公开(公告)号：US20140159072A1

公开(公告)日：2014-06-12

申请号：US14096626

申请日：2013-12-04

Applicant: NITTO DENKO CORPORATION

Inventor： Yasunari OOYABU ,  Yoshihiko KITAYAMA ,  Munehisa MITANI

IPC: H05K1/11 ,  H01L25/075

CPC classification number: H05K1/11 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device assembly includes a plurality of light-emitting devices, the plurality of light-emitting devices being provided continuously, the plurality of light-emitting devices each including a substrate, an optical semiconductor element mounted on the surface of the substrate, an encapsulating layer formed on the substrate surface to encapsulate the optical semiconductor element, and an electrode formed on the substrate surface so as to be electrically connected to the optical semiconductor element. The substrate has a fragile region formed to partition off the light-emitting devices that are disposed next to each other.

Abstract translation: 发光装置组件包括多个发光装置，所述多个发光装置连续地设置，所述多个发光装置各自包括基板，安装在所述基板的表面上的光半导体元件， 形成在基板表面上以封装光学半导体元件的封装层，以及形成在基板表面上以电连接到光学半导体元件的电极。 基板具有形成为分隔彼此相邻布置的发光器件的脆弱区域。

公开(公告)号：US20160035592A1

公开(公告)日：2016-02-04

申请号：US14776830

申请日：2014-01-30

Applicant: NITTO DENKO CORPORATION

Inventor： Munehisa MITANI ,  Yasunari OOYABU ,  Daisuke TSUKAHARA

IPC: H01L21/56

CPC classification number: H01L21/565 ,  H01L21/67126 ,  H01L23/10 ,  H01L33/52 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: The adhering device includes a first mold member having a first cavity in which an adhering preform, which includes an electronic component and a resin sheet disposed to face the electronic component in spaced-apart relation, is accomodated; an elastic member disposed to face the resin sheet so that a first enclosed space can be formed with the first cavity; and a differential pressure generation means connected to the first mold member for allowing the air pressure of the first enclosed space to be lower than the air pressure of a space opposite to the first enclosed space relative to the elastic member. The adhering device is configured such that by operating the differential pressure generation means, the elastic member moves towards the first cavity side, the adhering perform is pressed in the direction facing the electronic component and the resin sheet, thereby adhering the resin sheet to the electronic component.

Abstract translation: 粘合装置包括具有第一空腔的第一模具构件，其中包含电子部件的粘合预成型件和以间隔开的方式设置成面对电子部件的树脂片; 弹性构件，其设置成面对所述树脂片，使得能够与所述第一空腔形成第一封闭空间; 以及连接到第一模具构件的差压产生装置，用于允许第一封闭空间的空气压力低于与第一封闭空间相对于弹性构件的空间的空气压力。 粘接装置被构造成使得通过操作差压产生装置，弹性构件朝着第一腔侧移动，粘附表面在面向电子部件和树脂片的方向上被按压，从而将树脂片粘附到电子 零件。

公开(公告)号：US20140024153A1

公开(公告)日：2014-01-23

申请号：US13944577

申请日：2013-07-17

Applicant: NITTO DENKO CORPORATION

Inventor： Munehisa MITANI ,  Yuki EBE ,  Yasunari OOYABU

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L21/56 ,  H01L33/005 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A method for producing a semiconductor device includes a preparing step of preparing a board formed with a concave portion, a terminal disposed in or around the concave portion, and a semiconductor element disposed in the concave portion; a wire-bonding step of connecting the terminal to the semiconductor element with a wire; a pressure-welding step of pressure-welding an encapsulating sheet to the board so as to be in close contact with the upper surface of a portion around the concave portion and to be separated from the upper surface of the concave portion under a reduced pressure atmosphere; and an atmosphere releasing step of releasing the board and the encapsulating sheet under an atmospheric pressure atmosphere.

Abstract translation: 一种半导体器件的制造方法，其特征在于，具备准备形成有凹部的基板，设置在所述凹部内或周围的端子以及设置在所述凹部中的半导体元件的准备工序。 将端子与导线连接到半导体元件的引线键合步骤; 压接步骤，将密封片压焊到所述板上，使其与所述凹部周围的部分的上表面紧密接触，并且在减压气氛下与所述凹部的上表面分离 ; 以及气氛释放步骤，在大气压气氛下释放板和封装片。

公开(公告)号：US20160284951A1

公开(公告)日：2016-09-29

申请号：US14778196

申请日：2014-03-10

Applicant: NITTO DENKO CORPORATION

Inventor： Akito NINOMIYA ,  Hisataka ITO ,  Yasunari OOYABU ,  Shigehiro UMETANI ,  Munehisa MITANI

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2933/005 ,  H01S5/02228 ,  H01L2924/00014

Abstract: A method for producing an LED device 5 producing an LED device 5 by encapsulating an LED 4 by an encapsulating sheet 1 includes a sheet producing step of producing the encapsulating sheet 1 and an encapsulating step of encapsulating the LED 4 by the encapsulating sheet 1. Time T from producing the encapsulating sheet 1 in the sheet producing step to encapsulating the LED 4 by the encapsulating sheet 1 in the encapsulating step is 24 hours or less.

Abstract translation: 通过封装片1封装LED4来制造LED器件5的LED器件5的制造方法包括：制造密封片1的片材制造工序以及由密封片1封装LED 4的封装工序。时间 在封装工序中，通过密封片1将LED 4封装在片材制造工序中，制造密封片1的T为24小时以下。

公开(公告)号：US20160087170A1

公开(公告)日：2016-03-24

申请号：US14778197

申请日：2014-03-13

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki KATAYAMA ,  Hisataka ITO ,  Munehisa MITANI

IPC: H01L33/56

CPC classification number: H01L33/56 ,  H01L21/563 ,  H01L21/566 ,  H01L21/568 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: A method for producing an optical semiconductor device including a varnish production step of producing a varnish containing particles and a curable resin, a cover layer production step of producing an A-stage cover layer from the varnish, and a covering step of covering the optical semiconductor element with the A-stage covering layer.

Abstract translation: 一种光学半导体装置的制造方法，其特征在于，包括制造含有清漆的颗粒和固化性树脂的清漆制造工序，从所述清漆制造A级覆盖层的覆盖层制造工序以及覆盖所述光半导体 元素与A级覆盖层。

公开(公告)号：US20140091348A1

公开(公告)日：2014-04-03

申请号：US14042856

申请日：2013-10-01

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki KATAYAMA ,  Takashi KONDO ,  Yuki EBE ,  Munehisa MITANI

IPC: H01L33/50 ,  H01L21/56 ,  H01L33/00

CPC classification number: H01L33/502 ,  B32B3/08 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B27/283 ,  B32B2307/306 ,  B32B2307/54 ,  B32B2457/00 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/06 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/54 ,  H01L2221/68331 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/10157 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/005 ,  H01L2924/00

Abstract: An encapsulating sheet-covered semiconductor element includes a semiconductor element having one surface in contact with a board and the other surface disposed at the other side of the one surface and an encapsulating sheet covering at least the other surface of the semiconductor element. The encapsulating sheet includes an exposed surface that is, when projected from one side toward the other side, not included in the one surface of the semiconductor element and exposed from the one surface and the exposed surface has the other side portion that is positioned toward the other side with respect to the one surface of the semiconductor element.

Abstract translation: 封装片覆盖的半导体元件包括具有与基板接触的一个表面的半导体元件和设置在该一个表面的另一侧的另一个表面以及至少覆盖半导体元件的另一个表面的封装片。 封装片包括暴露表面，当从一侧朝向另一侧突出时，该暴露表面不包括在半导体元件的一个表面中并且从该一个表面露出并且暴露表面具有朝向该侧表面的另一侧部 相对于半导体元件的一个表面的另一侧。

公开(公告)号：US20140091334A1

公开(公告)日：2014-04-03

申请号：US14042958

申请日：2013-10-01

Applicant: NITTO DENKO CORPORATION

Inventor： Hiroyuki KATAYAMA ,  Takashi KONDO ,  Yuki EBE ,  Munehisa MITANI ,  Yasunari OOYABU

IPC: H01L33/52 ,  H01L33/44 ,  H01L33/50

CPC classification number: H01L33/52 ,  B32B3/08 ,  B32B3/26 ,  B32B3/266 ,  B32B7/12 ,  B32B15/08 ,  B32B15/18 ,  B32B27/06 ,  B32B27/20 ,  B32B27/283 ,  B32B27/306 ,  B32B2264/0214 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2307/54 ,  B32B2457/00 ,  H01L24/81 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/502 ,  H01L33/54 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/005 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A method for producing an encapsulating sheet-covered semiconductor element includes a semiconductor element disposing step of disposing a plurality of semiconductor elements at spaced intervals to each other and an encapsulating sheet disposing step of disposing an encapsulating sheet so as to cover a plurality of the semiconductor elements and to form a space over the semiconductor elements adjacent to each other.

Abstract translation: 封装有片状半导体元件的制造方法包括：将间隔开的多个半导体元件彼此配置的半导体元件配置工序以及封装片的配置工序，所述封装片的配置工序为将多个所述半导体元件 并且在彼此相邻的半导体元件上形成空间。

公开(公告)号：US20140091337A1

公开(公告)日：2014-04-03

申请号：US14096570

申请日：2013-12-04

Applicant: NITTO DENKO CORPORATION

Inventor： Yasunari OOYABU ,  Yoshihiko KITAYAMA ,  Munehisa MITANI

IPC: H01L33/52 ,  H01L27/15

CPC classification number: H01L33/52 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/09709 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2203/1311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device assembly includes a substrate, an optical semiconductor element mounted on the surface of the substrate, an encapsulating layer formed on the substrate surface to encapsulate the optical semiconductor element, and an electrode formed on the substrate surface to be electrically connected to the optical semiconductor element. On the substrate, only an encapsulating region and an electrode region are formed, the encapsulating region including the optical semiconductor element and being defined by the encapsulating layer, and the electrode region being defined by the electrode exposed from the encapsulating layer.

Abstract translation: 发光装置组件包括基板，安装在基板的表面上的光半导体元件，形成在基板表面上以封装光半导体元件的封装层，以及形成在基板表面上以电连接到 光半导体元件。 在基板上仅形成封装区域和电极区域，该封装区域包括光学半导体元件并由封装层限定，并且电极区域由从封装层露出的电极限定。

公开(公告)号：US20140024179A1

公开(公告)日：2014-01-23

申请号：US13943120

申请日：2013-07-16

Applicant: NITTO DENKO CORPORATION

Inventor： Munehisa MITANI ,  Yuki EBE ,  Yasunari OOYABU

IPC: H01L21/56

CPC classification number: H01L33/52 ,  H01L21/56 ,  H01L33/005 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/005 ,  H01L2924/00014

Abstract: A method for producing a semiconductor device includes a preparing step of preparing a board formed with a concave portion, a terminal disposed in or around the concave portion, and a semiconductor element disposed in the concave portion; a wire-bonding step of connecting the terminal to the semiconductor element with a wire; a pressure-welding step of pressure-welding an encapsulating sheet to the board so as to be in close contact with the upper surface of a portion around the concave portion and to be separated from the upper surface of the concave portion under a reduced pressure atmosphere; and an atmosphere releasing step of releasing the board and the encapsulating sheet under an atmospheric pressure atmosphere.