中断时间不小于1×10-12秒。
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公开(公告)号：US07691189B2
公开(公告)日：2010-04-06
申请号：US11736495
申请日：2007-04-17
申请人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
发明人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.
摘要翻译： 本发明涉及一种制造多层印刷电路板的方法，该印刷电路板能够同时通孔填充和形成导体电路和具有良好结晶度的通孔，并且可以在基板和高密度布线上构造均匀的沉积 并且可以实现高可靠性的导体连接而不退火。
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公开(公告)号：US20070266886A1
公开(公告)日：2007-11-22
申请号：US11736495
申请日：2007-04-17
申请人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
发明人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
IPC分类号： C09D5/00
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.
摘要翻译： 本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔 并且可以实现高可靠性的导体连接而不退火。 本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属 层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀 以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。
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公开(公告)号：US07230188B1
公开(公告)日：2007-06-12
申请号：US09787139
申请日：1999-09-14
申请人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
发明人： Honchin En , Tohru Nakai , Takeo Oki , Naohiro Hirose , Kouta Noda
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.
摘要翻译： 本发明的目的是提供一种制造多层印刷电路板的方法，其能够同时通孔填充和形成导体电路，并且可以在基板和高密度布线上构造具有良好结晶度和均匀沉积的通孔 并且可以实现高可靠性的导体连接而不退火。 本发明涉及一种多层印刷电路板的制造方法，其特征在于，在形成有导体电路的基板上设置层间树脂绝缘层，在所述层间树脂绝缘层上形成用于形成通孔的开口，形成无电镀金属 层，在其上设置抗蚀剂，进行电镀，剥离抗蚀剂并蚀刻无电镀金属层以提供导体电路和通孔，其中使用所述无电镀金属层作为阴极间歇地进行电镀 以及在所述阳极和所述阴极之间的恒定电压下的电镀金属作为阳极。
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公开(公告)号：US08148643B2
公开(公告)日：2012-04-03
申请号：US11875486
申请日：2007-10-19
申请人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
发明人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
IPC分类号： H05K1/03
CPC分类号： H05K3/4652 , B23K26/389 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K1/0201 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/0055 , H05K3/0094 , H05K3/108 , H05K3/28 , H05K3/381 , H05K3/383 , H05K3/384 , H05K3/427 , H05K3/4602 , H05K3/4623 , H05K3/4661 , H05K2201/0195 , H05K2201/0352 , H05K2201/0358 , H05K2201/062 , H05K2201/09536 , H05K2201/0959 , H05K2201/09827 , H05K2201/09863 , H05K2201/09881 , H05K2203/0307 , H05K2203/0353 , H05K2203/0554 , H05K2203/0773 , H05K2203/107 , H05K2203/121 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.
摘要翻译： 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。
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公开(公告)号：US20120125680A1
公开(公告)日：2012-05-24
申请号：US13357663
申请日：2012-01-25
申请人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
发明人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
CPC分类号： H05K3/4652 , B23K26/389 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K1/0201 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/0055 , H05K3/0094 , H05K3/108 , H05K3/28 , H05K3/381 , H05K3/383 , H05K3/384 , H05K3/427 , H05K3/4602 , H05K3/4623 , H05K3/4661 , H05K2201/0195 , H05K2201/0352 , H05K2201/0358 , H05K2201/062 , H05K2201/09536 , H05K2201/0959 , H05K2201/09827 , H05K2201/09863 , H05K2201/09881 , H05K2203/0307 , H05K2203/0353 , H05K2203/0554 , H05K2203/0773 , H05K2203/107 , H05K2203/121 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be prevented. Thus, the reliability of the connection of the via holes can be improved.
摘要翻译： 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以防止通孔的连接的可靠性。 因此，可以提高通孔连接的可靠性。
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公开(公告)号：US07832098B2
公开(公告)日：2010-11-16
申请号：US12098582
申请日：2008-04-07
申请人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
发明人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
IPC分类号： H01K3/10
CPC分类号： H05K3/4652 , B23K26/389 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K1/0201 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/0055 , H05K3/0094 , H05K3/108 , H05K3/28 , H05K3/381 , H05K3/383 , H05K3/384 , H05K3/427 , H05K3/4602 , H05K3/4623 , H05K3/4661 , H05K2201/0195 , H05K2201/0352 , H05K2201/0358 , H05K2201/062 , H05K2201/09536 , H05K2201/0959 , H05K2201/09827 , H05K2201/09863 , H05K2201/09881 , H05K2203/0307 , H05K2203/0353 , H05K2203/0554 , H05K2203/0773 , H05K2203/107 , H05K2203/121 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.
摘要翻译： 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。
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公开(公告)号：US07415761B2
公开(公告)日：2008-08-26
申请号：US10356464
申请日：2003-02-03
申请人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
发明人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
IPC分类号： H01K3/10
CPC分类号： H05K3/4652 , B23K26/389 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K1/0201 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/0055 , H05K3/0094 , H05K3/108 , H05K3/28 , H05K3/381 , H05K3/383 , H05K3/384 , H05K3/427 , H05K3/4602 , H05K3/4623 , H05K3/4661 , H05K2201/0195 , H05K2201/0352 , H05K2201/0358 , H05K2201/062 , H05K2201/09536 , H05K2201/0959 , H05K2201/09827 , H05K2201/09863 , H05K2201/09881 , H05K2203/0307 , H05K2203/0353 , H05K2203/0554 , H05K2203/0773 , H05K2203/107 , H05K2203/121 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.
摘要翻译： 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。
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