公开(公告)号：US5060844A

公开(公告)日：1991-10-29

申请号：US555120

申请日：1990-07-18

申请人： John R. Behun ,  Anson J. Call ,  Francis F. Cappo ,  Marie S. Cole ,  Karl G. Hoebener ,  Bruno T. Klingel ,  John C. Milliken

发明人： John R. Behun ,  Anson J. Call ,  Francis F. Cappo ,  Marie S. Cole ,  Karl G. Hoebener ,  Bruno T. Klingel ,  John C. Milliken

IPC分类号： H01L21/66 ,  G01R31/04 ,  G01R31/28 ,  H01L21/56 ,  H01L21/98 ,  H05K1/18 ,  H05K3/34

CPC分类号： H01L25/50 ,  G01R31/04 ,  G01R31/2886 ,  H01L21/563 ,  H05K3/3436 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613

摘要： Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion.Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion.Finally, disclosed is a method of testing the solderability of the above structures.

摘要翻译： 公开了一种在衬底上的连接器结构，其包括在衬底的表面上的至少一个第一焊料部分; 连接到所述至少一个第一焊料部分中的每一个的至少一个第二焊料部分; 以及围绕所述至少一个第一和第二焊料部分设置的环氧树脂，以覆盖所述第一焊料部分并且接触但不覆盖所述第二焊料部分。 还公开了一种在衬底上的连接器结构，其包括在所述衬底的表面上的至少一个第一焊料部分; 至少一个第二焊球部分连接到所述至少一个第一焊料部分; 其中所述第二焊球部分的熔点相对高于所述第一焊料部分的熔点。 最后，公开了测试上述结构的可焊性的方法。

公开(公告)号：US5147084A

公开(公告)日：1992-09-15

申请号：US743048

申请日：1991-08-09

申请人： John R. Behun ,  Anson J. Call ,  Francis F. Cappo ,  Marie S. Cole ,  Karl G. Hoebener ,  Bruno T. Klingel ,  John C. Milliken

发明人： John R. Behun ,  Anson J. Call ,  Francis F. Cappo ,  Marie S. Cole ,  Karl G. Hoebener ,  Bruno T. Klingel ,  John C. Milliken

IPC分类号： B23K35/14 ,  G01R31/04 ,  G01R31/28 ,  H01L21/56 ,  H01L21/98 ,  H05K3/34

CPC分类号： H01L25/50 ,  G01R31/04 ,  G01R31/2886 ,  H01L21/563 ,  H05K3/3436 ,  H01L2224/13022 ,  H01L2224/16058 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8192 ,  H01L2924/00013 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613

摘要： Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.

摘要翻译： 公开了一种在衬底上的连接器结构，其包括在衬底的表面上的至少一个第一焊料部分; 连接到所述至少一个第一焊料部分中的每一个的至少一个第二焊料部分; 以及围绕所述至少一个第一和第二焊料部分设置的环氧树脂，以覆盖所述第一焊料部分并且接触但不覆盖所述第二焊料部分。 还公开了一种在衬底上的连接器结构，其包括在所述衬底的表面上的至少一个第一焊料部分; 至少一个第二焊球部分连接到所述至少一个第一焊料部分; 其中所述第二焊球部分的熔点相对高于所述第一焊料部分的熔点。 最后，公开了测试上述结构的可焊性的方法。

公开(公告)号：US06120885A

公开(公告)日：2000-09-19

申请号：US106779

申请日：1998-06-30

申请人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

发明人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

IPC分类号： H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  B32B7/00 ,  B32B15/16 ,  H01L23/48 ,  H01L29/12

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H05K3/4015 ,  H01L2924/0002 ,  H05K2201/10234 ,  H05K2201/10333 ,  H05K2201/10962 ,  H05K3/321 ,  H05K3/3447 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/256

摘要： A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.

摘要翻译： 公开了一种可插座的球栅阵列结构，其包括通过新颖的导电粘合剂机械地刚性（与焊料合金相比）涂覆有接合到芯片载体端子的贵金属接触金属的球。 由于包括具有可熔涂层的导电颗粒和粘合剂中使用的聚合物树脂的适当选择的填料的性质，球以顺应性和弹性方式附着到模块上，同时留下了大部分的底表面 球原始。 因此，球阵可以插入形成可拆卸接触的印刷电路板中的配合插座中。 这样便于从板上轻松取出可插拔的BGA，以进行修理或升级，同时也可以方便地将这些BGA插入测试和老化板。

公开(公告)号：US5759285A

公开(公告)日：1998-06-02

申请号：US699750

申请日：1996-08-20

申请人： Stephen L. Buchwalter ,  Anson J. Call

发明人： Stephen L. Buchwalter ,  Anson J. Call

IPC分类号： C11D7/34 ,  C11D7/50 ,  C11D11/00 ,  C23G5/032 ,  H01L21/48 ,  H05K3/26 ,  C23G1/02 ,  C23G5/02

CPC分类号： C11D7/5018 ,  C11D11/0047 ,  C11D7/34 ,  C23G5/032 ,  H01L21/4864 ,  H05K3/26

摘要： A composition for cleaning solder to remove flux, flux reaction products, residues, including residues from manufacturing operations such as plating and photoresist residues and other contaminants, without any significant dissolution of the solder especially solder used in fabricating electronic components such as C4 area array flip chip connectors, is provided. The composition comprises a non-aromatic sulfonic acid and a substituted alcohol with a preferred composition comprising 3 weight % methanesulfonic acid and 97 weight % trifluoroethanol. A method for cleaning solder and solder containing components made using the cleaning method and composition of the invention are also disclosed.

摘要翻译： 用于清洁焊料以除去焊剂，助焊剂反应产物，残余物，包括诸如电镀和光致抗蚀剂残留物等其他污染物的制造操作的残留物的组合物，而没有焊料特别是用于制造电子部件如C4区域阵列翻转的焊料的任何明显溶解 芯片连接器。 该组合物包含非芳族磺酸和具有优选组合物的取代醇，其包含3重量％甲磺酸和97重量％三氟乙醇。 还公开了一种用于清洁使用本发明的清洁方法和组合物制成的含有焊料和焊料的组分的方法。

公开(公告)号：US20080072597A1

公开(公告)日：2008-03-27

申请号：US11533933

申请日：2006-09-21

申请人： Anson J. Call

发明人： Anson J. Call

IPC分类号： F01K13/00 ,  F01K25/02 ,  F01K25/00

CPC分类号： H02K44/085

摘要： A liquid piston engine utilizing an electronically or electrically conductive liquid medium. A method is provided for utilizing the electrically conductive liquid piston engine.

摘要翻译： 利用电子或导电液体介质的液体活塞发动机。 提供了一种利用导电液体活塞式发动机的方法。

公开(公告)号：US06300164B1

公开(公告)日：2001-10-09

申请号：US09559314

申请日：2000-04-27

申请人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

发明人： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

IPC分类号： H01L2144

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/321 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/10234 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/256 ,  H01L2924/00

摘要： A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.

摘要翻译： 公开了一种可插座的球栅阵列结构，其包括通过新颖的导电粘合剂机械地刚性（与焊料合金相比）涂覆有接合到芯片载体端子的贵金属接触金属的球。 由于包括具有可熔涂层的导电颗粒和粘合剂中使用的聚合物树脂的适当选择的填料的性质，球以顺应性和弹性方式附着到模块上，同时留下了大部分的底表面 球原始。 因此，球阵可以插入形成可拆卸接触的印刷电路板中的配合插座中。 这样便于从板上轻松取出可插拔的BGA，以进行修理或升级，同时也可以方便地将这些BGA插入测试和老化板。

公开(公告)号：US5471027A

公开(公告)日：1995-11-28

申请号：US279606

申请日：1994-07-22

申请人： Anson J. Call ,  Stephen H. Meisner ,  Frank L. Pompeo ,  Jeffrey A. Zitz

发明人： Anson J. Call ,  Stephen H. Meisner ,  Frank L. Pompeo ,  Jeffrey A. Zitz

IPC分类号： C08G59/20 ,  H01L21/56 ,  H01L23/10 ,  H01L23/28 ,  H01L23/29 ,  H01L23/31 ,  H01L23/367 ,  H01L23/433 ,  B23K1/00

CPC分类号： H01L23/3675 ,  H01L21/563 ,  H01L23/10 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19105 ,  Y10T29/49146 ,  Y10T29/49171

摘要： The present invention relates generally to a new apparatus and method for a chip carrier. More particularly, the invention encompasses an apparatus and a method that uses a chip carrier having a single encapsulant to provide both flip chip fatigue life enhancement and environmental protection. A double-sided, pressure-sensitive, thermally-conductive adhesive tape could also be used with the encapsulated chip to directly attach the chip to a heat sink. Similarly, also disclosed is a method and apparatus for directly joining a heat sink to the chip carrier.

摘要翻译： 本发明一般涉及一种用于芯片载体的新装置和方法。 更具体地，本发明包括使用具有单个密封剂的芯片载体以提供翻转芯片疲劳寿命增强和环境保护的装置和方法。 双面，压敏，导热粘合带也可以与封装的芯片一起使用，以将芯片直接连接到散热器。 类似地，还公开了一种用于将散热器直接连接到芯片载体的方法和装置。

公开(公告)号：US06584684B2

公开(公告)日：2003-07-01

申请号：US09804885

申请日：2001-03-13

申请人： Peter J. Brofman ,  Anson J. Call ,  Jeffrey T. Coffin ,  Kathleen A. Stalter

发明人： Peter J. Brofman ,  Anson J. Call ,  Jeffrey T. Coffin ,  Kathleen A. Stalter

IPC分类号： H05K334

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15787 ,  H05K3/323 ,  H05K2203/0307 ,  H05K2203/105 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before setting or curing the polymer, the module is exposed to an electric field which induces migration of the metallic particles to the opposing pads of the carrier and semiconductor device. Such migration ultimately forms metal dendrites extending between mating pad pairs. The dendrites establish a metallurgical bond and conductive paths between the carrier and the overlying semiconductor device. When the polymer is subsequently set, the carrier and device are not only adhered to each other, but the dendrite connections are fixed and structurally reinforced to provide the needed electrically conductive paths.

摘要翻译： 通过在载体和半导体器件之间插入聚合物以固定到载体上来形成模块或组件。 聚合物具有悬浮在其中的电离金属颗粒。 在设置或固化聚合物之前，模块暴露于电场，其引起金属颗粒迁移到载体和半导体器件的相对焊盘。 这种迁移最终形成在匹配垫对之间延伸的金属枝晶。 枝晶在载体和上覆半导体器件之间建立冶金结合和导电路径。 当随后设定聚合物时，载体和装置不仅彼此粘合，而且枝晶连接是固定的并在结构上加强以提供所需的导电路径。

公开(公告)号：US06218629B1

公开(公告)日：2001-04-17

申请号：US09233890

申请日：1999-01-20

申请人： Peter J. Brofman ,  Anson J. Call ,  Jeffrey T. Coffin ,  Kathleen A. Stalter

发明人： Peter J. Brofman ,  Anson J. Call ,  Jeffrey T. Coffin ,  Kathleen A. Stalter

IPC分类号： H05K116

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15787 ,  H05K3/323 ,  H05K2203/0307 ,  H05K2203/105 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before setting or curing the polymer, the module is exposed to an electric field which induces migration of the metallic particles to the opposing pads of the carrier and semiconductor device. Such migration ultimately forms metal dendrites extending between mating pad pairs. The dendrites establish a metallurgical bond and conductive paths between the carrier and the overlying semiconductor device. When the polymer is subsequently set, the carrier and device are not only adhered to each other, but the dendrite connections are fixed and structurally reinforced to provide the needed electrically conductive paths.

摘要翻译： 通过在载体和半导体器件之间插入聚合物以固定到载体上来形成模块或组件。 聚合物具有悬浮在其中的电离金属颗粒。 在设置或固化聚合物之前，模块暴露于电场，其引起金属颗粒迁移到载体和半导体器件的相对焊盘。 这种迁移最终形成在匹配垫对之间延伸的金属枝晶。 枝晶在载体和上覆半导体器件之间建立冶金结合和导电路径。 当随后设定聚合物时，载体和装置不仅彼此粘合，而且枝晶连接是固定的并在结构上加强以提供所需的导电路径。

公开(公告)号：US07786579B2

公开(公告)日：2010-08-31

申请号：US11752449

申请日：2007-05-23

申请人： Jean Audet ,  Anson J. Call ,  Steven P. Ostrander ,  Douglas O. Powell ,  Roger D. Weekly

发明人： Jean Audet ,  Anson J. Call ,  Steven P. Ostrander ,  Douglas O. Powell ,  Roger D. Weekly

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K1/116 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/562 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/19051 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K1/113 ,  H05K2201/09454 ,  H05K2201/09718 ,  H01L2924/00

摘要： A microelectronic package having integrated circuits is provided. The microelectronic package includes multiple dielectric laminate layers, copper circuitry between the dielectric laminate layers where the copper circuitry includes circuit traces, and ball grid arrays/land grid arrays operatively connected to the copper circuitry such that conduction occurs. Further, proximate to the connection of the copper circuitry and the ball grid arrays/land grid arrays, a protective copper tongue is below an extension of the circuit traces, such that the protective copper tongue prevents the circuit traces from being affected by cracking propagated in the dielectric laminate layers or the ball grid arrays/land grid arrays.

摘要翻译： 提供具有集成电路的微电子封装。 微电子封装包括多个电介质层压层，铜电路在介电层压层之间，其中铜电路包括电路迹线，以及球栅阵列/焊盘电极阵列，可操作地连接到铜电路，从而导通发生。 此外，靠近铜电路和球栅阵列/接地栅阵列的连接，保护铜舌低于电路迹线的延伸线，使得保护铜舌防止电路迹线受到在 电介质层压层或球栅阵列/焊盘阵列。