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公开(公告)号：US20220204442A1
公开(公告)日：2022-06-30
申请号：US17138254
申请日：2020-12-30
Applicant: Industrial Technology Research Institute
Inventor： Jyh-Long JENG , Jeng-Yu TSAI , Wei-Ta YANG
IPC: C07C271/58 , C08G18/34 , C08G18/78
Abstract: A compound, a resin composition and a laminated substrate thereof are provided. The compound has a structure represented by Formula (I) wherein A1 is C24-48 alkylene group, C24-48 alkenylene group, C24-48 alkynylene group, C24-48 alicyclic alkylene group, C24-48 alicyclic alkenylene group, or C24-48 alicyclic alkynylene group. A2 is C2-12 alkylene group, C6-C25 arylene group with two reactive groups, C4-8 cycloalkylene group, C5-25 heteroarylene group, divalent C7-C25 alkylaryl group, divalent C7-25 acylaryl group, divalent C6-25 aryl ether group, or divalent C7-25 acyloxyaryl group; and, n≥1.
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公开(公告)号：US20180179424A1
公开(公告)日：2018-06-28
申请号：US15656652
申请日：2017-07-21
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Jyh-Long JENG , Jeng-Yu TSAI , Hsi-Yi CHIN , Wei-Ta YANG
IPC: C09J171/12 , C09J153/00 , H05K1/02 , H05K1/03 , H05K1/09 , B32B7/12 , B32B15/08
CPC classification number: C09J171/12 , B32B7/12 , B32B15/08 , B32B2457/08 , C08F283/06 , C08F287/00 , C08F290/062 , C08G59/5073 , C09J151/085 , C09J153/00 , C09J153/005 , H05K1/028 , H05K1/032 , H05K1/0393 , H05K1/09 , H05K2201/0129 , H05K2201/0133 , H05K2201/0141 , C08L53/02 , C08L63/00 , C08F220/40
Abstract: An adhesive composition and a composite substrate employing the same are provided. The adhesive composition includes a compound having a structure represented by Formula (I) (Z—Y3X Formula (I) , wherein X is R can be hydrogen, or C1-6 alkyl group; each Y can be independently a moiety polymerized by at least two different phenol-based compounds; and each Z can be independently hydrogen, acryloyl group, allyl group, vinylbenzyl group, epoxypropyl group, methylacryloyl group, propargyl group, or cyanoallyl group; a thermoplastic elastomer; an epoxy resin; and a bismaleimide.
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公开(公告)号：US20240238911A1
公开(公告)日：2024-07-18
申请号：US18512534
申请日：2023-11-17
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Yi-Chi YANG , Jyh-Long JENG
CPC classification number: B23K35/025 , B22F1/052 , B22F1/102 , B22F1/103 , B22F3/10 , H01B1/22 , B22F2301/255 , B22F2302/45 , B22F2304/10 , B22F2999/00
Abstract: A conductive composition, conductive layer and electronic device employing the same are provided. The conductive composition includes 3-7 parts by weight of a component (A) and 93-97 parts by weight of a component (B). The component (A) is an epoxy compound, wherein the epoxy compound is a compound having at least one glycidyloxycarbonyl group. The component (B) includes a first metal particle, wherein the first metal particle has a particle size distribution D90 that is less than or equal to 1 μm. The total weight of the component (A) and component (B) is 100 parts by weight.
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公开(公告)号：US20240209154A1
公开(公告)日：2024-06-27
申请号：US18184034
申请日：2023-03-15
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Chen-Kuang CHIANG , Jyh-Long JENG , Hsiang-Yen TSAO
CPC classification number: C08G77/045 , C08K5/005 , C09K5/10
Abstract: A polymer is formed by reacting a terminating agent with a star polymer. The star polymer is formed by reacting a core molecule with a hydroxy terminated silicone oil. The core molecule includes a plurality of alkoxysilyl groups, a plurality of hydroxysilyl groups, or a combination thereof. The polymer can be mixed with antioxidant and metal deactivator to form a dielectric fluid, which can be used in a cooling system.
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公开(公告)号：US20230201975A1
公开(公告)日：2023-06-29
申请号：US17745131
申请日：2022-05-16
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Shou-Yi HO , Jyh-Long JENG
CPC classification number: B23K35/025 , B23K35/262 , B23K2103/08
Abstract: A solder ball with a concave-convex structure is provided. The solder ball with a concave-convex structure includes tin-bismuth alloy including a plurality of concave portions and convex portions on its surface. The height difference between the concave portions and the convex portions is between about 10 nanometers and about 200 nanometers. The proportion of tin in the tin-bismuth alloy is between about 28% and about 52%. A method for preparing the solder ball with a concave-convex structure is also provided.
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Patent Agency Ranking
公开(公告)号：US20240228854A1
公开(公告)日：2024-07-11
申请号：US18180609
申请日：2023-03-08
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Hsiang-Yen TSAO , Hui-Wen CHANG , Jyh-Long JENG
Abstract: A polymer is formed by reacting (a) benzaldazine compound with (b1) diamine compound, (b2) dianhydride compound, (b3) epoxy resin, or a combination thereof, wherein (a) benzaldazine compound has a chemical structure of
in which R1 is —NH2, —OH, or
The polymer can be combined with inorganic powder to form a thermal interface material.-
公开(公告)号：US20230101144A1
公开(公告)日：2023-03-30
申请号：US17888269
申请日：2022-08-15
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Yi-Syuan WANG , Jeng-Yu TSAI , Chi-En KUAN , Jyh-Long JENG , Chih-Ming HU , Chen-Hsi CHENG
IPC: C08G73/10 , C08J5/18 , C07D307/89
Abstract: An anhydride compound, polyimide, and thin film are provided. The anhydride compound has a chemical structure of wherein R1 is each of R4 is independently C1-6 alkylene group, m is an integer of 0 to 10, and m′ is an integer of 1 to 10; n is an integer of 1 to 10, each of R2 is independently hydrogen, saturated or unsaturated C1-6 hydrocarbon group, CF3, silanol group, silyl group, or Al(OH)3; and R3 is silanol group, silyl group, or Al(OH)3. The anhydride compound can be reacted with a diamine compound to form a polyimide.
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公开(公告)号：US20220204697A1
公开(公告)日：2022-06-30
申请号：US17139088
申请日：2020-12-31
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Jyh-Long JENG , Jeng-Yu TSAI , Wei-Ta YANG
Abstract: A polymer and a resin composition thereof are provided. The polymer includes a first repeat unit represented by Formula (I) and a second repeat unit represented by Formula (II) wherein A1 is C24-48 alkylene, C24-48 alkenylene, C24-48 alkynylene, C24-48 alicyclic alkylene, C24-48 alicyclic alkenylene, or C24-48 alicyclic alkynylene. A2 and A4, independently having at least one reactive group, are independently C6-25 arylene, C4-8 cycloalkylene, C5-25 heteroarylene, divalent C7-25 alkylaryl, divalent C7-25 acylaryl, divalent C6-25 aryl ether, divalent C7-25 acyloxyaryl, or divalent C6-25 sulfonylaryl; and, A3 is substituted or unsubstituted C6-25 arylene, C4-8 cycloalkylene, C5-25 heteroarylene, divalent C7-25 alkylaryl, divalent C7-25 acylaryl, divalent C6-25 aryl ether, divalent C7-25 acyloxyaryl, or divalent C6-25 sulfonylaryl.
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公开(公告)号：US20190203067A1
公开(公告)日：2019-07-04
申请号：US16232766
申请日：2018-12-26
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Jyh-Long JENG , Jeng-Yu TSAI , Yen-Yi CHU , Wei-Ta YANG
IPC: C09D145/00 , C09D4/06 , H01B3/44
CPC classification number: C09D145/00 , C09D4/06 , H01B3/441 , H01B3/447 , H01B3/448
Abstract: A composition, an insulating material, and a method for preparing an insulating material are provided. The composition includes (a) 100 parts by weight of oligomer of Formula (I) (b) 20-50 parts by weight of polymer having at least two reactive functional groups, wherein the reactive functional group is a reactive-double-bond-containing functional group; (c) 1-5 parts by weight of photoinitiator; (d) 0.5-2 parts by weight of thermal initiator; and (e) 0.5-2 parts by weight of photoacid generator.
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公开(公告)号：US20170174880A1
公开(公告)日：2017-06-22
申请号：US14974547
申请日：2015-12-18
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Jyh-Long JENG , Jeng-Yu TSAI , Wei-Ta YANG
IPC: C08L63/10 , H01B3/40 , C08G59/14 , C08K3/36 , C08K5/1515
CPC classification number: C08L63/10 , C08G59/1433 , C08G59/24 , C08K3/36 , C08K5/1515 , C08L63/00 , H01B3/40 , C08L49/00
Abstract: A solventless resin composition with a low dielectric constant and a substrate structure are provided. The composition includes: (a) 20-50 parts by weight of a copolymer having the structure of Formula (I) wherein, i, j, k, l, and m are independently an integer from 1 to 10; (b) 50-80 parts by weight of a compound having the structure of Formula (II) (c) 80-100 parts by weight of a hardener; and (d) 70-100 parts by weight of an inorganic filler.
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