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公开(公告)号：US20110242781A1
公开(公告)日：2011-10-06
申请号：US13034520
申请日：2011-02-24
IPC分类号： H05K7/00
CPC分类号： H05K7/00 , G01R31/2853 , G01R31/31717
摘要： According to one embodiment, a module includes a circuit substrate having a circuit pattern which is formed of a first conductor and which includes a signal circuit, a bonding member formed of a second conductor different from the first conductor, a passive element and an active element bonded to the circuit pattern with the bonding member to implement the circuit substrate, and a detection circuit provided separately from the signal circuit on the circuit substrate. The detection circuit includes a detector having the first conductor and the second conductor which are provided on the circuit substrate and which are electrically connected to each other, a power source configured to supply current to the detector, and a measuring instrument interposed between one of the first and the second conductors in the detector and the power source and configured to measure electrical characteristics between the first and the second conductors.
摘要翻译： 根据一个实施例，模块包括具有由第一导体形成的电路图案的电路基板，该电路图形包括信号电路，由不同于第一导体的第二导体形成的接合部件，无源元件和有源元件 利用所述接合部件与所述电路图案接合以实现所述电路基板，以及与所述电路基板上的所述信号电路分开设置的检测电路。 检测电路包括具有第一导体和第二导体的检测器，其设置在电路基板上并彼此电连接;电源，被配置为向检测器提供电流;以及测量仪器， 检测器和电源中的第一和第二导体，并且被配置为测量第一和第二导体之间的电特性。
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公开(公告)号：US08451614B2
公开(公告)日：2013-05-28
申请号：US13034520
申请日：2011-02-24
IPC分类号： H05K7/00
CPC分类号： H05K7/00 , G01R31/2853 , G01R31/31717
摘要： According to one embodiment, a module includes a circuit substrate having a circuit pattern which is formed of a first conductor and which includes a signal circuit, a bonding member formed of a second conductor different from the first conductor, a passive element and an active element bonded to the circuit pattern with the bonding member to implement the circuit substrate, and a detection circuit provided separately from the signal circuit on the circuit substrate. The detection circuit includes a detector having the first conductor and the second conductor which are provided on the circuit substrate and which are electrically connected to each other, a power source configured to supply current to the detector, and a measuring instrument interposed between one of the first and the second conductors in the detector and the power source and configured to measure electrical characteristics between the first and the second conductors.
摘要翻译： 根据一个实施例，模块包括具有由第一导体形成的电路图案的电路基板，该电路图形包括信号电路，由不同于第一导体的第二导体形成的接合部件，无源元件和有源元件 利用所述接合部件与所述电路图案接合以实现所述电路基板，以及与所述电路基板上的所述信号电路分开设置的检测电路。 检测电路包括具有第一导体和第二导体的检测器，其设置在电路基板上并彼此电连接;电源，被配置为向检测器提供电流;以及测量仪器， 检测器和电源中的第一和第二导体，并且被配置为测量第一和第二导体之间的电特性。
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公开(公告)号：US09007779B2
公开(公告)日：2015-04-14
申请号：US13358432
申请日：2012-01-25
CPC分类号： H05K1/0215 , G11B25/043 , H05K3/4007 , H05K2201/0305 , H05K2201/10409
摘要： According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.
摘要翻译： 根据一个实施例，电子设备包括壳体，容纳在壳体中并具有通孔的印刷电路板，以及包括插入通孔中的轴部分的固定构件和位于通孔的一端的头部 轴部分。 电子设备还包括设置在印刷电路板上的铜箔，以及覆盖膜，其包括被配置为暴露铜箔的一部分的开口部分。 开口部位于要被头部覆盖的位置，并且覆盖膜在位于开口部的位置以外的位置处覆盖铜箔。 电子设备还包括设置在开口部分内的铜箔上的导电材料，并被配置为将头部部分和铜箔彼此电连接。
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4.发明申请Electronic Apparatus Manufacturing Method, Electronic Component, and Electronic Apparatus 审中-公开电子设备制造方法，电子部件和电子设备公开(公告)号：US20120085575A1
公开(公告)日：2012-04-12
申请号：US13093641
申请日：2011-04-25
CPC分类号： H01L24/92 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/14155 , H01L2224/16225 , H01L2224/16227 , H01L2224/29012 , H01L2224/29015 , H01L2224/29034 , H01L2224/29078 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/30131 , H01L2224/32225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H01L2924/01029 , H05K3/3436 , H05K3/3489 , H05K2201/10977 , Y10T29/49144 , H01L2924/00012 , H01L2924/00 , H01L2924/0665 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/014
摘要： According to one embodiment, a manufacturing method for an electronic apparatus, which includes a housing, a substrate, pads on the substrate, and an electronic component, which includes a component body including a bottom surface, terminals arranged on the bottom surface of the component body, and a thermosetting resin disposed on the bottom surface of the component body and configured to remove an oxide film when heated, and is mounted on the substrate, the method includes putting the electronic component on the substrate, heating the electronic component, thereby softening the resin, causing the softened resin to flow, thereby forcing out a gas between the electronic component and the substrate and filling the resin between the electronic component and the substrate, and further heating the electronic component, thereby solder-bonding the terminals and the pads to one another and curing the resin between the electronic component and the substrate.
摘要翻译： 根据一个实施例，一种电子设备的制造方法，其包括壳体，基板，基板上的焊盘和电子部件，其包括具有底表面的部件主体，布置在部件的底表面上的端子 主体和热固性树脂，其设置在所述部件主体的底面上并且被构造为在加热时除去氧化膜，并且安装在所述基板上，所述方法包括将所述电子部件放置在所述基板上，加热所述电子部件，由此软化 树脂，使软化树脂流动，从而在电子部件和基板之间排出气体，并且在电子部件和基板之间填充树脂，并且进一步加热电子部件，从而焊接端子和焊盘 并固化电子部件和基板之间的树脂。
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5.发明申请ELECTRONIC DEVICE, ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING CIRCUIT BOARD ASSEMBLY 审中-公开电子设备，电子元件和制造电路板组件的方法公开(公告)号：US20120250275A1
公开(公告)日：2012-10-04
申请号：US13300379
申请日：2011-11-18
CPC分类号： H05K5/062 , H01L21/563 , H01L23/13 , H01L23/32 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/26175 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81007 , H01L2224/81138 , H01L2224/8114 , H01L2224/81191 , H01L2224/8121 , H01L2224/83191 , H01L2224/8321 , H01L2224/9211 , H01L2924/01029 , H05K1/183 , H05K3/3436 , H05K3/3489 , H05K2201/10977 , Y02P70/613 , Y10T29/49124 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2224/83 , H01L2924/014
摘要： According to one embodiment, an electronic device includes a housing, a circuit board, an electronic component, a joint, a sealant, and a positioning member. The circuit board is provided in the housing, and includes a first surface and a first conductor on the first surface. The electronic component is located on the first surface of the circuit board, and includes a second surface facing the first surface and a second conductor on the second surface. The joint is located between the first surface and the second surface to electrically connect between the first conductor and the second conductor. The sealant is located at least between the first surface and the second surface. The sealant contains a reductant that reduces an oxide film and seals the joint. The positioning member positions the circuit board and the electronic component.
摘要翻译： 根据一个实施例，电子设备包括壳体，电路板，电子部件，接头，密封剂和定位构件。 电路板设置在壳体中，并且包括在第一表面上的第一表面和第一导体。 电子部件位于电路板的第一表面上，并且包括面对第一表面的第二表面和在第二表面上的第二导体。 接头位于第一表面和第二表面之间以电连接第一导体和第二导体之间。 密封剂至少位于第一表面和第二表面之间。 密封剂含有减少氧化膜并密封接头的还原剂。 定位构件定位电路板和电子部件。
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公开(公告)号：US20120120591A1
公开(公告)日：2012-05-17
申请号：US13358432
申请日：2012-01-25
CPC分类号： H05K1/0215 , G11B25/043 , H05K3/4007 , H05K2201/0305 , H05K2201/10409
摘要： According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.
摘要翻译： 根据一个实施例，电子设备包括壳体，容纳在壳体中并具有通孔的印刷电路板，以及包括插入通孔中的轴部分的固定构件和位于通孔的一端的头部 轴部分。 电子设备还包括设置在印刷电路板上的铜箔，以及覆盖膜，其包括被配置为暴露铜箔的一部分的开口部分。 开口部位于要被头部覆盖的位置，并且覆盖膜在位于开口部的位置以外的位置处覆盖铜箔。 电子设备还包括设置在开口部分内的铜箔上的导电材料，并被配置为将头部部分和铜箔彼此电连接。
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公开(公告)号：US20120002119A1
公开(公告)日：2012-01-05
申请号：US13008680
申请日：2011-01-18
IPC分类号： H04N5/64
CPC分类号： G02F1/133 , G06F1/1601
摘要： According to one embodiment, a television apparatus includes a substrate, a pad, a receiving portion, a coating layer, and an electric component. The pad is formed on a surface of the substrate. A conductive material arranged on the pad flows into the receiving portion while having fluidity. The coating layer is formed by the conductive material flowed into the receiving portion and solidified while covering at least a surface of the pad. The electric component includes a contact terminal pressed against and brought into contact with the coating layer.
摘要翻译： 根据一个实施例，一种电视设备包括基板，焊盘，接收部分，涂层和电气部件。 衬垫形成在衬底的表面上。 布置在垫上的导电材料在流动性的同时流入接收部分。 涂层由流入接收部分的导电材料形成，并且在至少覆盖焊盘表面的同时固化。 电气部件包括压接并与涂层接触的接触端子。
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公开(公告)号：US20110235288A1
公开(公告)日：2011-09-29
申请号：US12905650
申请日：2010-10-15
IPC分类号： H05K5/00
CPC分类号： H05K1/0215 , G11B25/043 , H05K3/4007 , H05K2201/0305 , H05K2201/10409
摘要： According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.
摘要翻译： 根据一个实施例，电子设备包括壳体，容纳在壳体中并具有通孔的印刷电路板，以及包括插入通孔中的轴部分的固定构件和位于通孔的一端的头部 轴部分。 电子设备还包括设置在印刷电路板上的铜箔，以及覆盖膜，其包括被配置为暴露铜箔的一部分的开口部分。 开口部位于要被头部覆盖的位置，并且覆盖膜在位于开口部的位置以外的位置处覆盖铜箔。 电子设备还包括设置在开口部分内的铜箔上的导电材料，并被配置为将头部部分和铜箔彼此电连接。
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公开(公告)号：US20110291694A1
公开(公告)日：2011-12-01
申请号：US12953180
申请日：2010-11-23
申请人： Tsuyoshi Kozai , Nobuhiro Yamamoto
发明人： Tsuyoshi Kozai , Nobuhiro Yamamoto
IPC分类号： G01R31/28
CPC分类号： H05K1/0268 , G06F1/1637 , H01L23/49822 , H01L2924/0002 , H04N5/64 , H05K3/4069 , H05K3/42 , H05K2201/09509 , H05K2201/096 , H01L2924/00
摘要： According to one embodiment, a television apparatus includes a circuit board, a conductive portion, and an easily broken portion. The circuit board is mounted with an electronic component. The conductive portion is located on a surface or the inside of the circuit board. A breakage detection mechanism detects breakage of the conductive portion by conduction. The easily broken portion is provided to at least part of the conductive portion. The easily broken portion is broken easier than other portions of the conductive portion when a stress is applied to the circuit board.
摘要翻译： 根据一个实施例，电视设备包括电路板，导电部分和容易断开的部分。 电路板安装有电子元件。 导电部分位于电路板的表面或内部。 破损检测机构通过导电检测导电部分的断裂。 容易断开的部分被提供给导电部分的至少一部分。 当对电路板施加应力时，容易断裂的部分比导电部分的其它部分容易断裂。
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公开(公告)号：US20100187672A1
公开(公告)日：2010-07-29
申请号：US12622193
申请日：2009-11-19
申请人： Nobuhiro Yamamoto
发明人： Nobuhiro Yamamoto
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/36 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/19041 , H05K3/0094 , H05K3/28 , H05K3/305 , H05K2201/015 , H05K2201/0959 , H05K2201/10734 , H05K2203/0126 , H05K2203/0545 , H05K2203/1173 , H05K2203/304 , Y02P70/613 , H01L2924/00 , H01L2224/0401
摘要： According to an aspect of the present invention, there is provided an electronic apparatus including: a housing; a circuit board that is housed in the housing; a semiconductor package that includes a first surface on which solder balls are provided and a second surface opposite to the first surface and that is mounted on the circuit board so as to be electrically connected to the circuit board through the solder balls; a protective film that has a water repellency and that is applied on the circuit board so as to expose around the semiconductor package mounted on the circuit board; and a joint member that joins at least a part of a side surface of the semiconductor package and the circuit board.
摘要翻译： 根据本发明的一个方面，提供了一种电子设备，包括：壳体; 容纳在壳体中的电路板; 半导体封装，其包括设置有焊球的第一表面和与所述第一表面相对的第二表面，并且安装在所述电路板上以通过所述焊球与所述电路板电连接; 保护膜，其具有防水性，并且施加在电路板上以暴露在安装在电路板上的半导体封装周围; 以及连接半导体封装的侧表面的至少一部分和电路板的接合构件。
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