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    CAPACITIVE/RESISTIVE DEVICES, ORGANIC DIELECTRIC LAMINATES AND PRINTED WIRING BOARDS INCORPORATING SUCH DEVICES, AND METHODS OF MAKING THEREOF
    2.
    发明申请
    CAPACITIVE/RESISTIVE DEVICES, ORGANIC DIELECTRIC LAMINATES AND PRINTED WIRING BOARDS INCORPORATING SUCH DEVICES, AND METHODS OF MAKING THEREOF 有权
    电容/电阻器件，有机电介质层压板和印制这样的器件的布线板及其制造方法

    公开(公告)号：US20080297274A1

    公开(公告)日：2008-12-04

    申请号：US12188271

    申请日：2008-08-08

    申请人： WILLIAM J. BORLAND ,  G. Sidney Cox ,  David Ross McGregor

    发明人： WILLIAM J. BORLAND ,  G. Sidney Cox ,  David Ross McGregor

    IPC分类号： H03H7/00 ,  H01G4/00

    CPC分类号： H05K1/167 ,  H05K1/162 ,  H05K3/429 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09672 ,  H05K2201/09763 ,  H05K2203/0361 ,  H05K2203/1461 ,  Y10T29/435

    摘要： This invention relates to a capacitive/resistive device, which may be embedded within a layer of a printed wiring board. Embedding the device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. More specifically, the device, comprises a first metallic foil; a second metallic foil; a first electrode formed from the first metallic foil; a dielectric disposed over the first electrode; a resistor element formed on and adjacent to the dielectric; a conductive trace; and a second electrode formed from the second metallic foil and disposed over the dielectric and in electrical contact with the resistor element, wherein the dielectric is disposed between the first electrode and the second electrode and wherein said dielectric comprises an unfilled polymer of dielectric constant less than 4.0.

    摘要翻译： 本发明涉及可以嵌入在印刷线路板的层内的电容/电阻装置。 嵌入器件节省了电路板表面的空间，并减少了焊接连接的数量，从而提高了可靠性。 更具体地，该装置包括第一金属箔; 第二金属箔; 由所述第一金属箔形成的第一电极; 设置在所述第一电极上的电介质; 形成在电介质上并与电介质相邻的电阻元件; 导电迹线 以及由所述第二金属箔形成并且设置在所述电介质上并与所述电阻元件电接触的第二电极，其中所述电介质设置在所述第一电极和所述第二电极之间，并且其中所述电介质包括介电常数小于 4.0。

    Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
    4.
    发明授权
    Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof 有权
    电容/电阻装置，有机介电层压板和包含这种装置的印刷线路板及其制造方法

    公开(公告)号：US07813141B2

    公开(公告)日：2010-10-12

    申请号：US12188271

    申请日：2008-08-08

    申请人： William J. Borland ,  G. Sidney Cox ,  David Ross McGregor

    发明人： William J. Borland ,  G. Sidney Cox ,  David Ross McGregor

    IPC分类号： H05K1/16

    CPC分类号： H05K1/167 ,  H05K1/162 ,  H05K3/429 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09672 ,  H05K2201/09763 ,  H05K2203/0361 ,  H05K2203/1461 ,  Y10T29/435

    摘要： This invention relates to a capacitive/resistive device, which may be embedded within a layer of a printed wiring board. Embedding the device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. More specifically, the device, comprises a first metallic foil; a second metallic foil; a first electrode formed from the first metallic foil; a dielectric disposed over the first electrode; a resistor element formed on and adjacent to the dielectric; a conductive trace; and a second electrode formed from the second metallic foil and disposed over the dielectric and in electrical contact with the resistor element, wherein the dielectric is disposed between the first electrode and the second electrode and wherein said dielectric comprises an unfilled polymer of dielectric constant less than 4.0.

    摘要翻译： 本发明涉及可以嵌入在印刷线路板的层内的电容/电阻装置。 嵌入器件节省了电路板表面的空间，并减少了焊接连接的数量，从而提高了可靠性。 更具体地，该装置包括第一金属箔; 第二金属箔; 由所述第一金属箔形成的第一电极; 设置在所述第一电极上的电介质; 形成在电介质上并与其相邻的电阻元件; 导电迹线 以及由所述第二金属箔形成并且设置在所述电介质上并与所述电阻元件电接触的第二电极，其中所述电介质设置在所述第一电极和所述第二电极之间，并且其中所述电介质包括介电常数小于 4.0。

    Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
    5.
    发明授权
    Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof 有权
    电容/电阻装置，有机介电层压板和包含这种装置的印刷线路板及其制造方法

    公开(公告)号：US07430128B2

    公开(公告)日：2008-09-30

    申请号：US10967541

    申请日：2004-10-18

    申请人： William J. Borland ,  G. Sidney Cox ,  David Ross McGregor

    发明人： William J. Borland ,  G. Sidney Cox ,  David Ross McGregor

    IPC分类号： H05K1/16

    CPC分类号： H05K1/167 ,  H05K1/162 ,  H05K3/429 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09672 ,  H05K2201/09763 ,  H05K2203/0361 ,  H05K2203/1461 ,  Y10T29/435

    摘要： This invention relates to a capacitive/resistive device, which may be embedded within a layer of a printed wiring board. Embedding the device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. More specifically, the device, comprises a first metallic foil; a second metallic foil; a first electrode formed from the first metallic foil; a dielectric disposed over the first electrode, a resistor element formed on and adjacent to the dielectric; a conductive trace; and a second electrode formed from the second metallic foil and disposed over the dielectric and in electrical contact with the resistor element, wherein the dielectric is disposed between the first electrode and the second electrode and wherein said dielectric comprises an unfilled polymer of dielectric constant less than 4.0. This invention also relates to a method of making the device.

    摘要翻译： 本发明涉及可以嵌入在印刷线路板的层内的电容/电阻装置。 嵌入器件节省了电路板表面的空间，并减少了焊接连接的数量，从而提高了可靠性。 更具体地，该装置包括第一金属箔; 第二金属箔; 由所述第一金属箔形成的第一电极; 设置在所述第一电极上的电介质; 形成在电介质上并与其相邻的电阻元件; 导电迹线 以及由所述第二金属箔形成并且设置在所述电介质上并与所述电阻元件电接触的第二电极，其中所述电介质设置在所述第一电极和所述第二电极之间，并且其中所述电介质包括介电常数小于 4.0。 本发明还涉及制造该装置的方法。