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    Method and system for idle state operation
    1.
    发明授权
    Method and system for idle state operation 有权
    空闲状态操作的方法和系统

    公开(公告)号：US07628898B2

    公开(公告)日：2009-12-08

    申请号：US11198905

    申请日：2005-08-05

    申请人： John Klocke ,  Kyle M. Hanson ,  Rajesh Baskaran

    发明人： John Klocke ,  Kyle M. Hanson ,  Rajesh Baskaran

    IPC分类号： C25D17/02 ,  C25D21/00 ,  C25D7/12

    CPC分类号： C23C18/1632 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D21/12 ,  C25F7/00

    摘要： Methods and systems for electrochemically processing microfeature workpieces are described herein. In one embodiment, a process for electrochemically treating a surface of a plurality of microfeature workpieces in an electrochemical treating chamber that includes a processing unit separated from an electrode unit by an ion-permeable barrier is described. The process involves an idle stage wherein during the idle stage, processing fluid components are prevented from transferring between the first processing fluid and the second processing fluid. The described system includes a flow control system for controlling the flow of processing fluid to achieve separation of a processing fluid from the barrier during the idle stage.

    摘要翻译： 本文描述了用于电化学处理微特征工件的方法和系统。 在一个实施例中，描述了一种用于电化学处理电化学处理室中的多个微特征工件的表面的方法，其包括通过离子可渗透屏障与电极单元分离的处理单元。 该过程包括空闲阶段，其中在空闲阶段期间，防止处理流体组分在第一处理流体和第二处理流体之间传递。 所描述的系统包括流量控制系统，用于控制处理流体的流动，以在空转阶段期间实现处理流体与屏障的分离。

    Apparatus and method for thermally controlled processing of microelectronic workpieces
    2.
    发明授权
    Apparatus and method for thermally controlled processing of microelectronic workpieces 失效
    微电子工件热控加工的装置和方法

    公开(公告)号：US07252714B2

    公开(公告)日：2007-08-07

    申请号：US10295302

    申请日：2002-11-15

    申请人： Kyle M. Hanson ,  Robert W. Batz, Jr. ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory J. Wilson ,  Paul R. McHugh

    发明人： Kyle M. Hanson ,  Robert W. Batz, Jr. ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory J. Wilson ,  Paul R. McHugh

    IPC分类号： B05C3/00

    CPC分类号： H01L21/6723 ,  C23C18/1676 ,  H01L21/67109 ,  Y10T137/0318

    摘要： Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater. The interaction between the microelectronic workpiece and the processing liquid can be further controlled by controlling the rate at which the microelectronic workpiece rotates and/or the manner in which the microelectronic workpiece is introduced to and/or withdrawn from the processing liquid.

    摘要翻译： 用液体对微电子工件进行热处理的装置和方法。 根据本发明的实施例的装置包括配置成承载诸如无电处理液体的处理液体的处理容器。 容器具有用于将热量传递到和/或内部的处理液体的热传递壁。 传热装置，例如容纳从处理容器溢出的处理液体的储存器，将热量传递到处理容器内或从处理容器内的处理液体。 传热装置还可以将热量传递到内部或外部热源，例如承载传热流体的导管或电阻加热器。 通过控制微电子工件旋转的速度和/或微电子工件被引入和/或从处理液中取出的方式，可以进一步控制微电子工件和处理液之间的相互作用。

    ELECTROLYTIC PROCESS USING CATION PERMEABLE BARRIER
    6.
    发明申请
    ELECTROLYTIC PROCESS USING CATION PERMEABLE BARRIER 有权
    电解工艺使用渗透性阻挡层

    公开(公告)号：US20120292194A1

    公开(公告)日：2012-11-22

    申请号：US13559494

    申请日：2012-07-26

    申请人： Rajesh Baskaran ,  Robert W. Batz, JR. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

    发明人： Rajesh Baskaran ,  Robert W. Batz, JR. ,  Bioh Kim ,  Tom L. Ritzdorf ,  John L. Klocke ,  Kyle M. Hanson

    IPC分类号： C25D5/02

    CPC分类号： C25D7/12 ,  C25D5/00 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02 ,  C25D21/12

    摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.

    摘要翻译： 描述了利用第一处理流体和阳极电解处理微特征工件的工艺和系统。 使用第一处理流体，阳极，第二处理流体和阳离子可渗透阻挡层对微特征工件进行电解处理。 阳离子可渗透阻隔层将第一处理流体与第二处理流体分离，同时允许某些阳离子物质在两种流体之间转移。 所描述的方法在反复电镀循环中产生沉积物，其在所需范围内具有沉积性质（例如电阻率）。

    Method for applying metal features onto barrier layers using ion permeable barriers
    10.
    发明申请
    Method for applying metal features onto barrier layers using ion permeable barriers 审中-公开
    使用离子渗透屏障将金属特征施加到阻挡层上的方法

    公开(公告)号：US20060189129A1

    公开(公告)日：2006-08-24

    申请号：US11413228

    申请日：2006-04-28

    申请人： Rajesh Baskaran ,  Bioh Kim ,  Robert Batz ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

    发明人： Rajesh Baskaran ,  Bioh Kim ,  Robert Batz ,  Tom Ritzdorf ,  John Klocke ,  Kyle Hanson

    IPC分类号： C25D5/34 ,  H01L21/44

    CPC分类号： C25D3/02 ,  C25D5/38 ,  C25D5/54 ,  C25D7/123 ,  C25D17/00 ,  C25D17/001 ,  C25D17/002 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/321 ,  H01L21/76843 ,  H01L21/76861 ,  H01L21/76873 ,  H01L21/76877 ,  H01L21/76883 ,  H01L21/76885

    摘要： The methods described are directed to processes for producing structures containing metallized features for use in microelectronic workpieces. The processes treat a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and metallized features include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The processes described modify an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process. According to the processes described metallized features are formed on the treated barrier layers using processes that employ ion permeable barriers.

    摘要翻译： 所描述的方法涉及用于生产用于微电子工件的包含金属化特征的结构的方法。 该方法处理阻挡层以促进阻挡层和金属化特征之间的粘附。 用于促进阻挡层和金属化特征之间的粘合的合适方式包括阻挡层的酸处理，阻挡层的电解处理，或阻挡层和金属化特征之间的结合层的沉积。 所描述的方法改变了阻挡层的外表面，使得其更适合于在屏障上电沉积金属，因此不需要PVD或CVD种子层沉积工艺。 根据所述方法，使用采用离子可渗透屏障的方法在经处理的阻挡层上形成金属化特征。