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公开(公告)号：US09728691B2
公开(公告)日：2017-08-08
申请号：US15016501
申请日：2016-02-05
发明人： Tsung-Jen Liaw
CPC分类号： H01L33/58 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/508 , H01L2224/14 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2933/0041 , H01L2924/00014
摘要： The present invention relates to a light-emitting diode (LED) structure, which comprises an LED unit. The LED unit is doped with a plurality of fluorescent powders in at least an arbitrary layer on one side of a light-emitting layer. Alternatively, the LED unit includes a plurality of fluorescent powder particles arranged on at least a light-emitting surface of the LED unit. No gel is adopted for disposing or packaging fluorescent powders. Thereby, gel yellowing caused by long-term high-temperature heating of the LED structure will not occur. The yellowing phenomenon will affect the light-emitting efficiency of LED and induce color deviation.
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公开(公告)号：US09341322B2
公开(公告)日：2016-05-17
申请号：US14273712
申请日：2014-05-09
发明人： Tsung-Jen Liaw , Jen-Te Chen , Ting-Yuan Cheng
IPC分类号： F21K99/00 , H01L25/075 , F21Y113/00 , H01L33/50 , H01L33/58
CPC分类号： F21K9/54 , F21K9/62 , F21Y2113/17 , F21Y2115/10 , H01L25/0753 , H01L33/504 , H01L33/58 , H01L2224/48091 , H01L2924/15192 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a color-mixing light-emitting diode module. According to the present invention, a first light-emitting chip and two second light-emitting chips are disposed on a holder. The first light-emitting chip emits red light and the plurality of second light-emitting chips emit white light. The red light and the white light are mixed, giving mixed light with high color rendering and brightness. Objects illuminated by the mixed light will exhibit colors closest to their original colors as perceived by eyes. Furthermore, by arranging the first and second light-emitting chips in matrix, the color rendering of the light-emitting diode module can be adjusted and improved.
摘要翻译： 本发明提供了一种混色发光二极管模块。 根据本发明，第一发光芯片和两个第二发光芯片设置在支架上。 第一发光芯片发出红光，并且多个第二发光芯片发出白光。 红光和白光混合，具有高色彩和亮度的混合光。 由混合光照亮的物体将呈现出最接近于眼睛所感觉到的原始颜色的颜色。 此外，通过将第一和第二发光芯片布置成矩阵，可以调节和改善发光二极管模块的显色性。
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公开(公告)号：US20150260357A1
公开(公告)日：2015-09-17
申请号：US14273712
申请日：2014-05-09
发明人： TSUNG-JEN LIAW , JEN-TE CHEN , TING-YUAN CHENG
IPC分类号： F21K99/00
CPC分类号： F21K9/54 , F21K9/62 , F21Y2113/17 , F21Y2115/10 , H01L25/0753 , H01L33/504 , H01L33/58 , H01L2224/48091 , H01L2924/15192 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： The present invention provides a color-mixing light-emitting diode module. According to the present invention, a first light-emitting chip and two second light-emitting chips are disposed on a holder. The first light-emitting chip emits red light and the plurality of second light-emitting chips emit white light. The red light and the white light are mixed, giving mixed light with high color rendering and brightness. Objects illuminated by the mixed light will exhibit colors closest to their original colors as perceived by eyes. Furthermore, by arranging the first and second light-emitting chips in matrix, the color rendering of the light-emitting diode module can be adjusted and improved.
摘要翻译： 本发明提供了一种混色发光二极管模块。 根据本发明，第一发光芯片和两个第二发光芯片设置在支架上。 第一发光芯片发出红光，并且多个第二发光芯片发出白光。 红光和白光混合，具有高色彩和亮度的混合光。 由混合光照亮的物体将呈现出最接近于眼睛所感觉到的原始颜色的颜色。 此外，通过将第一和第二发光芯片布置成矩阵，可以调节和改善发光二极管模块的显色性。
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公开(公告)号：US08240882B2
公开(公告)日：2012-08-14
申请号：US12968660
申请日：2010-12-15
申请人： Tsung-Jen Liao , Chung-Kai Wang , Yuan-Hsin Liu , Yao-Tsung Hsu
发明人： Tsung-Jen Liao , Chung-Kai Wang , Yuan-Hsin Liu , Yao-Tsung Hsu
IPC分类号： F21V33/00
CPC分类号： H05K1/021 , F21K9/00 , F21V29/70 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L33/64 , H01L2224/48247 , H05K2201/09054 , H05K2201/09745 , H05K2201/10106 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting diode module includes: a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer, and a plurality of through holes; a metallic heat sink formed with a plurality of chip-support portions and disposed below the printed circuit board; a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of the chip-support portions and each of which is electrically connected to the upper circuit layer. A method for making the light emitting diode module is also disclosed.
摘要翻译： 发光二极管模块包括：印刷电路板，包括上电路层，下金属层，绝缘层和多个通孔; 金属散热器，形成有多个芯片支撑部分，并设置在印刷电路板的下方; 热连接层，其具有分别结合到散热器和印刷电路板的下金属层的下表面和上表面; 以及多个发光二极管芯片，其各自与芯片支撑部分中的一个接触并接合，并且每个芯片支撑部分电连接到上部电路层。 还公开了制造发光二极管模块的方法。
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公开(公告)号：US20100103689A1
公开(公告)日：2010-04-29
申请号：US12604510
申请日：2009-10-23
申请人： Cheng-Shih LEE , Hsin-Yi HSIEH , Chou-Chih YIN
发明人： Cheng-Shih LEE , Hsin-Yi HSIEH , Chou-Chih YIN
IPC分类号： B60Q1/26
CPC分类号： F21S41/143 , F21S41/147 , F21S45/33 , F21S45/43 , F21S45/47 , F21V29/763 , F21V29/83 , F21Y2115/10
摘要： A lamp device includes a lamp housing embedded in an automobile body. The lamp housing has an outer housing part coupled to and disposed outwardly around an inner housing part. The outer housing part has a thermal conductivity coefficient less than that of the inner housing part. A transparent lamp cap is mounted to the lamp housing, is exposed from the automobile body, and cooperates with the inner housing part of the lamp housing to define a first inner space therebetween. A lighting module is disposed in the first inner space, and includes at least one light emitting diode.
摘要翻译： 灯装置包括嵌入汽车车体中的灯壳体。 灯壳体具有外壳体部分，其耦合到内壳体部分并且围绕内部壳体部分向外设置。 外壳部分的导热系数小于内壳体部分的导热系数。 透明灯头安装在灯壳体上，从汽车车身露出，并与灯壳体的内壳部分配合，以在其间限定第一内部空间。 照明模块设置在第一内部空间中，并且包括至少一个发光二极管。
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公开(公告)号：USD595451S1
公开(公告)日：2009-06-30
申请号：US29320739
申请日：2008-07-02
申请人： Hsiao-Wen Lee
设计人： Hsiao-Wen Lee
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公开(公告)号：US20070217195A1
公开(公告)日：2007-09-20
申请号：US11619704
申请日：2007-01-04
IPC分类号： F21V14/00
CPC分类号： H01L33/58 , G02B19/0028 , G02B19/0061 , G02B19/0071 , H01L33/60
摘要： A lens includes a lens body having a bottom surface, a reflective surface, and a refractive surface. The bottom surface is to be disposed proximate to a light-emitting component. The reflective surface is disposed opposite to the bottom surface along a lens axis, and reflects a first portion of the light provided by the light-emitting component that is incident thereon toward the refractive surface. The refractive surface extends from an edge of the reflective surface to the bottom surface, and refracts a second portion of the light provided by the light-emitting component that is incident thereon as well as the first portion of the light reflected by the reflective surface theretoward in sideward directions relative to the light-emitting component. The lens body has cross-sections transverse to the lens axis, sizes of which increase gradually from a junction of the reflective surface and the refractive surface toward the bottom surface.
摘要翻译： 透镜包括具有底表面，反射表面和折射表面的透镜体。 底表面将靠近发光部件设置。 反射面沿着透镜轴线与底面相对设置，并且将由入射到其上的发光部件提供的光的第一部分反射到折射面。 折射表面从反射表面的边缘延伸到底表面，并且折射由入射到其上的发光部件提供的光的第二部分以及由反射表面反射的光的第一部分 在相对于发光部件的侧向。 透镜体具有横向于透镜轴线的横截面，其尺寸从反射表面和折射表面的接合部朝向底面逐渐增加。
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公开(公告)号：US07081645B2
公开(公告)日：2006-07-25
申请号：US11078344
申请日：2005-03-14
申请人： Yen Cheng Chen , Ching Lin Tseng , Sher Chain Wei , Ming Li Chang
发明人： Yen Cheng Chen , Ching Lin Tseng , Sher Chain Wei , Ming Li Chang
IPC分类号： H01L29/22
CPC分类号： H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
摘要： A SMD-type LED with high heat dissipation efficiency and high power includes a base with a post arranged and integrated on the center thereof and a slot on top of the post. At least one contact hole is arranged on bottom of the base for connecting with an external heat sink so as to achieve better heat dissipation. The slot is used for accommodating a LED chip that is electrically connected with a circuitry extension device through two electrical contacts. The LED chip is electrically connected with the circuitry extension device directly while it also connects with the base for heat dissipation, thus the structure for electricity conduction is separated from the structure for heat dissipation.
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公开(公告)号：US20110157897A1
公开(公告)日：2011-06-30
申请号：US12968660
申请日：2010-12-15
申请人： Tsung-Jen Liao , Chung-Kai Wang , Yuan-Hsin Liu , Yao-Tsung Hsu
发明人： Tsung-Jen Liao , Chung-Kai Wang , Yuan-Hsin Liu , Yao-Tsung Hsu
CPC分类号： H05K1/021 , F21K9/00 , F21V29/70 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L33/64 , H01L2224/48247 , H05K2201/09054 , H05K2201/09745 , H05K2201/10106 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting diode module includes: a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer, and a plurality of through holes; a metallic heat sink formed with a plurality of chip-support portions and disposed below the printed circuit board; a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of the chip-support portions and each of which is electrically connected to the upper circuit layer. A method for making the light emitting diode module is also disclosed.
摘要翻译： 发光二极管模块包括：印刷电路板，包括上电路层，下金属层，绝缘层和多个通孔; 金属散热器，形成有多个芯片支撑部分，并设置在印刷电路板的下方; 热连接层，其具有分别结合到散热器和印刷电路板的下金属层的下表面和上表面; 以及多个发光二极管芯片，其各自与芯片支撑部分中的一个接触并接合，并且每个芯片支撑部分电连接到上部电路层。 还公开了制造发光二极管模块的方法。
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公开(公告)号：US20090231849A1
公开(公告)日：2009-09-17
申请号：US12401266
申请日：2009-03-10
申请人： Ching-Lin TSENG , Yu-Shen CHEN , Ming-Li CHANG
发明人： Ching-Lin TSENG , Yu-Shen CHEN , Ming-Li CHANG
CPC分类号： F21K9/00 , Y10T29/49121
摘要： A method for making a light emitting diode lighting module includes steps of: (a) packaging a plurality of light emitting diode dies respectively on a plurality of die-mounting parts of a metal lead frame to form a plurality of light emitting diodes, respectively; and (b) cutting off supporting parts of the lead frame so as to form a connecting structure through which the light emitting diodes are connected to each other in one of serial, parallel, and serial-and-parallel connecting manners.
摘要翻译： 一种制造发光二极管照明模块的方法包括以下步骤：（a）将多个发光二极管管芯分别封装在金属引线框架的多个管芯安装部分上以分别形成多个发光二极管; 和（b）切断引线框架的支撑部分，以形成连接结构，发光二极管通过串联，并联和串联和并联连接方式彼此连接。
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