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公开(公告)号：US10338031B2
公开(公告)日：2019-07-02
申请号：US15446092
申请日：2017-03-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago , Hirofumi Shinagawa , Toshiro Adachi
IPC: G01N29/04 , H01L23/00 , G01N29/11 , H01L23/538 , H01L23/552 , H01L25/065 , H05K1/02 , H05K1/18
Abstract: A component-embedded substrate includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, an embedded component embedded in the multilayer body, and planar conductors disposed on both sides of the embedded component in the stacking direction, the planar conductors overlapping the embedded component. The planar conductors each include a plurality of openings that overlap the embedded component over substantially the entire region occupied by the embedded component, as seen in the stacking direction.
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公开(公告)号：US10219367B2
公开(公告)日：2019-02-26
申请号：US15806456
申请日：2017-11-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirofumi Shinagawa , Shigeru Tago
Abstract: A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates.
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公开(公告)号：US09974185B2
公开(公告)日：2018-05-15
申请号：US15015475
申请日：2016-02-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago , Hirofumi Shinagawa , Yuki Wakabayashi , Kuniaki Yosui , Yuki Ito , Toshiro Adachi , Wataru Yanase , Masaki Kawata
CPC classification number: H05K1/185 , H05K1/0298 , H05K1/186 , H05K3/4682 , H05K2201/09072 , H05K2203/0278
Abstract: A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.
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公开(公告)号：US09848489B2
公开(公告)日：2017-12-19
申请号：US14879296
申请日：2015-10-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirofumi Shinagawa , Shigeru Tago
CPC classification number: H05K1/025 , H05K1/0216 , H05K1/0219 , H05K1/0225 , H05K1/024 , H05K1/028 , H05K1/0298 , H05K1/0313 , H05K1/0393 , H05K1/115 , H05K3/4632 , H05K3/4635 , H05K3/4685 , H05K2201/0129 , H05K2201/0141 , H05K2201/09036 , H05K2203/063
Abstract: A multilayer resin substrate includes resin substrates laminated together, an overlapping portion in which a signal line as a conductor pattern and another conductor pattern overlap each other in a laminating direction of the resin substrates, and a non-overlapping portion in which the signal line and the other conductor pattern do no overlap each other in the laminating direction. A thin portion is provided at a position in the non-overlapping portion near the overlapping portion. The thin portion is a portion of the multilayer resin substrate which has a thickness smaller than the thickness in the overlapping portion in the laminating direction of the resin substrates.
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公开(公告)号：US09743507B2
公开(公告)日：2017-08-22
申请号：US14698983
申请日：2015-04-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago
CPC classification number: H05K1/0218 , H01L23/12 , H01L23/5384 , H01L23/5389 , H01L23/552 , H01L23/66 , H01L24/19 , H01L2224/04105 , H01L2224/2518 , H01L2924/1421 , H05K1/11 , H05K1/183 , H05K1/186 , H05K3/4697
Abstract: A radio frequency module includes a plurality of insulating base material layers made of a thermoplastic resin defining a multilayer circuit board and including a cavity inside thereof, an IC chip disposed in the cavity and including a noise generation source, and planar ground conductive bodies provided in the multilayer circuit board. The planar ground conductive bodies are disposed on a layer not exposed to the inner surface of the cavity, and include inter-layer connection conductive bodies protruding in the direction of the noise generation source from the planar ground conductive bodies.
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Patent Agency Ranking
公开(公告)号：US09490513B2
公开(公告)日：2016-11-08
申请号：US14503612
申请日：2014-10-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi Sasaki , Nobuo Ikemoto , Shigeru Tago
CPC classification number: H01P3/003 , H01P3/08 , H01P3/085 , H05K1/0225 , H05K1/0253 , H05K1/0284 , H05K1/0393 , H05K1/147 , H05K2201/09245 , H05K2201/09281 , H05K2201/09727
Abstract: A dielectric element assembly includes a plurality of dielectric layers stacked on each other in a direction of lamination and extends in an x-axis direction. A signal line is provided in the dielectric element assembly and extends in the x-axis direction. A reference ground conductor is provided on a positive side in a z-axis direction relative to the signal line. An auxiliary ground conductor is provided on a negative side in the z-axis direction relative to the signal line. Via-hole conductors connect the reference ground conductor and the auxiliary ground conductor and are provided in the dielectric element assembly on the negative side relative to the center in a y-axis direction. A portion of the signal line in a section which includes the via-hole conductors is positioned on the positive side in the y-axis direction relative to another portion of the signal line in a section which does not include the via-hole conductors.
Abstract translation: 电介质元件组件包括在层叠方向上彼此堆叠并沿x轴方向延伸的多个电介质层。 信号线设置在电介质元件组件中并沿x轴方向延伸。 参考接地导体相对于信号线在z轴方向的正侧设置。 辅助接地导体相对于信号线设置在z轴方向的负侧。 通孔导体连接参考接地导体和辅助接地导体，并且在y轴方向相对于中心的负侧设置介质元件组件。 包括通孔导体的部分中的信号线的一部分在不包括通孔导体的部分中位于相对于信号线的另一部分的y轴方向的正侧。
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公开(公告)号：US09401532B2
公开(公告)日：2016-07-26
申请号：US14191605
申请日：2014-02-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago , Satoshi Sasaki , Noboru Kato
CPC classification number: H01P3/08 , H01P3/081 , H01P3/085 , H01P5/028 , H05K1/0225 , H05K1/0253 , H05K1/028 , H05K1/147 , H05K3/4635 , H05K2201/0191 , H05K2201/09309 , H05K2201/09618 , H05K2201/09727 , H05K2201/10037
Abstract: A high-frequency signal line includes a dielectric element body including regions and a plurality of flexible dielectric sheets. A signal conductive layer is provided in or on the dielectric element body. Ground conductive layers are provided in or on the dielectric element body and face the signal conductive layer. A distance between the ground conductive layer and the signal conductive layer in the region is smaller than a distance between the ground conductive layer and the signal conductive layer in the regions. The dielectric element body is bent in the region.
Abstract translation: 高频信号线包括具有区域和多个柔性电介质片的电介质元件体。 信号导电层设置在电介质元件主体中或其上。 接地导电层设置在电介质元件主体中或其上，并面向信号导电层。 该区域中的接地导电层和信号导电层之间的距离小于该区域中的接地导电层与信号导电层之间的距离。 电介质元件体在该区域中弯曲。
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公开(公告)号：US08937257B2
公开(公告)日：2015-01-20
申请号：US13772483
申请日：2013-02-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago
CPC classification number: H05K1/181 , H05K1/0298 , H05K1/0313 , H05K1/115 , H05K1/185 , H05K7/02 , H05K2201/10537
Abstract: An electronic module includes a substrate, a built-in electronic component and a surface mount electronic component. A suckable region is provided on a front surface of the substrate. When viewed in a see-through manner in a direction perpendicular or substantially perpendicular to the front surface of the substrate, the suckable region is inside of a region in which one built-in electronic component is built in and a center of gravity of the electronic module is located inside of the suckable region. A protective layer is not provided on the front surface of the substrate on which the surface mount electronic component is mounted.
Abstract translation: 电子模块包括基板，内置电子部件和表面安装电子部件。 可吸取区域设置在基板的前表面上。 当以直视方式在垂直于或基本垂直于基板的正面的方向上观察时，可吸取区域在内置有一个内置电子部件的区域内，电子的重心 模块位于可吸取区域的内部。 在安装有表面安装电子部件的基板的正面上没有设置保护层。
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公开(公告)号：US12003015B2
公开(公告)日：2024-06-04
申请号：US17702786
申请日：2022-03-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuri Yamakawa , Shigeru Tago , Yoshiki Yamada
CPC classification number: H01Q1/2283 , H01Q1/38 , H01Q1/48 , H01Q21/065
Abstract: An antenna module including a dielectric substrate formed by stacking a plurality of dielectric layers, a radiating element formed on or in the dielectric substrate, a ground electrode facing the radiating element, and peripheral electrodes that are formed in a plurality of layers between the radiating element and the ground electrode at an outer periphery of the dielectric substrate.
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公开(公告)号：US11266016B2
公开(公告)日：2022-03-01
申请号：US17319396
申请日：2021-05-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yusuke Kamitsubo , Ryosuke Takada , Tsuyoshi Katsube , Yasuhiro Kuratani , Shigeru Tago , Tomohiro Furumura
Abstract: A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.
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