公开(公告)号：US20180116078A1

公开(公告)日：2018-04-26

申请号：US15789184

申请日：2017-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju MUN ,  Keon KUK ,  Ji-woon YEOM

IPC: H05K9/00 ,  H05K1/11 ,  H05K1/18 ,  H01L23/552 ,  H05K3/40

CPC classification number: H05K9/0024 ,  H01L23/552 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K3/284 ,  H05K3/321 ,  H05K3/4007 ,  H05K9/0039 ,  H05K2201/0919 ,  H05K2201/10371 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/163

Abstract: An EMI shielding structure includes a shielding pad surrounding at least one circuit component mounted on a printed circuit board and grounded to a ground pad disposed on the printed circuit board; and a shield can configured to cover the at least one circuit component, wherein a portion of the shield can is attached to the shielding pad.

公开(公告)号：US20160204073A1

公开(公告)日：2016-07-14

申请号：US14991800

申请日：2016-01-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： O-hyun BEAK ,  Keon KUK ,  Yong-chul KO ,  Woon-bae KIM

IPC: H01L23/552 ,  H05K1/18 ,  H01L21/56 ,  H01L21/02 ,  H01L23/48 ,  B05C5/00 ,  H01L23/29 ,  H01L21/3205 ,  H04W4/00 ,  H01L21/67 ,  B05C5/02 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/552 ,  B05C5/001 ,  B05C5/027 ,  H01L21/02255 ,  H01L21/32051 ,  H01L21/56 ,  H01L21/67115 ,  H01L23/291 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/14511 ,  H01L2924/15311 ,  H01L2924/15331 ,  H04W4/50 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Abstract translation: 半导体封装包括安装在基板上的半导体芯片，覆盖半导体芯片的至少一部分并且包括触变材料或热熔材料的绝缘层，以及覆盖半导体芯片的至少一部分的屏蔽层和 绝缘层。 制造半导体封装的方法包括通过使用三维打印机形成具有高纵横比的绝缘层和屏蔽层。

公开(公告)号：US20170349770A1

公开(公告)日：2017-12-07

申请号：US15540843

申请日：2015-12-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeon Kyoung JUNG ,  Keon KUK ,  Oh Hyun BEAK

IPC: C09D11/101 ,  B33Y70/00 ,  B33Y10/00 ,  B33Y30/00 ,  C09D11/322 ,  B29C64/112

CPC classification number: C09D11/101 ,  B29C64/112 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  C09D11/322

Abstract: The present invention relates to an ink composition for 3D printing, a 3D printer and a method of controlling the 3D printer. An ink composition for 3D printing according to an aspect of the present invention may include surface-modified inorganic particles, a photocurable material crosslinked with the surface-modified inorganic particles and a photoinitiator which cures the photocurable material.

公开(公告)号：US20170295679A1

公开(公告)日：2017-10-12

申请号：US15438008

申请日：2017-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyong-il KIM ,  Keon KUK ,  Il-ju MUN ,  O-hyun BEAK

IPC: H05K9/00 ,  B29C45/14 ,  H05K1/18

CPC classification number: H05K9/0088 ,  B29C45/14639 ,  B29K2101/12 ,  B29L2031/3425 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0022 ,  H01L2224/81

Abstract: An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

公开(公告)号：US20170292740A1

公开(公告)日：2017-10-12

申请号：US15511851

申请日：2015-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Hee Moon JEONG ,  Seong Ho KIL ,  Seok Uk KIM ,  Keon KUK ,  Yong Chan KIM ,  Jae Jun LEE ,  Yong Seok JEON

IPC: F25B29/00 ,  F25B49/02 ,  F25D17/04 ,  F25B40/04

CPC classification number: F25B29/003 ,  F24F5/00 ,  F25B5/02 ,  F25B5/04 ,  F25B9/08 ,  F25B13/00 ,  F25B40/00 ,  F25B40/04 ,  F25B40/06 ,  F25B49/02 ,  F25B49/027 ,  F25B2400/0403 ,  F25B2400/0409 ,  F25D11/00 ,  F25D17/04

Abstract: Disclosed herein is a refrigeration cycle includes a first refrigerant circuit configured to cause a refrigerant ejected from a compressor to flow through a condenser, an ejector, a first evaporator, and a second evaporator and flow back to the compressor; a second refrigerant circuit configured to cause the refrigerant to bypass the first evaporator in the first refrigerant circuit; and a third refrigerant circuit branching at a junction provided at a downstream end of the condenser from at least one of the first refrigerant circuit and the second refrigerant circuit, and configured to cause the refrigerant to flow through an expansion device and a third evaporator and flow to the ejector. By such configuration, a coefficient of performance (COP) of a refrigeration cycle may be improved and an ejector may be used to improve energy efficiency.

公开(公告)号：US20150094394A1

公开(公告)日：2015-04-02

申请号：US14502072

申请日：2014-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeon Kyoung JUNG ,  O Hyun Beak ,  Keon KUK ,  Eun Bong HAN ,  Yong Hyun LIM ,  Jong Youb RYU

IPC: C08L33/08 ,  B05D5/00 ,  B05C5/00

CPC classification number: C08L33/08 ,  B05C5/00 ,  B05D5/00 ,  B33Y30/00 ,  C08L2205/025 ,  C09D11/101 ,  C09D11/38 ,  C09D11/40 ,  C09D11/54

Abstract: A multi-color ink for 3D printing, a 3D printer, and a method of controlling the 3D printer are provided. The multi-color ink for 3D printing including a first ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, a first colorant, and an anti-intercolor bleed agent configured to prevent intercolor bleeding occurring when the plurality of ink compositions come into contact with each other, and a second ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, and a second colorant having an acid moiety involved in a reaction with the anti-intercolor bleed agent to cause aggregation. The multi-color ink for 3D printing may enable a clear image by inhibiting intercolor bleeding that occurs when ink compositions with different colors are printed to be adjacent to each other before curing during 3D printing.

Abstract translation: 提供了用于3D打印的多色油墨，3D打印机以及3D打印机的控制方法。 用于3D打印的多色油墨，包括包含可光固化材料的第一油墨组合物，被配置成固化可光固化材料的光引发剂，第一着色剂和抗间色渗色剂，其构造成防止当多个油墨 组合物彼此接触，并且包括光固化材料的第二油墨组合物，被配置成固化可光固化材料的光引发剂和具有与抗间色渗色剂反应的酸部分引起聚集的第二着色剂 。 用于3D印刷的多色油墨可以通过抑制在3D打印期间固化之前印刷具有不同颜色的油墨组合物彼此相邻而发生的色间渗色来实现清晰的图像。

公开(公告)号：US20230170355A1

公开(公告)日：2023-06-01

申请号：US18102375

申请日：2023-01-27

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  ENJET CO., LTD.

Inventor： Doyoung BYUN ,  Yonghee JANG ,  Keon KUK ,  Seongyong KIM ,  Jinwoo JUNG ,  Soonmin HONG ,  Tackmo LEE ,  Gyun HEO

IPC: H01L27/12 ,  H01L25/16

CPC classification number: H01L27/124 ,  H01L25/167 ,  H01L27/1288

Abstract: A display module includes a thin film transistor (TFT) substrate including a class substrate and a TFT layer provided on a front surface of the glass substrate, the TFT layer including a TFT circuit, a plurality of light emitting diodes provided on the TFT layer, a plurality of first connection pads provided at a distance from each other on the front surface of the glass substrate and connected to the TFT circuit, a plurality of second connection pads provided at a distance from each other on a rear surface of the glass substrate and connected to a second circuit, where the second circuit is configured to supply power and is connected to a control board, and a plurality of side wirings electrically connecting each of the plurality of first connection pads to respective connection pads of the plurality of second connection pads.

公开(公告)号：US20180042147A1

公开(公告)日：2018-02-08

申请号：US15488024

申请日：2017-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Il-ju MUN ,  Keon KUK ,  Ji-woon YEOM

IPC: H05K9/00 ,  H05K1/18

CPC classification number: H05K1/182 ,  B05D1/26 ,  B05D7/50 ,  H01L23/552 ,  H01L2224/16227 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K9/0024 ,  H05K2201/09972 ,  H05K2201/10204 ,  H05K2203/0126

Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a shielding dam provided on a printed circuit board, the shielding dam forming a closed loop that defines a periphery of adjacent shielding regions of the printed circuit board; an insulating member that is provided on the adjacent shielding regions within the shielding dam, the insulating member covering circuit devices provided in the adjacent shielding regions; and a shielding member that covers an upper surface of the insulating member, wherein the shielding dam includes a border portion surrounding the adjacent shielding regions, and a partition portion disposed between the adjacent shielding regions and within the border portion.

公开(公告)号：US20170325365A1

公开(公告)日：2017-11-09

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon KUK ,  Il-ju MUN ,  Ji-woon YEOM ,  Yeon-kyoung JUNG ,  Kyong-il KIM

IPC: H05K9/00 ,  H05K3/30

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US20150260433A1

公开(公告)日：2015-09-17

申请号：US14657097

申请日：2015-03-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woo Hyek CHOI ,  Il Ju MUN ,  Keon KUK ,  Min Soo KIM

IPC: F25B21/00

CPC classification number: F25B21/00 ,  F25B2321/0022 ,  Y02B30/66

Abstract: A magnetic cooling apparatus includes first magnetic regenerators that pass a first heat transfer fluid and a first magnetocaloric material, second magnetic regenerators that pass a second heat transfer fluid having a relative lower freezing point than the first heat transfer fluid and a second magnetocaloric material having a relative lower Curie temperature than the first magnetocaloric material, a magnet that applies a magnetic field to the first magnetic regenerators and the second magnetic regenerators, a hot side heat exchanger allowing the first heat transfer fluid to emit heat, a cold side heat exchanger allowing the second heat transfer fluid to absorb heat, and an intermediate heat exchanger allowing the first heat transfer fluid flowing between cold sides of the first magnetic regenerators and the second heat transfer fluid passing through hot sides of the second magnetic regenerators to exchange heat with each other.

Abstract translation: 磁性冷却装置包括通过第一传热流体和第一磁热材料的第一磁性再生器，通过具有比第一传热流体相对低的凝固点的第二传热流体的第二磁性再生器和具有第一热电材料的第二磁热材料， 比第一磁热材料相对较低的居里温度，向第一磁性再生器和第二磁性再生器施加磁场的磁体，允许第一传热流体发热的热侧热交换器，允许 第二传热流体吸收热量;以及中间热交换器，其允许在第一磁性再生器的冷侧之间流动的第一传热流体和通过第二磁性再生器的热侧的第二传热流体彼此交换热量。