摘要:
A test board includes an insulating part provided to face a semiconductor device when the semiconductor device is mounted on the test board, a sloped connection hole formed in the insulating part for accepting a projection electrode when the semiconductor device is mounted on the test board, and a conductive part formed in the insulating part so as to be in contact with and electrically connected to the projection electrode. When the semiconductor device is mounted on the test board, the semiconductor device or the projection electrode is supported by the insulating part.
摘要:
An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.
摘要:
An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.
摘要:
An integrated circuit testing device includes a flexible base of an insulating material, the base having a first surface and a second surface opposite to each other, an integrated circuit to be tested being bonded to the first surface. A conductive wiring layer is provided on the first or second surface of the base, the wiring layer including a plurality of projecting contacts over the first surface at positions which electrodes of the integrated circuit are connected to. An elastic member is provided beneath the second surface of the base opposite to the first surface, the elastic member having a first level of hardness. A flexible film member is provided between the second surface of the base and the elastic member, the film member having a second level of hardness higher than the first level of hardness of the elastic member.
摘要:
An image pickup device is disclosed that has little deformation caused by thermal expansion of a transparent resin for sealing an image pickup element. The image pickup device includes an image pickup element having a light receiving surface, a micro-lens for condensing incident light to the image pickup element, a first transparent plate disposed on the light receiving surface of the image pickup element with the micro-lens in between, a transparent resin that seals the image pickup element and the first transparent plate, and a second transparent plate disposed on the transparent resin to face the first transparent plate.
摘要:
An imaging device includes an image sensing device provided on a semiconductor substrate; a transparent member provided on a light-receiving area of the image sensing device; and a circuit element provided on the transparent member, wherein the image sensing device and the circuit element are electrically coupled to each other.
摘要:
A method for processing substrates for a substrate processing facility includes the steps of: performing ventilation of a container with a fan filter unit while a lid of the container is in a closed state, when the container is stored in a storage shelf, and when the container is transferred with a substrate transfer device, and ventilating the container with the fan filter with the lid of the container in an open state, when substrates are transferred in a substrate loading/unloading section with the substrate transfer device.
摘要:
A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.
摘要:
It is an object of the present invention to provide a plate-shaped work piece transporting apparatus that has a fan, a dust-removal filter disposed above this fan, and a plate-shape porous member disposed above the dust-removal filter. By forming a chamber in which air can accumulate between the porous member and the dust-removal filter, it is possible to suppress air pulsations. Further, by providing support members on the porous member, the plate-shaped work piece can be supported and damage thereto can be avoided when the plate-shaped work piece, which is supported by air from the fan, drops to below a set height.
摘要:
An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member. The plate-like transparent member includes a first principal plane positioned on the light receiving element side and a second principal plane opposite the first principal plane. The first principal plane is greater in area than the second principal plane.