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公开(公告)号：US5060844A
公开(公告)日：1991-10-29
申请号：US555120
申请日：1990-07-18
申请人： John R. Behun , Anson J. Call , Francis F. Cappo , Marie S. Cole , Karl G. Hoebener , Bruno T. Klingel , John C. Milliken
发明人： John R. Behun , Anson J. Call , Francis F. Cappo , Marie S. Cole , Karl G. Hoebener , Bruno T. Klingel , John C. Milliken
CPC分类号： H01L25/50 , G01R31/04 , G01R31/2886 , H01L21/563 , H05K3/3436 , H01L2224/73203 , H01L2224/81191 , H01L2224/814 , H01L2924/01078 , H01L2924/01322 , H01L2924/09701 , H05K2201/10234 , H05K2201/10977 , H05K2201/10992 , H05K2203/041 , Y02P70/613
摘要： Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion.Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion.Finally, disclosed is a method of testing the solderability of the above structures.
摘要翻译： 公开了一种在衬底上的连接器结构，其包括在衬底的表面上的至少一个第一焊料部分; 连接到所述至少一个第一焊料部分中的每一个的至少一个第二焊料部分; 以及围绕所述至少一个第一和第二焊料部分设置的环氧树脂，以覆盖所述第一焊料部分并且接触但不覆盖所述第二焊料部分。 还公开了一种在衬底上的连接器结构，其包括在所述衬底的表面上的至少一个第一焊料部分; 至少一个第二焊球部分连接到所述至少一个第一焊料部分; 其中所述第二焊球部分的熔点相对高于所述第一焊料部分的熔点。 最后，公开了测试上述结构的可焊性的方法。
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公开(公告)号：US5147084A
公开(公告)日：1992-09-15
申请号：US743048
申请日：1991-08-09
申请人： John R. Behun , Anson J. Call , Francis F. Cappo , Marie S. Cole , Karl G. Hoebener , Bruno T. Klingel , John C. Milliken
发明人： John R. Behun , Anson J. Call , Francis F. Cappo , Marie S. Cole , Karl G. Hoebener , Bruno T. Klingel , John C. Milliken
CPC分类号： H01L25/50 , G01R31/04 , G01R31/2886 , H01L21/563 , H05K3/3436 , H01L2224/13022 , H01L2224/16058 , H01L2224/73203 , H01L2224/73204 , H01L2224/8192 , H01L2924/00013 , H01L2924/01078 , H01L2924/01322 , H01L2924/09701 , H05K2201/10234 , H05K2201/10977 , H05K2201/10992 , H05K2203/041 , Y02P70/613
摘要： Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion. Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion. Finally, disclosed is a method of testing the solderability of the above structures.
摘要翻译： 公开了一种在衬底上的连接器结构，其包括在衬底的表面上的至少一个第一焊料部分; 连接到所述至少一个第一焊料部分中的每一个的至少一个第二焊料部分; 以及围绕所述至少一个第一和第二焊料部分设置的环氧树脂，以覆盖所述第一焊料部分并且接触但不覆盖所述第二焊料部分。 还公开了一种在衬底上的连接器结构，其包括在所述衬底的表面上的至少一个第一焊料部分; 至少一个第二焊球部分连接到所述至少一个第一焊料部分; 其中所述第二焊球部分的熔点相对高于所述第一焊料部分的熔点。 最后，公开了测试上述结构的可焊性的方法。
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公开(公告)号：US5591941A
公开(公告)日：1997-01-07
申请号：US144981
申请日：1993-10-28
申请人： John Acocella , Donald R. Banks , Joseph A. Benenati , Thomas Caulfield , Karl G. Hoebener , David P. Watson , John S. Corbin, Jr.
发明人： John Acocella , Donald R. Banks , Joseph A. Benenati , Thomas Caulfield , Karl G. Hoebener , David P. Watson , John S. Corbin, Jr.
IPC分类号： B23K1/00 , H01L21/48 , H01L23/488 , H01L23/498 , H05K1/11 , H05K3/34 , H05K3/36 , H05K3/42 , H06K1/14
CPC分类号： B23K1/0008 , B23K1/0016 , H01L21/4853 , H01L21/486 , H01L23/488 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H05K1/114 , H05K3/3436 , H05K3/3478 , B23K2201/36 , B23K2201/40 , B23K2201/42 , H01L2224/81191 , H01L2224/814 , H01L2924/00013 , H01L2924/09701 , H05K2201/0215 , H05K2201/10234 , H05K2201/10734 , H05K2201/10992 , H05K2203/0195 , H05K2203/0338 , H05K2203/041 , H05K2203/0415 , H05K2203/0455 , H05K2203/082 , H05K3/3452 , H05K3/42 , H05K3/429 , Y02P70/613 , Y10T29/49126 , Y10T29/49144
摘要： High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.
摘要翻译： 高熔点温度Pb / Sn 95/5焊球通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底底部的铜焊盘上。 通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。 然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊锡球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，将球制成为尽可能大的I / O间距，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。 为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。
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公开(公告)号：US4919970A
公开(公告)日：1990-04-24
申请号：US907265
申请日：1986-09-15
申请人： Karl G. Hoebener , John J. Stankus
发明人： Karl G. Hoebener , John J. Stankus
CPC分类号： H05K3/1233 , H05K3/12 , H05K2201/09572 , H05K2203/0139 , H05K2203/163
摘要： A technique for one step solder application through a mask to a printed circuit board (PCB) having pads for surface mountable components and through holes for a leaded components is disclosed wherein the amount of solder deposited on the pads and in the holes is simultaneously, independently controlled as a function of mask thickness, blade hardness and blade to mask angle.
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公开(公告)号：US5762259A
公开(公告)日：1998-06-09
申请号：US848792
申请日：1997-05-01
申请人： Eric M. Hubacher , Karl G. Hoebener
发明人： Eric M. Hubacher , Karl G. Hoebener
IPC分类号： H01L21/60 , H05K3/12 , H05K3/34 , B23K35/00 , H01L21/441
CPC分类号： H01L24/11 , H05K3/3484 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/3025 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , H05K2203/0557 , H05K3/1216
摘要： Solder bumps are formed on a substrate, such as a semiconductor die (28) or wafer, using a screen printing and reflow operation. Solder paste (18) is screened into openings (14) of a stencil (10). The paste is reflowed within the stencil to produce a solder preform (22). The stencil and solder preforms are then aligned over the substrate to be bumped so that the preform aligns with a metal pad (30) on the substrate. The solder preforms are again reflowed, and the solder within the openings of the stencil is drawn onto the metal pad. To facilitate the transfer of the solder from the stencil to the metal pad, a second stencil (12) can be used to form a protrusion (27) on the solder preform. The protrusion contacts the metal pad during the transfer reflow operation to facilitate removing the solder from the stencil.
摘要翻译： 使用丝网印刷和回流操作在诸如半导体管芯（28）或晶片的基板上形成焊料凸块。 焊膏（18）被筛选到模版（10）的开口（14）中。 在模板内将浆料回流以产生焊料预制件（22）。 然后将模板和焊料预成型件对准在衬底上以被凸起，使得预成型体与衬底上的金属焊盘（30）对准。 焊料预制件再次回流，并且模板的开口内的焊料被拉到金属垫上。 为了便于将焊料从模板转移到金属焊盘，可以使用第二模板（12）在焊料预成型件上形成突起（27）。 在转移回流操作期间，突起与金属垫接触以便于从模板去除焊料。
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公开(公告)号：US4998342A
公开(公告)日：1991-03-12
申请号：US401359
申请日：1989-08-31
CPC分类号： H05K13/0469 , H05K3/3415 , H05K2203/1476 , H05K2203/1572 , H05K3/305 , H05K3/3447 , Y02P70/613 , Y10T29/49144
摘要： An improved method for double sided attachment of components to a printed circuit board is described wherein surface mount components soldered to a first surface of the circuit board (backside) are, once the board is inverted during reflow, retained in place only by force of molten solder surface tension.
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7.发明授权
公开(公告)号：US5492266A
公开(公告)日：1996-02-20
申请号：US298983
申请日：1994-08-31
IPC分类号： B41F15/08 , B23K3/06 , B41M1/12 , H01L21/48 , H01L21/60 , H01L23/485 , H05K3/12 , H05K3/34 , B23K1/00
CPC分类号： H05K3/3484 , B23K3/06 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L24/81 , H05K3/1225 , B23K2201/36 , H01L2224/11 , H01L2224/1131 , H01L2224/11334 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/81801 , H01L2924/01004 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H05K2201/09727 , H05K2201/10674 , H05K2203/043 , H05K2203/0485 , H05K2203/0557 , H05K2203/1476 , H05K3/1216
摘要： A method, and product created thereby, by which low melting point solder suitable for reflow connection of components is formed on select contacts of a printed circuit board. The method is particularly suited to the fabrication of populated printed circuit board having fine pitch devices including flip-chip devices, connected on a board including conventional coarse pitch surface mounted components. The fine pitch contacts of the board are exposed through holes in a stencil characterized in its ability to withstand solder reflow temperatures, not be wettable by solder, and have a coefficient of thermal expansion relatively matching the printed circuit board. Low temperature solder paste is screen deposited into the stencil openings. With the stencil fixedly positioned on the board, the solder paste retained by the stencil pattern is reflowed to selectively form on the underlying contacts of the printed circuit board. Thereafter, according to a preferred practice of the invention, the stencil is removed from the board and the board is subject to previously practiced depositions of flux and paste in preparation for fine and coarse pitch component placement and ensuing solder reflow. Alternate practices of the invention involve concurrent deposition of fine and coarse pitch solder and retention of the stencil following fine pitch solder fellow.
摘要翻译： 一种由此制造的产品，通过这种方法，在印刷电路板的选择的触点上形成适用于部件回流连接的低熔点焊料。 该方法特别适用于制造具有细间距器件的填充印刷电路板，其中包括倒装芯片器件，其连接在包括常规粗节距表面安装部件的板上。 板的细间距触点通过模板中的孔露出，其特征在于其能够承受焊料回流温度，不能被焊料润湿，并且具有与印刷电路板相对匹配的热膨胀系数。 低温焊膏被屏幕沉积在模板孔中。 当模板固定在板上时，由模板图案保持的焊膏被回流以选择性地形成在印刷电路板的下面的触点上。 此后，根据本发明的优选实践，将模板从板上移除，并且板经历先前实践的焊剂和浆料沉积，以准备精细和粗略的沥青组分放置以及随后的回流焊。 本发明的替代实践涉及精细和粗沥青焊料的同时沉积以及在细间距焊料之后保留模板。
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公开(公告)号：US4761881A
公开(公告)日：1988-08-09
申请号：US907266
申请日：1986-09-15
CPC分类号： H05K3/3447 , B23K1/20 , H05K3/3415 , B23K2201/40 , H05K2201/10636 , H05K2203/045 , H05K2203/1484 , H05K2203/1572 , H05K3/305 , H05K3/3484 , Y02P70/611 , Y02P70/613 , Y10T29/49144
摘要： A technique is disclosed for attaching a variety of device types to the same side of a printed circuit board including a single solder application step for both surface mountable and leaded components, placement of the devices, drying of the solder and solder reflow.
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