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55 条记录 (耗时 0.04 秒)

    Cooling device and electronic device
    5.
    发明授权
    Cooling device and electronic device 有权
    冷却装置和电子装置

    公开(公告)号：US09240365B2

    公开(公告)日：2016-01-19

    申请号：US13255964

    申请日：2010-03-12

    申请人： Kenji Ohsawa ,  Katsuya Tsuruta

    发明人： Kenji Ohsawa ,  Katsuya Tsuruta

    IPC分类号： F25B41/06 ,  H01L23/427 ,  F28D15/02 ,  F28D15/04

    CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/046 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A cooling device is disclosed. The cooling device includes a thermal diffusing unit operable to radiate heat taken from a heating element, and a heat transporting part, laminated in a thickness direction of the heat diffusing unit and diffused thereby. The thermal diffusing unit has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. The heat transporting part has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. Either the upper plate or the lower plate is formed with the same member of the lower plate or the upper plate of the heat transporting part.

    摘要翻译： 公开了一种冷却装置。 冷却装置包括热扩散单元，其可操作以辐射从加热元件获取的热量，以及传热部件，其在热扩散单元的厚度方向上层叠并由此散热。 热扩散单元具有上板，与其相对的下板，用于扩散蒸发的制冷剂的蒸气扩散路径和使冷凝的制冷剂循环的毛细通道。 传热部具有上板，与其相对的下板，用于扩散蒸发的制冷剂的蒸气扩散路径和使冷凝的制冷剂循环的毛细通道。 上板或下板都由下板的同一部件或热传输部的上板形成。

    Heat sink package and method of manufacturing
    6.
    发明授权
    Heat sink package and method of manufacturing 有权
    散热片包装及制造方法

    公开(公告)号：US08988882B2

    公开(公告)日：2015-03-24

    申请号：US13259563

    申请日：2010-03-24

    申请人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

    发明人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

    IPC分类号： H05K7/20 ,  H01L23/498 ,  H01L23/367 ,  H01L23/433 ,  H05K1/00 ,  H01L21/48

    CPC分类号： H01L23/49816 ,  H01L21/4867 ,  H01L23/367 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2924/15321 ,  Y10T29/4913

    摘要： A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.

    摘要翻译： 电路元件设置在有机基板上并连接到布置在有机基板上的布线图案。 通过电铸在导电性支撑体上形成内部连接电极，以获得内部连接电极和支撑体的整体块。 通过支撑体连接到整体块的每个内部连接电极的每个端部连接到布线图案。 在电路元件被树脂密封之后，剥离支撑体，以分别获得单独的内部连接电极，并且将每个内部连接电极的另一端用作前表面上的外部连接电极，而外部 后表面上的连接电极连接到布线图案。

    HEAT TRANSPORTING UNIT AND ELECTRONIC DEVICE
    7.
    发明申请
    HEAT TRANSPORTING UNIT AND ELECTRONIC DEVICE 审中-公开
    热输送单元和电子设备

    公开(公告)号：US20120211207A1

    公开(公告)日：2012-08-23

    申请号：US13389632

    申请日：2010-08-11

    申请人： Kenji Ohsawa ,  Katsuya Tsuruta

    发明人： Kenji Ohsawa ,  Katsuya Tsuruta

    IPC分类号： F28F3/12

    CPC分类号： F28D15/0233 ,  F28D15/046

    摘要： A heat transporting unit comprises an upper plate, a lower plate opposing the upper plate, an internal space formed by the upper plate and the lower plate and operable to enter a refrigerant, a plurality of paths dividing the internal space in a first direction, and a plurality of grooves being provided at a bottom surface of the internal space. The plurality of the paths and the plurality of the grooves are connected by capillary channels in a region, and are divided by sidewalls in another region.

    摘要翻译： 传热单元包括上板，与上板相对的下板，由上板和下板形成并可操作以进入制冷剂的内部空间，沿第一方向分割内部空间的多个路径，以及 多个凹槽设置在内部空间的底表面处。 多个路径和多个槽通过毛细通道在一个区域中连接，并且由另一区域中的侧壁划分。

    RECORDING MEDIUM REPRODUCING DEVICE AND REPRODUCING METHOD
    8.
    发明申请
    RECORDING MEDIUM REPRODUCING DEVICE AND REPRODUCING METHOD 审中-公开
    记录介质再现设备和再现方法

    公开(公告)号：US20100189415A1

    公开(公告)日：2010-07-29

    申请号：US12160924

    申请日：2007-01-16

    申请人： Kenji Ohsawa

    发明人： Kenji Ohsawa

    IPC分类号： H04N5/91

    CPC分类号： G11B27/11 ,  G11B27/105 ,  G11B2220/2562 ,  G11B2220/65

    摘要： [Problems] An object of the present invention is to perform switching of audio and subtitle and so on automatically or by simple operation when a recording medium such as a DVD, on which a plurality of streams of audio and subtitle are recorded, is reproduced.[Means for Solving Problems] A playback pattern based on combination of streams of video, audio, and subtitle which was reproduced in the past is stored in a flash memory 12. Then, a microcontroller 10 makes an audio/video/subtitle processing section 7 reproduce a playback pattern based on combination of the streams different from the playback pattern stored in the flash memory 12.

    摘要翻译： 发明内容本发明的目的在于，当再现记录有多个音频和字幕流的诸如DVD的记录介质时，自动或通过简单的操作来执行音频和字幕等的切换。 解决问题的手段将过去再现的基于视频，音频和副标题的流的组合的重放模式存储在闪速存储器12中。然后，微控制器10使音频/视频/字幕处理部分7 基于与存储在闪速存储器12中的重放模式不同的流的组合再现播放模式。

    Method of manufacturing lead frame having inner lead connected to outer lead by metal etch stop layer
    9.
    发明授权
    Method of manufacturing lead frame having inner lead connected to outer lead by metal etch stop layer 失效
    制造引线框架的方法，其具有通过金属蚀刻停止层连接到外部引线的内部引线

    公开(公告)号：US5937278A

    公开(公告)日：1999-08-10

    申请号：US732817

    申请日：1996-10-15

    申请人： Makoto Ito ,  Kenji Ohsawa ,  Mutsumi Nagano

    发明人： Makoto Ito ,  Kenji Ohsawa ,  Mutsumi Nagano

    IPC分类号： H01L21/48 ,  H01L23/495 ,  H01L21/44 ,  H01L21/60

    CPC分类号： H01L21/4828 ,  H01L23/49524 ,  H01L2924/0002 ,  H01L2924/16195

    摘要： A method of manufacturing a lead frame comprises the steps of preparing a three-layered material comprising a metal base, an etching stopper layer made of a metal material different from that of the metal layer formed on a first surface of the metal base and a chromium layer formed on the etching stopper layer, forming a resist layer having a negative pattern relative to an inner lead to be formed on the chromium layer of the three-layered material, forming an inner lead by plating copper by using the resist layer as a mask, forming an outer lead on the metal base, removing a back of a region in which an inner lead of the metal base is formed by etching, removing the etching stopper layer, and removing the chromium layer.

    摘要翻译： 制造引线框架的方法包括以下步骤：制备包括金属基底的三层材料，由与金属基底的第一表面上形成的金属层不同的金属材料制成的蚀刻阻挡层和铬 形成在蚀刻停止层上的层，形成相对于在三层材料的铬层上形成的内部引线具有负图案的抗蚀剂层，通过使用抗蚀剂层作为掩模，通过电镀铜形成内部引线 在金属基底上形成外部引线，通过蚀刻除去金属基底的内部引线的区域的背面，去除蚀刻停止层，以及去除铬层。

    HEAT SINK PACKAGE AND METHOD OF MANUFACTURING
    10.
    发明申请
    HEAT SINK PACKAGE AND METHOD OF MANUFACTURING 审中-公开
    散热封装及其制造方法

    公开(公告)号：US20120127667A1

    公开(公告)日：2012-05-24

    申请号：US13259563

    申请日：2010-03-24

    申请人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

    发明人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

    IPC分类号： H05K7/20 ,  H05K3/32

    CPC分类号： H01L23/49816 ,  H01L21/4867 ,  H01L23/367 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2924/15321 ,  Y10T29/4913

    摘要： A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.

    摘要翻译： 电路元件设置在有机基板上并连接到布置在有机基板上的布线图案。 通过电铸在导电性支撑体上形成内部连接电极，以获得内部连接电极和支撑体的整体块。 通过支撑体连接到整体块的每个内部连接电极的每个端部连接到布线图案。 在电路元件被树脂密封之后，剥离支撑体，以分别获得单独的内部连接电极，并且将每个内部连接电极的另一端用作前表面上的外部连接电极，而外部 后表面上的连接电极连接到布线图案。