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公开(公告)号：US20150325510A1
公开(公告)日：2015-11-12
申请号：US14461800
申请日：2014-08-18
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Woon Chul CHOI , Yong Sam LEE , Hwan Soo LEE
IPC: H01L23/498 , H01L21/48
CPC classification number: H01L23/49827 , H01F17/0013 , H01F27/292 , H01F41/046 , H01F2017/002 , H01F2017/0066 , H01F2027/2809 , H01L21/486 , H01L2924/0002 , H01L2924/00
Abstract: A chip electronic component may be capable of improving connectivity between internal coils formed on upper and lower surfaces of an insulating substrate and preventing loss of inductance due to the areas of via pads by decreasing sizes of the outermost via electrodes and decreasing sizes of the via pad.
Abstract translation: 芯片电子部件可以能够改善形成在绝缘基板的上表面和下表面上的内部线圈之间的连接性，并且通过减小最外通孔电极的尺寸和减小通孔焊盘的尺寸来防止由于通孔焊盘的面积导致的电感损失 。
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公开(公告)号：US20190180911A1
公开(公告)日：2019-06-13
申请号：US15961291
申请日：2018-04-24
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Hwan YANG , Yong Sam LEE , Young Seuck YOO
IPC: H01F27/28 , H01F27/29 , H01F27/245 , H01F27/255 , H01F41/061
Abstract: A winding-type inductor includes a body including a winding-type coil and first and second external electrodes disposed on external surfaces of the body. The body includes the winding-type coil, and first and second connection reinforcing portions are additionally arranged on first and second ends of the winding-type coil and directly connected to the first and second external electrodes.
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公开(公告)号：US20180158584A1
公开(公告)日：2018-06-07
申请号：US15665263
申请日：2017-07-31
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ho Sik PARK , Sang Jae LEE , Youn Soo SEO , Yong Sam LEE , Hye Yeon CHA , Jae Ha KIM
CPC classification number: H01F5/003 , H01F5/04 , H01F17/0013 , H01F41/041
Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.
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公开(公告)号：US20150129293A1
公开(公告)日：2015-05-14
申请号：US14537998
申请日：2014-11-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Hyeon CHO , Hyo Seung NAM , Yong Sam LEE , Seok Hwan AHN
CPC classification number: H05K1/0271 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15311 , H05K3/002 , H05K3/0029 , H05K3/0047 , H05K3/0052 , H05K3/007 , H05K3/429 , H05K3/4605 , H05K3/4644 , H05K2201/017 , H05K2201/0187 , H05K2201/0195 , H05K2201/0909 , H05K2201/09136 , H05K2201/09827 , H05K2201/09881 , H05K2201/2009 , H05K2203/1536 , H01L2224/81 , H01L2924/00
Abstract: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.
Abstract translation: 印刷电路板及其制造方法。 在一个实施例中，印刷电路板包括：由玻璃材料制成的芯; 围绕芯的绝缘体; 以及通过芯和绝缘体连接内部电路层的通孔。
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公开(公告)号：US20220013302A1
公开(公告)日：2022-01-13
申请号：US17095104
申请日：2020-11-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Youn Soo KIM , Hyun Sub OH , Hee Sung CHOI , Hong Kyu SHIN , Jin Ho HONG , Yong Sam LEE , Jung Youn KIM , Ran Suk YANG
Abstract: The present disclosure relates to a solid electrolytic capacitor, including a body comprising a tantalum wire disposed on one end thereof; a substrate, on which the body is disposed, comprising an insulating layer, first and second wiring layers respectively disposed on a first surface and a second surface, facing each other, of the insulating layer, and a via electrode penetrating the insulating layer to connect the first and second wiring layers to each other; and a connection portion connecting the tantalum wire to the first wiring layer.
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Patent Agency Ranking
公开(公告)号：US20180122546A1
公开(公告)日：2018-05-03
申请号：US15676446
申请日：2017-08-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Sam LEE , Eo Jin CHOI , Jae Hun KIM , Ji Hyun EOM , Hye Yeon CHA
CPC classification number: H01F27/02 , H01F17/0013 , H01F27/24 , H01F27/29 , H01F27/292 , H01F2017/048
Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.
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公开(公告)号：US20200058431A1
公开(公告)日：2020-02-20
申请号：US16664062
申请日：2019-10-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Sam LEE , Eo Jin CHOI , Jae Hun KIM , Ji Hyun EOM , Hye Yeon CHA
Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.
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公开(公告)号：US20190035533A1
公开(公告)日：2019-01-31
申请号：US15875298
申请日：2018-01-19
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Sam LEE
Abstract: An inductor includes a body including an insulating portion formed of a plurality of layers and a magnetic portion surrounding the insulating portion and external electrodes disposed on external surfaces of the body, and a method of manufacturing the same. A coil portion is embedded in the insulating portion, and has a structure in which coil patterns formed on a plurality of layers are stacked while being connected to each other.
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公开(公告)号：US20180242453A1
公开(公告)日：2018-08-23
申请号：US15712787
申请日：2017-09-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Sam LEE , Won Joong KIM
CPC classification number: H05K1/115 , H05K1/111 , H05K1/112 , H05K1/113 , H05K3/0038 , H05K3/0055 , H05K3/0094 , H05K3/427
Abstract: A method of manufacturing a substrate includes forming a through hole in a substrate only in one of a direction from a top surface to a bottom surface of the substrate or a direction from a bottom surface to a top surface of the substrate, removing a protruding portion of a metal layer provided in the substrate, protruding toward the through hole, and forming a plating layer on an inner surface of the substrate forming at least the through hole.
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公开(公告)号：US20150373841A1
公开(公告)日：2015-12-24
申请号：US14746308
申请日：2015-06-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Hyeon CHO , Yong Sam LEE , Tae Hong MIN , Young Gwan KO , Yoong OH , Joon Sung LEE
CPC classification number: H05K3/4605 , C03B33/074 , H05K1/0306 , H05K2201/09036 , H05K2201/09827 , Y10T83/0207 , Y10T428/24488
Abstract: A printed circuit board, according to one embodiment, includes: a core having a slope pattern formed on a side surface thereof; a first insulating layer laminated on the core; a second insulating layer laminated on the first insulating layer to cover the side surface of the core; an inner circuit layer and an outer circuit layer respectively formed on the first insulating layer and the second insulating layer; and a solder resist layer laminated on the second insulating layer.
Abstract translation: 根据一个实施例的印刷电路板包括：具有形成在其侧表面上的斜面图案的芯; 层叠在所述芯上的第一绝缘层; 层叠在所述第一绝缘层上以覆盖所述芯的侧表面的第二绝缘层; 分别形成在所述第一绝缘层和所述第二绝缘层上的内电路层和外电路层; 以及层叠在第二绝缘层上的阻焊层。
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