公开(公告)号：US11755899B2

公开(公告)日：2023-09-12

申请号：US16751202

申请日：2020-01-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G11C16/04 ,  G06N3/065 ,  G06F17/16 ,  G11C16/10 ,  G11C16/34 ,  G11C16/26 ,  G11C11/56 ,  G11C16/14 ,  G06N3/044

CPC classification number: G06N3/065 ,  G06F17/16 ,  G06N3/044 ,  G11C11/5628 ,  G11C11/5635 ,  G11C16/0425 ,  G11C16/10 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3459 ,  G11C2216/04

Abstract: Numerous embodiments of a precision programming algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.

公开(公告)号：US11682459B2

公开(公告)日：2023-06-20

申请号：US17082956

申请日：2020-10-28

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Stanley Hong ,  Stephen Trinh ,  Thuan Vu ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do

IPC: G11C16/10 ,  G11C16/04 ,  G11C16/34 ,  G11C11/56 ,  G11C16/14 ,  G06N3/065

CPC classification number: G11C16/10 ,  G06N3/065 ,  G11C11/5628 ,  G11C16/0425 ,  G11C16/0433 ,  G11C16/14 ,  G11C16/3459

Abstract: Two or more physical memory cells are grouped together to form a logical cell that stores one of N possible levels. Within each logical cell, the memory cells can be programmed using different mechanisms. For example, one or more of the memory cells in a logical cell can be programmed using a coarse programming mechanism, one or more of the memory cells can be programmed using a fine mechanism, and one or more of the memory cells can be programmed using a tuning mechanism. This achieves extreme programming accuracy and programming speed.

公开(公告)号：US20210407588A1

公开(公告)日：2021-12-30

申请号：US17471099

申请日：2021-09-09

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G11C11/54 ,  H01L27/11521 ,  H01L29/423 ,  G11C16/04 ,  G06N3/04 ,  G11C16/10 ,  G11C16/14 ,  H01L29/788

Abstract: A neural network device with synapses having memory cells each having a floating gate and a first gate over first and second portions of a channel region disposed between source and drain regions, and a second gate over the floating gate or the source region. First lines each electrically connect the first gates in one of the memory cell rows, second lines each electrically connect the second gates in one of the memory cell rows, third lines each electrically connect the source regions in one of the memory cell columns, and fourth lines each electrically connect the drain regions in one of the memory cell columns. The synapses receive a first plurality of inputs as electrical voltages on the first or second lines, and provide a first plurality of outputs as electrical currents on the third or fourth lines.

公开(公告)号：US11183506B2

公开(公告)日：2021-11-23

申请号：US17005139

申请日：2020-08-27

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho Kim ,  Xian Liu ,  Feng Zhou ,  Parviz Ghazavi ,  Steven Lemke ,  Nhan Do

IPC: H01L27/11536 ,  H01L29/66 ,  H01L21/3205 ,  H01L27/11521 ,  H01L27/12 ,  H01L21/84 ,  H01L21/3213 ,  H01L29/08 ,  H01L29/423 ,  H01L21/28 ,  H01L21/027 ,  H01L21/3105 ,  H01L21/265 ,  H01L21/321

Abstract: A method of forming a semiconductor device where memory cells and some logic devices are formed on bulk silicon while other logic devices are formed on a thin silicon layer over insulation over the bulk silicon of the same substrate. The memory cell stacks, select gate poly, and source regions for the memory devices are formed in the memory area before the logic devices are formed in the logic areas. The various oxide, nitride and poly layers used to form the gate stacks in the memory area are formed in the logic areas as well. Only after the memory cell stacks and select gate poly are formed, and the memory area protected by one or more protective layers, are the oxide, nitride and poly layers used to form the memory cell stacks removed from the logic areas, and the logic devices are then formed.

公开(公告)号：US20210090654A1

公开(公告)日：2021-03-25

申请号：US17095661

申请日：2020-11-11

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Nhan Do ,  Vipin Tiwari ,  Mark Reiten

IPC: G11C16/04 ,  G06F17/16 ,  G06N3/063

Abstract: Numerous embodiments are disclosed for providing temperature compensation in an analog memory array. A method and related system are disclosed for compensating for temperature changes in an array of memory cells by measuring an operating temperature within the array of memory cells and changing a threshold voltage of a selected memory cell in the array of memory cells to compensate for a change in the operating temperature.

公开(公告)号：US10790292B2

公开(公告)日：2020-09-29

申请号：US16057749

申请日：2018-08-07

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho Kim ,  Xian Liu ,  Feng Zhou ,  Parviz Ghazavi ,  Steven Lemke ,  Nhan Do

IPC: H01L27/11521 ,  H01L21/027 ,  H01L27/11536 ,  H01L29/66 ,  H01L27/12 ,  H01L21/84 ,  H01L21/3205 ,  H01L21/3213 ,  H01L29/08 ,  H01L29/423 ,  H01L21/28 ,  H01L21/3105 ,  H01L21/265 ,  H01L21/321

Abstract: A method of forming a semiconductor device where memory cells and some logic devices are formed on bulk silicon while other logic devices are formed on a thin silicon layer over insulation over the bulk silicon of the same substrate. The memory cell stacks, select gate poly, and source regions for the memory devices are formed in the memory area before the logic devices are formed in the logic areas. The various oxide, nitride and poly layers used to form the gate stacks in the memory area are formed in the logic areas as well. Only after the memory cell stacks and select gate poly are formed, and the memory area protected by one or more protective layers, are the oxide, nitride and poly layers used to form the memory cell stacks removed from the logic areas, and the logic devices are then formed.

公开(公告)号：US10741568B2

公开(公告)日：2020-08-11

申请号：US16231231

申请日：2018-12-21

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G06N3/04 ,  G06F3/06 ,  H01L27/115 ,  H01L29/788 ,  H01L27/11531 ,  G06N3/08 ,  G11C16/04

Abstract: Numerous embodiments of a precision tuning algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.

公开(公告)号：US20180145253A1

公开(公告)日：2018-05-24

申请号：US15727776

申请日：2017-10-09

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  Xian Liu ,  Steven Lemke ,  Santosh Hariharan ,  Hieu Van Tran ,  Nhan Do

IPC: H01L45/00

CPC classification number: H01L45/1608 ,  H01L45/04 ,  H01L45/1233 ,  H01L45/1253 ,  H01L45/146 ,  H01L45/16 ,  H01L45/1675

Abstract: A method of forming a memory device includes forming a first layer of conductive material having opposing upper and lower surfaces, forming a layer of amorphous silicon on the upper surface of the first layer of conductive material, stripping away the layer of amorphous silicon, wherein some of the amorphous silicon remains in the upper surface of the first layer of conductive material, forming a layer of transition metal oxide material on the upper surface of the first layer of conductive material, and forming a second layer of conductive material on the layer of transition metal oxide material. The method smoothes the upper surface of the bottom electrode, and also provides an bottom electrode upper surface with stable material that is hard to oxidize.

公开(公告)号：US20180033482A1

公开(公告)日：2018-02-01

申请号：US15597709

申请日：2017-05-17

Applicant: Silicon Storage Technology, Inc. ,  Agency For Science, Technology, and Research

Inventor： Santosh Hariharan ,  Hieu Van Tran ,  Feng Zhou ,  Xian Liu ,  Steven Lemke ,  Nhan Do ,  Zhixian Chen ,  Xinpeng Wang

IPC: G11C13/00 ,  H01L27/24 ,  H01L45/00

CPC classification number: G11C13/0011 ,  G11C11/00 ,  G11C13/0007 ,  G11C13/0064 ,  G11C13/0069 ,  G11C2013/0066 ,  G11C2013/0078 ,  G11C2013/0083 ,  G11C2013/0088 ,  G11C2013/0092 ,  G11C2213/79 ,  H01L27/2436 ,  H01L27/2463 ,  H01L45/04 ,  H01L45/085 ,  H01L45/146

Abstract: A memory device includes a metal oxide material disposed between and in electrical contact with first and second conductive electrodes, and an electrical current source configured to apply one or more electrical current pulses through the metal oxide material. For each of the one or more electrical current pulses, an amplitude of the electrical current increases over time during the electrical current pulse to form a conductive filament in metal oxide material.

公开(公告)号：US12249368B2

公开(公告)日：2025-03-11

申请号：US18645184

申请日：2024-04-24

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Steven Lemke ,  Vipin Tiwari ,  Nhan Do ,  Mark Reiten

IPC: G11C11/54 ,  G06N3/045 ,  G11C16/04 ,  G11C16/10 ,  G11C16/14 ,  H01L29/423 ,  H01L29/788 ,  H10B41/30

Abstract: A neural network device with synapses having memory cells each having a floating gate and a first gate over first and second portions of a channel region disposed between source and drain regions, and a second gate over the floating gate or the source region. First lines each electrically connect the first gates in one of the memory cell rows, second lines each electrically connect the second gates in one of the memory cell rows, third lines each electrically connect the source regions in one of the memory cell rows, and fourth lines each electrically connect the drain regions in one of the memory cell columns. The synapses receive a first plurality of inputs as electrical voltages on the fourth lines, and provide a first plurality of outputs as electrical currents on the third lines.