公开(公告)号：US5060844A

公开(公告)日：1991-10-29

申请号：US555120

申请日：1990-07-18

申请人： John R. Behun ,  Anson J. Call ,  Francis F. Cappo ,  Marie S. Cole ,  Karl G. Hoebener ,  Bruno T. Klingel ,  John C. Milliken

发明人： John R. Behun ,  Anson J. Call ,  Francis F. Cappo ,  Marie S. Cole ,  Karl G. Hoebener ,  Bruno T. Klingel ,  John C. Milliken

IPC分类号： H01L21/66 ,  G01R31/04 ,  G01R31/28 ,  H01L21/56 ,  H01L21/98 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L25/50 ,  G01R31/04 ,  G01R31/2886 ,  H01L21/563 ,  H05K3/3436 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613

摘要： Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion.Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion.Finally, disclosed is a method of testing the solderability of the above structures.

摘要翻译： 公开了一种在衬底上的连接器结构，其包括在衬底的表面上的至少一个第一焊料部分; 连接到所述至少一个第一焊料部分中的每一个的至少一个第二焊料部分; 以及围绕所述至少一个第一和第二焊料部分设置的环氧树脂，以覆盖所述第一焊料部分并且接触但不覆盖所述第二焊料部分。 还公开了一种在衬底上的连接器结构，其包括在所述衬底的表面上的至少一个第一焊料部分; 至少一个第二焊球部分连接到所述至少一个第一焊料部分; 其中所述第二焊球部分的熔点相对高于所述第一焊料部分的熔点。 最后，公开了测试上述结构的可焊性的方法。

公开(公告)号：US5147084A

公开(公告)日：1992-09-15

申请号：US743048

申请日：1991-08-09

申请人： John R. Behun ,  Anson J. Call ,  Francis F. Cappo ,  Marie S. Cole ,  Karl G. Hoebener ,  Bruno T. Klingel ,  John C. Milliken

发明人： John R. Behun ,  Anson J. Call ,  Francis F. Cappo ,  Marie S. Cole ,  Karl G. Hoebener ,  Bruno T. Klingel ,  John C. Milliken

IPC分类号： B23K35/14 ,  G01R31/04 ,  G01R31/28 ,  H01L21/56 ,  H01L21/98 ,  H05K3/34

CPC分类号： H01L25/50 ,  G01R31/04 ,  G01R31/2886 ,  H01L21/563 ,  H05K3/3436 ,  H01L2224/13022 ,  H01L2224/16058 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8192 ,  H01L2924/00013 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613

摘要： Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.

摘要翻译： 公开了一种在衬底上的连接器结构，其包括在衬底的表面上的至少一个第一焊料部分; 连接到所述至少一个第一焊料部分中的每一个的至少一个第二焊料部分; 以及围绕所述至少一个第一和第二焊料部分设置的环氧树脂，以覆盖所述第一焊料部分并且接触但不覆盖所述第二焊料部分。 还公开了一种在衬底上的连接器结构，其包括在所述衬底的表面上的至少一个第一焊料部分; 至少一个第二焊球部分连接到所述至少一个第一焊料部分; 其中所述第二焊球部分的熔点相对高于所述第一焊料部分的熔点。 最后，公开了测试上述结构的可焊性的方法。

公开(公告)号：US5565119A

公开(公告)日：1996-10-15

申请号：US431245

申请日：1995-04-28

申请人： John R. Behun ,  Pedro A. Chalco ,  Joseph Funari ,  J. Robert Young

发明人： John R. Behun ,  Pedro A. Chalco ,  Joseph Funari ,  J. Robert Young

IPC分类号： B23K1/005 ,  B23K26/06 ,  B29C65/24 ,  B29C65/60 ,  H05K3/34 ,  B23K26/00

CPC分类号： B29C65/18 ,  B23K1/0056 ,  B23K26/06 ,  B23K26/064 ,  B29C65/245 ,  B29C65/606 ,  B29C66/43 ,  B29C66/7424 ,  B29C66/80 ,  B29C66/8322 ,  B23K2201/40 ,  B29C2791/009 ,  B29C65/1612 ,  B29C65/1687 ,  B29C66/843 ,  H05K3/3478 ,  H05K3/3494

摘要： A laser head for simultaneously attaching solder balls to a carrier has at least one solder tip, with the number of solder tips being equal to the number of solder balls to be attached to the carrier. Each solder tip is heated by an optical fiber in thermal contact with the tip at one end of the fiber and coupled to a laser, preferably operating in the infrared wavelength range, at the other end of the fiber via a multiplexer coupling device. A spring is used in association with each solder tip to bias each solder tip to hold the carrier in contact with the solder balls. The tip absorbs the radiant energy as it exits the optical fiber, and the tip is heated. The laser and multiplexer permit precise control over the heat imparted to the tip, which in turn permits control of the amount of the solder ball that is reflowed.

摘要翻译： 用于将焊球同时附着到载体上的激光头具有至少一个焊嘴，其中焊锡头的数量等于要附着到载体的焊球的数量。 每个焊嘴通过光纤加热，该光纤与光纤的一端处的尖端热接触，并且经由多路复用器耦合器件耦合到光纤的另一端处优选在红外波长范围内工作的激光器。 与每个焊嘴相关联地使用弹簧以偏置每个焊嘴以保持载体与焊球接触。 尖端在离开光纤时吸收辐射能，并且尖端被加热。 激光器和多路复用器允许精确地控制施加到尖端的热量，这又允许控制回流焊球的量。

公开(公告)号：US5297618A

公开(公告)日：1994-03-29

申请号：US999260

申请日：1992-12-31

申请人： John R. Behun ,  Joseph A. Benenati

发明人： John R. Behun ,  Joseph A. Benenati

IPC分类号： H01L23/40 ,  F28F7/00

CPC分类号： H01L23/4006 ,  H01L2023/4087 ,  H01L2224/16

摘要： A heatsink is provided which can be removably secured in a heat transfer relationship to an electronic module or package by an epoxy type adhesive. A screw is provided through one end of the heatsink directly over an edge of the module sealing cap. To remove the heatsink from the module, the screw is turned down to contact the cap. Continued turning causes a prying force between the cap and the module whereby the heatsink is peeled away and removed from the module. All forces are directed between the cap and the module thereby eliminating harmful stress from being transmitted through the solder ball connections and to a supporting circuit card.

摘要翻译： 提供散热器，其可以通过环氧型粘合剂以热传递关系可拆卸地固定到电子模块或封装。 螺杆通过散热器的一端直接设置在模块密封盖的边缘上。 要从模块中卸下散热器，将螺钉向下转动以接触盖子。 继续转动导致盖和模块之间的撬动力，从而将散热器剥离并从模块中移除。 所有的力都被引导在盖和模块之间，从而消除了通过焊球连接和支撑电路卡传递的有害应力。

公开(公告)号：US4914814A

公开(公告)日：1990-04-10

申请号：US347305

申请日：1989-05-04

申请人： John R. Behun ,  William R. Miller ,  Bert H. Newman ,  Edward L. Yankowski

发明人： John R. Behun ,  William R. Miller ,  Bert H. Newman ,  Edward L. Yankowski

IPC分类号： H01R12/04 ,  H01L23/50 ,  H05K3/34

CPC分类号： H05K3/3436 ,  H05K3/3478 ,  H01L2224/16225 ,  H05K2201/0379 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0557 ,  Y02P70/613 ,  Y10T29/49149

摘要： A low cost process for fabricating solder column interconnectons for an electronic package is described. The process includes the step of filling an array of pin holes in a pin mold with a lead/tin solder, which array of pin holes is in substantial registration with the array of conductive pads on one side of a chip carrier; heating the lead/tin solder in the pin mold such that the solder becomes molten and coalesces with the array of conductive pads of the chip carrier, thereby forming an array of miniature pins bonded to the array of conductive pads of the chip carrier; joining circuit components to the other side of the chip carrier; and reflowing an eutectic lead/tin solder paste screened to the corresponding array of conductive pads of a circuit board to bond the free ends of the array of miniature pins of the carrier to the corresponding array of conductive pads, thereby forming the solder column connnections between the chip carrier and the circuit board. The process is suitable for mass production of reliable, high-density electrical interconnections between a chip carrier and a supporting circuit board.