公开(公告)号：US09936578B2

公开(公告)日：2018-04-03

申请号：US14517002

申请日：2014-10-17

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Mark Charles Held

IPC: H05K7/00 ,  H05K1/11 ,  H01L23/552 ,  H01L23/00 ,  H05K1/18 ,  H05K9/00 ,  H01L23/31 ,  H05K3/28

CPC classification number: H05K1/111 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8201 ,  H01L2224/82031 ,  H01L2224/82101 ,  H01L2224/82136 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/1443 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15787 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/0715 ,  H05K2201/10439 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2924/00

Abstract: A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

公开(公告)号：US20140355222A1

公开(公告)日：2014-12-04

申请号：US13906892

申请日：2013-05-31

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Joseph Byron Bullis

IPC: H05K1/14 ,  H05K3/28 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K3/4007 ,  H01L23/3135 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48229 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/144 ,  H05K3/284 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/10371 ,  Y10T29/4902 ,  Y10T29/49146 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.

Abstract translation: 本公开涉及电子部件的电子模块及其制造方法。 在一个实施例中，使用具有第一部件区域的第一基板和具有第二部件区域的第二基板形成电子模块。 一个或多个电子部件可以附接到第一部件区域和第二部件区域。 第二基板安装在第一基板上，使得第二部件区域面向第一部件区域。 包覆成型覆盖第一部件区域和第二部件区域，以覆盖第一部件区域和第二部件区域上的电子部件。 以这种方式，能够安装在印刷电路板（PCB）的区域上的电子模块内的电子部件的数量增加。

公开(公告)号：US20160351509A1

公开(公告)日：2016-12-01

申请号：US15080001

申请日：2016-03-24

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Dan Carey ,  Ma Shirley Asoy

IPC: H01L23/552 ,  H01L21/78 ,  H01L21/768 ,  H01L21/3105 ,  H01L21/48 ,  H01L21/683 ,  H01L21/56 ,  H01L21/3205 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L21/268

CPC classification number: H01L23/552 ,  H01L21/268 ,  H01L21/31058 ,  H01L21/4817 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/04105 ,  H01L2224/12105

Abstract: The present disclosure integrates electromagnetic shielding into a wafer level fan-out packaging process. First, a mold wafer having multiple modules is provided. Each module includes a die with an I/O port and is surrounded by an inter-module area. A redistribution structure that includes a shield connected element coupled to the I/O port of each module is formed over a bottom surface of the mold wafer. The shield connected element extends laterally from the I/O port into the inter-module area for each module. Next, the mold wafer is sub-diced at each inter-module area to create a cavity. A portion of the shield connected element is then exposed through the bottom of each cavity. A shielding structure is formed over a top surface of the mold wafer and exposed faces of each cavity. The shielding structure is in contact with the shield connected element.

Abstract translation: 本公开将电磁屏蔽集成到晶片级扇出封装工艺中。 首先，提供具有多个模块的模具晶片。 每个模块包括一个具有I / O端口的模块，并被模块间区域包围。 包括耦合到每个模块的I / O端口的屏蔽连接元件的再分配结构形成在模具晶片的底表面上。 屏蔽连接元件从I / O端口横向延伸到每个模块的模块间区域。 接下来，在每个模块间区域对模具晶片进行子切割以形成空腔。 屏蔽连接元件的一部分然后通过每个空腔的底部暴露。 在模具晶片的顶表面和每个腔的暴露表面上形成屏蔽结构。 屏蔽结构与屏蔽连接的元件接触。

公开(公告)号：US20150036306A1

公开(公告)日：2015-02-05

申请号：US14517002

申请日：2014-10-17

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Mark Charles Held

IPC: H05K1/11 ,  H05K1/18 ,  H05K9/00

CPC classification number: H05K1/111 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8201 ,  H01L2224/82031 ,  H01L2224/82101 ,  H01L2224/82136 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/1443 ,  H01L2924/1461 ,  H01L2924/15159 ,  H01L2924/15787 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/284 ,  H05K9/0022 ,  H05K2201/0715 ,  H05K2201/10439 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2224/82 ,  H01L2924/014 ,  H01L2924/00

Abstract: A shielded electronic module is formed on a substrate. The substrate has a component area and one or more electronic components attached to the component area. One set of conductive pads may be attached to the component area and another set of conductive pads may be provided on the electronic component. The conductive pads on the component area are electrically coupled to the conductive pads of the electronic component by a conductive layer. A first insulating layer is provided over the component area and underneath the conductive layer that may insulate the electronic component and the substrate from the conductive layer. A second insulating layer is provided over the first insulating layer that covers at least the conductive layer. In this manner, the conductive layer is isolated from an electromagnetic shield formed over the component area.

Abstract translation: 屏蔽电子模块形成在基板上。 基板具有附接到部件区域的部件区域和一个或多个电子部件。 一组导电焊盘可以附接到部件区域，另外一组导电焊盘可以设置在电子部件上。 组件区域上的导电焊盘通过导电层电耦合到电子部件的导电焊盘。 第一绝缘层设置在导电层之上的部件区域和下方，可以使电子部件和衬底与导电层绝缘。 第二绝缘层设置在覆盖至少导电层的第一绝缘层上。 以这种方式，导电层与组件区域上形成的电磁屏蔽隔离。

公开(公告)号：US09807890B2

公开(公告)日：2017-10-31

申请号：US13906892

申请日：2013-05-31

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Joseph Byron Bullis

IPC: H05K3/40 ,  H05K1/14 ,  H01L23/31 ,  H01L23/00 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K3/4007 ,  H01L23/3135 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48229 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/144 ,  H05K3/284 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/10371 ,  Y10T29/4902 ,  Y10T29/49146 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.

公开(公告)号：US09570406B2

公开(公告)日：2017-02-14

申请号：US15080001

申请日：2016-03-24

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Dan Carey ,  Ma Shirley Asoy

IPC: H01L21/78 ,  H01L23/552 ,  H01L23/31 ,  H01L21/768 ,  H01L21/3105 ,  H01L21/268 ,  H01L21/683 ,  H01L21/56 ,  H01L21/3205 ,  H01L25/00 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L21/268 ,  H01L21/31058 ,  H01L21/4817 ,  H01L21/485 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/04105 ,  H01L2224/12105

Abstract: The present disclosure integrates electromagnetic shielding into a wafer level fan-out packaging process. First, a mold wafer having multiple modules is provided. Each module includes a die with an I/O port and is surrounded by an inter-module area. A redistribution structure that includes a shield connected element coupled to the I/O port of each module is formed over a bottom surface of the mold wafer. The shield connected element extends laterally from the I/O port into the inter-module area for each module. Next, the mold wafer is sub-diced at each inter-module area to create a cavity. A portion of the shield connected element is then exposed through the bottom of each cavity. A shielding structure is formed over a top surface of the mold wafer and exposed faces of each cavity. The shielding structure is in contact with the shield connected element.

Abstract translation: 本公开将电磁屏蔽集成到晶片级扇出封装工艺中。 首先，提供具有多个模块的模具晶片。 每个模块包括一个具有I / O端口的模块，并被模块间区域包围。 包括耦合到每个模块的I / O端口的屏蔽连接元件的再分配结构形成在模具晶片的底表面上。 屏蔽连接元件从I / O端口横向延伸到每个模块的模块间区域。 接下来，在每个模块间区域对模具晶片进行子切割以形成空腔。 屏蔽连接元件的一部分然后通过每个空腔的底部暴露。 在模具晶片的顶表面和每个腔的暴露表面上形成屏蔽结构。 屏蔽结构与屏蔽连接的元件接触。