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35 条记录 (耗时 0.032 秒)

    Dummy wafer
    1.
    发明授权
    Dummy wafer 失效
    虚拟晶圆

    公开(公告)号：US6150023A

    公开(公告)日：2000-11-21

    申请号：US637496

    申请日：1996-04-25

    申请人： Tatsuhiro Yasaka ,  Takashi Nishizawa ,  Kazuo Muramatsu ,  Tsutomu Watanabe

    发明人： Tatsuhiro Yasaka ,  Takashi Nishizawa ,  Kazuo Muramatsu ,  Tsutomu Watanabe

    IPC分类号： C04B35/52 ,  C01B31/02 ,  H01L21/02 ,  H01L21/66 ,  H01L23/544 ,  B32B9/00

    CPC分类号： H01L22/34 ,  Y10T428/24942 ,  Y10T428/30

    摘要： The present invention provides a test dummy wafer used in the process for manufacturing a semiconductor device, which has more excellent etching resistance than a silicon wafer, and excellent mirror surface properties and evenness required for a substrate, and which causes no contamination source in the manufacturing process. The dummy wafer is composed of glassy carbon, and at least one side thereof is preferably polished to a mirror surface having a surface roughness Ra of not more than 0.005 .mu.m. The dummy wafer of the present invention has excellent characteristics as a dummy wafer for monitoring the thickness of a CVD film. The dummy wafer having specific electric resistance of not more than 0.1 .OMEGA..multidot.cm exhibits excellent characteristics as a dummy wafer for monitoring the thickness of a film formed by sputtering and confirming cleanliness.

    摘要翻译： 本发明提供了一种用于制造半导体器件的方法的测试虚拟晶片，其具有比硅晶片更好的耐蚀刻性，以及基板所需的优异的镜面性质和均匀性，并且在制造中不产生污染源 处理。 伪晶片由玻璃碳组成，其至少一侧优选抛光至表面粗糙度Ra不大于0.005μm的镜面。 本发明的虚设晶片作为用于监测CVD膜的厚度的虚设晶片具有优异的特性。 具有不大于0.1欧姆·厘米的比电阻的伪晶片作为用于监测由溅射形成的膜的厚度并确认清洁度的虚拟晶片表现出优异的特性。

    Regeneration method and apparatus of wafer and substrate
    2.
    发明授权
    Regeneration method and apparatus of wafer and substrate 失效
    晶圆和基片再生方法及装置

    公开(公告)号：US5981301A

    公开(公告)日：1999-11-09

    申请号：US804732

    申请日：1997-02-21

    申请人： Kazuo Muramatsu ,  Akihiro Kawai ,  Tsutomu Watanabe ,  Satoshi Shimamoto

    发明人： Kazuo Muramatsu ,  Akihiro Kawai ,  Tsutomu Watanabe ,  Satoshi Shimamoto

    IPC分类号： B24B51/00 ,  B24B53/00 ,  H01L21/02 ,  H01L21/304 ,  H01L21/306 ,  H01L21/66 ,  H01L23/544 ,  H01L21/00

    CPC分类号： H01L22/34 ,  B24B37/042 ,  H01L21/02032 ,  H01L2924/0002 ,  Y10S438/906 ,  Y10S438/959

    摘要： A method for regenerating a used wafer or substrate by removing a functional coating film formed on the used wafer or substrate, comprising the steps of:(a) a step for sorting the used wafer or substrate according to the quality, structure or thickness of the functional coating film;(b) a step for removing the functional coating film, while in a state of holding the used wafer or substrate, (i) by lapping the objective face of the used wafer or substrate with a hard metal-bonded whetstone while applying an electrochemical in-process dressing, (ii) by polishing the objective face while dropping a fine-particle polishing slurry between a polishing plate provided with a pad and the functional coating film, or (iii) by electrolyzing the functional coating film on the objective face placed opposite to an electrode face in an electrolyte solution at a predetermined voltage;(c) a step for mechanically removing the functional coating film adhered to the end face at an adequate stage; and(d) a step for washing and drying the used wafer or substrate after removal of the functional coating film.

    摘要翻译： 一种用于通过去除在所使用的晶片或衬底上形成的功能性涂层来再生所使用的晶片或衬底的方法，包括以下步骤：（a）根据质量，结构或厚度对所使用的晶片或衬底进行分选的步骤 功能性涂膜; （b）在保持所使用的晶片或基板的状态下，（i）通过用硬质金属结合的砂轮研磨所使用的晶片或基板的物镜，同时施加电化学 （ii）通过抛光目标面，同时在设置有衬垫的抛光板和功能性涂膜之间滴下细粒抛光浆料，或（iii）通过电解相对放置的物镜面上的功能性涂膜 以预定电压在电解质溶液中的电极面; （c）在足够的阶段机械去除附着在端面上的功能性涂膜的步骤; 以及（d）除去功能性涂膜后，对使用过的晶片或基板进行清洗干燥的工序。

    Actuator provided with grounding terminal
    6.
    发明授权
    Actuator provided with grounding terminal 有权
    执行器配有接地端子

    公开(公告)号：US07151333B2

    公开(公告)日：2006-12-19

    申请号：US11150091

    申请日：2005-06-13

    申请人： Yuzuru Suzuki ,  Naoyuki Harada ,  Kazuo Muramatsu

    发明人： Yuzuru Suzuki ,  Naoyuki Harada ,  Kazuo Muramatsu

    IPC分类号： H02K5/00

    CPC分类号： H02K5/225 ,  H02K11/01 ,  H02K11/40

    摘要： There is provided an actuator which includes: a stator assembly including a pair of stator yokes, and a coil disposed between the pair of stator yokes; a rotor unit including a magnet at its outer circumference and disposed inside the stator assembly; an output shaft disposed inside the rotor unit; a housing; a front plate disposed between the stator assembly and the housing; a printed board having a land portion leading to a grounding wire; and a grounding terminal having electrical conductivity and elasticity and disposed between the stator assembly and the housing. One end portion of the grounding terminal makes contact with one of the pair of stator yokes, and the other end portion thereof makes connection to the land portion of the printed board, whereby static electricity and electromagnetic noises generated in the stator assembly are conducted to the grounding wire.

    摘要翻译： 提供了一种致动器，其包括：定子组件，其包括一对定子轭和设置在所述一对定子轭之间的线圈; 转子单元，其外周具有磁铁，并设置在定子组件的内部; 设置在转子单元内的输出轴; 房屋; 设置在所述定子组件和所述壳体之间的前板; 印刷电路板，具有通向接地线的接地部分; 以及具有导电性和弹性并设置在定子组件和壳体之间的接地端子。 接地端子的一个端部与一对定子轭中的一个接触，另一端部与印刷电路板的接地部连接，由此在定子组件中产生静电和电磁噪声， 接地线。

    Linear actuator, and production and inspection method thereof
    7.
    发明授权
    Linear actuator, and production and inspection method thereof 有权
    线性执行器及其生产和检验方法

    公开(公告)号：US07005766B2

    公开(公告)日：2006-02-28

    申请号：US10786979

    申请日：2004-02-24

    申请人： Yuzuru Suzuki ,  Taketoshi Ohyashiki ,  Kazuo Muramatsu

    发明人： Yuzuru Suzuki ,  Taketoshi Ohyashiki ,  Kazuo Muramatsu

    IPC分类号： H02K7/06 ,  F16H25/24

    CPC分类号： H02K7/06 ,  F16H25/20 ,  F16H2025/2075 ,  H02K5/08 ,  H02K5/1732 ,  H02K15/02

    摘要： In a motor portion of a linear actuator, a rear end cap and a front end protrusion, which are disposed respectively at the rear and front ends of a stator assembly, and which include rear and front bearings to rotatably support a rotor assembly, are formed by injection-molding simultaneously and integrally with a stator support member which fixedly supports constituent members of the stator assembly, whereby the stator assembly, the rear end cap, and the front end protrusion can be coaxially aligned to one another with a high degree of precision thus improving the assembling precision of the motor portion. Also, since the front bearing can be attached to the front end protrusion before an output shaft is attached, the rotation characteristic of the rotor assembly can be evaluated before the output shaft is attached.

    摘要翻译： 在分别位于定子组件的后端和前端处并且包括后轴承和前轴承以可旋转地支撑转子组件的线性致动器，后端盖和前端突起的马达部分中形成 通过与固定地支撑定子组件的构成部件的定子支撑部件同时且一体地注射成型，由此定子组件，后端盖和前端突起可以以高精度同轴对准 从而提高电动机部的组装精度。 此外，由于前轴承可以在安装输出轴之前附接到前端突起，所以可以在安装输出轴之前评估转子组件的旋转特性。

    Method of manufacturing carbon substrate
    8.
    发明授权
    Method of manufacturing carbon substrate 失效
    制造碳基板的方法

    公开(公告)号：US5580500A

    公开(公告)日：1996-12-03

    申请号：US297811

    申请日：1994-08-30

    申请人： Kazuo Muramatsu ,  Manabu Hisada ,  Hideki Yamamuro ,  Hideo Ashida ,  Satoru Takada ,  Masami Takao ,  Yoshihiro Hara ,  Nobuhiro Ota

    发明人： Kazuo Muramatsu ,  Manabu Hisada ,  Hideki Yamamuro ,  Hideo Ashida ,  Satoru Takada ,  Masami Takao ,  Yoshihiro Hara ,  Nobuhiro Ota

    IPC分类号： C04B35/524 ,  C01B31/00

    CPC分类号： C04B35/524

    摘要： A carbon substrate manufacturing method includes a hot molding step, a burn-carbonizing step, a hot isostatical pressure treatment step, and a mirror polishing step. In the hot molding step, molding is performed while heating thermosetting resin powders to be a hard carbon substrate after burn-carbonizing, where the thermosetting resin powders are of a particle size 150 .mu.m or more, HPF 80-150 mm, a moisture content 1.0-3.0 weight %, Fe, Ni, Si and Ca respectively 5 ppm or less. In the burn-carbonizing process, a disk shaped resin molded body is filled into a graphite cylinder and burn-carbonized by heating from the external while the condition therefor is maintained in that the disk shaped resin molded body is stacked holding therein a graphite spacer at every one sheet basis or at every plurality of sheet basis and is loaded on its top with a tungsten carbide weight, where the graphite spacer has a heat conductivity 100 kcal/m.hr..degree. C. or less, a bulk density 1.70-1.85, and a flatness degree 10 .mu.m or less.

    摘要翻译： 碳基板制造方法包括热成型步骤，燃烧碳化步骤，热等压压力处理步骤和镜面抛光步骤。 在热成型工序中，在将热固化性树脂粉末在烧成碳化后作为硬质碳基板加热的同时进行成型，其中热固性树脂粉末的粒径为150μm以上，HPF为80-150mm，水分含量 1.0-3.0重量％，Fe，Ni，Si和Ca分别为5ppm以下。 在烧成碳化工序中，将圆盘状树脂成形体填充到石墨圆筒中，通过加热从外部进行燃烧碳化，同时保持其状态，将盘状树脂成型体层叠在一起，将石墨间隔件 每一片或多个片材基础，并以碳化钨重量装载在其顶部，其中石墨间隔物具有100kcal / m·hr的热导率。 ℃以下，体积密度1.70-1.85，平坦度10μm以下。

    OPTICAL FIBER ARRAY
    10.
    发明申请
    OPTICAL FIBER ARRAY 审中-公开
    光纤阵列

    公开(公告)号：US20060233510A1

    公开(公告)日：2006-10-19

    申请号：US11422544

    申请日：2006-06-06

    申请人： Toshiki Kumagai ,  Osamu Suzuki ,  Junichi Kaneko ,  Yukinari Abe ,  Kazuo Muramatsu

    发明人： Toshiki Kumagai ,  Osamu Suzuki ,  Junichi Kaneko ,  Yukinari Abe ,  Kazuo Muramatsu

    IPC分类号： G02B6/00

    CPC分类号： G02B6/3636 ,  G02B6/3652 ,  G02B6/3839 ,  G02B6/3861 ,  G02B6/3885

    摘要： In an optical fiber array (1) which has a V-groove substrate (2) formed in its surface (2a) with V-grooves (3) for arranging optical fibers, a plurality of optical fiber cores (61) fixedly bonded in each individual V-groove (3) of the V-groove substrate (2), and a pressure plate (4) fixedly bonded to surfaces of the optical fiber cores (61), an adhesive comprising a resin composition (component A) having an OH group after curing and a filler (component B) is used to fixedly bond the V-groove substrate (2), the optical fiber cores (61), and the pressure plate (4). This adhesive has a glass transition temperature that is somewhat lower than the ambient test temperature and possesses somewhat higher elasticity. Therefore, large internal stress does not occur in the adhesive even under conditions of high temperature and high humidity. Consequently, no peeling occurs as a result of moisture penetration since gaps cannot form between the pressure plate (4) and the adhesive.

    摘要翻译： 在具有在其表面（2a）上形成有用于布置光纤的V形槽（3）的V形槽衬底（2）的光纤阵列（1）中，多个光纤芯（61）固定地接合在 V槽基板（2）的各个V形槽（3）和与光纤芯（61）的表面固定接合的压板（4），粘合剂包括具有 固化后的OH基和填料（B成分）固定在V槽基板（2），光纤芯（61）和压板（4）上。 该粘合剂的玻璃化转变温度略低于环境试验温度，并具有稍高的弹性。 因此即使在高温高湿的条件下也不会发生大的内应力。 因此，由于在压板（4）和粘合剂之间不能形成间隙，所以不会由于水分渗透而发生剥离。