公开(公告)号：US4987004A

公开(公告)日：1991-01-22

申请号：US522129

申请日：1990-05-11

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

IPC分类号： C23C16/517 ,  H01J37/32 ,  H01J37/34

CPC分类号： H01J37/32082 ,  C23C16/517 ,  H01J37/32165 ,  H01J37/32568 ,  H01J37/34 ,  H01J2237/3321

摘要： A plasma process and an apparatus therefor are described. A number of substrates are disposed between a pair of electrodes, to which a high frequency electric power is applied in order to generate glow discharge and induce a plasma. The substrates in the plasma are applied with an alternating electric field. By virtue of the alternating electric field, the substrates are subjected to sputtering action.

公开(公告)号：US5283087A

公开(公告)日：1994-02-01

申请号：US863543

申请日：1992-04-06

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

IPC分类号： C23C16/517 ,  H01J37/32 ,  H01J37/34 ,  B05D3/06 ,  C23C16/00 ,  C25F3/00

CPC分类号： H01J37/32082 ,  C23C16/517 ,  H01J37/32165 ,  H01J37/32568 ,  H01J37/34 ,  H01J2237/3321

摘要： A plasma process and an apparatus therefor are described. A number of substrates are disposed between a pair of electrodes, to which a high frequency electric power is applied in order to generate glow discharge and induce a plasma. The substrates in the plasma are applied with an alternating electric field. By virtue of the alternating electric field, the substrates are subjected to sputtering action.

摘要翻译： 对等离子体处理及其装置进行说明。 多个基板设置在一对电极之间，施加高频电力以产生辉光放电并诱导等离子体。 等离子体中的衬底被施加交变电场。 由于交变电场，基板受到溅射作用。

公开(公告)号：US5256483A

公开(公告)日：1993-10-26

申请号：US606185

申请日：1990-10-31

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

IPC分类号： C23C16/517 ,  H01J37/32 ,  H01J37/34 ,  B32B9/00

CPC分类号： H01J37/32082 ,  C23C16/517 ,  H01J37/32165 ,  H01J37/32568 ,  H01J37/34 ,  H01J2237/3321 ,  Y10S428/906 ,  Y10T428/30

摘要： A plasma process and an apparatus therefor are described. A number of substrates are disposed between a pair of electrodes, to which a high frequency electric power is applied in order to generate glow discharge and induce a plasma. The substrates in the plasma are applied with an alternating electric field. By virtue of the alternating electric field, the substrates are subjected to sputtering action.

摘要翻译： 对等离子体处理及其装置进行说明。 多个基板设置在一对电极之间，施加高频电力以产生辉光放电并诱导等离子体。 等离子体中的衬底被施加交变电场。 由于交变电场，基板受到溅射作用。

公开(公告)号：US4971667A

公开(公告)日：1990-11-20

申请号：US303240

申请日：1989-02-03

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Toshiji Hamatani ,  Takashi Inushima ,  Kenji Itou

IPC分类号： C23C16/517 ,  H01J37/32 ,  H01J37/34

CPC分类号： H01J37/32082 ,  C23C16/517 ,  H01J37/32165 ,  H01J37/32568 ,  H01J37/34 ,  H01J2237/3321

摘要： A plasma process and an apparatus therefor are described. A number of substrates are disposed between a pair of electrodes, to which a high frequency electromagnetic power is applied in order to generate glow discharge and induce a plasma. The substrates in the plasma are additionally applied with an alternating electric field. By virtue of the alternating electric field, the substrates are subjected to sputtering action.

公开(公告)号：US5079031A

公开(公告)日：1992-01-07

申请号：US324669

申请日：1989-03-17

申请人： Shunpei Yamazaki ,  Shinji Imatou ,  Noriya Ishida ,  Mari Sasaki ,  Mitsunori Sakama ,  Takeshi Fukada ,  Naoki Hirose ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Kazuhisa Nakashita ,  Junichi Takeyama ,  Toshiji Hamatani

发明人： Shunpei Yamazaki ,  Shinji Imatou ,  Noriya Ishida ,  Mari Sasaki ,  Mitsunori Sakama ,  Takeshi Fukada ,  Naoki Hirose ,  Mitsunori Tsuchiya ,  Atsushi Kawano ,  Kazuhisa Nakashita ,  Junichi Takeyama ,  Toshiji Hamatani

IPC分类号： C23C16/517 ,  H01J37/32

CPC分类号： H01J37/3244 ,  C23C16/517 ,  H01J37/32082 ,  H01J37/32568 ,  H01J2237/3321

摘要： An improved apparatus and method for depositing thin films on a substrate. The apparatus utilizes two types of energy input. A pair of electrodes are provided in a reaction chamber and supplied with first AC electric energy at 1 to 100 MHz for generating a plasma gas in a reaction chamber therebetween. The substrate is mounted on a substrate holder to which second electric energy is supplied.

公开(公告)号：US5007374A

公开(公告)日：1991-04-16

申请号：US324668

申请日：1989-03-17

申请人： Shunpei Yamazaki ,  Shinji Imatou ,  Mitsunori Tsuchiya ,  Kenji Itoh ,  Takashi Inushima ,  Atsushi Kawano

发明人： Shunpei Yamazaki ,  Shinji Imatou ,  Mitsunori Tsuchiya ,  Kenji Itoh ,  Takashi Inushima ,  Atsushi Kawano

IPC分类号： H01L21/205 ,  C23C16/26 ,  C23C16/517 ,  H01L21/31

CPC分类号： C23C16/517 ,  C23C16/26

摘要： An apparatus suitable for mass-production of carbon coatings having a high degree of hardness. The apparatus utilized two types of energy input. First energy is inputted to a pair of electrodes provided in a reaction chamber, between which electrodes a deposition space is defined. A number of substrates to be coated are mounted on a plurality of substrate holders which are supplied with a second electric energy. The holders are arranged parallel to the electric field to prevent disturbance of the electric field.

摘要翻译： 适用于大规模生产硬度高的碳涂层的设备。 该装置使用两种类型的能量输入。 将第一能量输入到设置在反应室中的一对电极，在该电极之间限定了沉积空间。 待涂覆的多个基板安装在被提供有第二电能的多个基板保持器上。 保持器平行于电场布置以防止电场的干扰。

公开(公告)号：US06191492B1

公开(公告)日：2001-02-20

申请号：US08161859

申请日：1993-12-06

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L2328

CPC分类号： H01L24/48 ,  H01L23/3135 ,  H01L23/49586 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/05042 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制件，其中所述有机树脂的表面设置有硬化防水或 碳质膜或其中有机树脂表面的孔被填充在惰性气体如氩气中，因为用惰性气体等离子体处理树脂表面，从而防止杂质通过孔进入有机树脂。

公开(公告)号：US06756670B1

公开(公告)日：2004-06-29

申请号：US09698055

申请日：2000-10-30

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L2306

CPC分类号： H01L23/49586 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3135 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/8592 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2924/00012

摘要： An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制件，其中所述有机树脂的表面设置有硬化防水或 碳质膜或其中有机树脂表面的孔被填充在惰性气体如氩气中，因为用惰性气体等离子体处理树脂表面，从而防止杂质通过孔进入有机树脂。

公开(公告)号：US5147822A

公开(公告)日：1992-09-15

申请号：US667231

申请日：1991-02-25

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/49586 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3135 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181

摘要： An electronic device comprising a substrate having a frame, a metal lead and electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制品，其中所述有机树脂的表面设置有硬化的耐水或含碳的 电影。

公开(公告)号：US5013688A

公开(公告)日：1991-05-07

申请号：US385155

申请日：1989-07-26

申请人： Shunepi Yamazaki ,  Kazuo Urata ,  Itaru Koyama ,  Noriya Ishida ,  Mari Sasaki ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Naoki Hirose

发明人： Shunepi Yamazaki ,  Kazuo Urata ,  Itaru Koyama ,  Noriya Ishida ,  Mari Sasaki ,  Shinji Imatou ,  Kazuhisa Nakashita ,  Naoki Hirose

IPC分类号： H01L21/316 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/48 ,  H01L21/56 ,  H01L23/3135 ,  H01L23/49586 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/8592 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  Y10T29/49121

摘要： An improved electric device and manufacturing method for the same are described. The device is, for example, an IC chip clothed with moulding. In advance of the moulding process, the IC chip is coated with silicon nitride in order to protect the IC chip from moisture invaded through cracks or gaps. The coating of silicon nitride is carried out after cleaning the surface of the IC chip by plasma CVD.

摘要翻译： 描述了一种改进的电气装置及其制造方法。 该装置例如是具有成型的IC芯片。 在模制过程之前，IC芯片被涂覆有氮化硅，以保护IC芯片免受通过裂纹或间隙侵入的水分。 在通过等离子体CVD清洁IC芯片的表面之后进行氮化硅涂层。