利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

45 条记录 (耗时 0.015 秒)

    Forming a micro electro mechanical system
    1.
    发明授权
    Forming a micro electro mechanical system 有权
    形成微机电系统

    公开(公告)号：US08084285B2

    公开(公告)日：2011-12-27

    申请号：US12948477

    申请日：2010-11-17

    申请人： Sriram Ramamoorthi ,  Donald J. Milligan

    发明人： Sriram Ramamoorthi ,  Donald J. Milligan

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00253 ,  B81B2201/0235 ,  B81B2203/051 ,  B81B2203/053 ,  B81C1/00142 ,  B81C3/004 ,  B81C2201/019 ,  B81C2203/058

    摘要： A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second movable portion corresponding to a z accelerometer, where each movable portion comprises at least one flexure member and at least one proof mass, each proof mass and flexure member being formed by the selective removal of material from a top side and a bottom side of first wafer; (2) bonding the first wafer to a second wafer comprising an electronic circuit, such that a gap is defined between the first wafer and the second wafer. The thickness of the at least one flexure member of the first movable portion is independent of a thickness of the at least one flexure member of the second movable portion and a thickness of the proof mass of the first movable portion is independent of a thickness of the at least one proof mass of the second movable portion.

    摘要翻译： 一种形成微机电系统（MEMS）的方法包括：（1）从第一晶片去除材料以限定对应于xy加速度计的第一可移动部分和对应于z i加速度计的第二可移动部分，其中每个可移动部分包括 至少一个弯曲构件和至少一个检验质量块，通过从第一晶片的顶侧和底侧选择性地去除材料形成每个检验质量和挠曲构件; （2）将第一晶片接合到包括电子电路的第二晶片，使得在第一晶片和第二晶片之间限定间隙。 第一可移动部分的至少一个弯曲部件的厚度与第二可动部分的至少一个弯曲部件的厚度无关，并且第一可移动部分的检验质量块的厚度与 所述第二可动部的至少一个检验质量。

    Acceleration sensor and method of manufacturing acceleration sensor
    3.
    发明授权
    Acceleration sensor and method of manufacturing acceleration sensor 有权
    加速度传感器及加速度传感器的制造方法

    公开(公告)号：US08276449B2

    公开(公告)日：2012-10-02

    申请号：US12585553

    申请日：2009-09-17

    申请人： Goro Nakatani

    发明人： Goro Nakatani

    IPC分类号： G01P15/12 ,  G01P15/00

    CPC分类号： G01P15/18 ,  B81B2201/0235 ,  B81C3/004 ,  B81C2201/019 ,  B81C2203/051 ,  G01P15/0802 ,  G01P15/123 ,  G01P2015/0842

    摘要： The acceleration sensor according to the present invention includes a sensor chip having a movable portion operating in response to a change in a physical quantity and a silicon chip arranged to be opposed to a first side of the sensor chip and bonded to the sensor chip, while the sensor chip is provided with a penetrating portion penetrating the sensor chip in the thickness direction so that the first side is visually recognizable from a second side of the sensor chip, and the silicon chip is provided with an alignment mark on a portion opposed to the penetrating portion.

    摘要翻译： 根据本发明的加速度传感器包括传感器芯片，其具有响应于物理量的变化而起作用的可移动部分和布置成与传感器芯片的第一侧相对并结合到传感器芯片的硅芯片，同时 传感器芯片在厚度方向上设有穿透传感器芯片的穿透部分，从而可以从传感器芯片的第二侧视觉上识别第一侧，并且硅芯片在与该传感器芯片相对的部分上设置有对准标记 穿透部分。

    Forming a Micro Electro Mechanical System
    4.
    发明申请
    Forming a Micro Electro Mechanical System 有权
    形成微机电系统

    公开(公告)号：US20110059566A1

    公开(公告)日：2011-03-10

    申请号：US12948477

    申请日：2010-11-17

    申请人： Sriram Ramamoorthi ,  Donald J. Milligan

    发明人： Sriram Ramamoorthi ,  Donald J. Milligan

    IPC分类号： H01L21/02

    CPC分类号： B81C1/00253 ,  B81B2201/0235 ,  B81B2203/051 ,  B81B2203/053 ,  B81C1/00142 ,  B81C3/004 ,  B81C2201/019 ,  B81C2203/058

    摘要： A method of forming a micro-electro mechanical system (MEMS), includes (1) removing material from a first wafer to define a first movable portion corresponding to an x-y accelerometer and a second movable portion corresponding to a z accelerometer, where each movable portion comprises at least one flexure member and at least one proof mass, each proof mass and flexure member being formed by the selective removal of material from a top side and a bottom side of first wafer; (2) bonding the first wafer to a second wafer comprising an electronic circuit, such that a gap is defined between the first wafer and the second wafer. The thickness of the at least one flexure member of the first movable portion is independent of a thickness of the at least one flexure member of the second movable portion and a thickness of the proof mass of the first movable portion is independent of a thickness of the at least one proof mass of the second movable portion.

    摘要翻译： 一种形成微机电系统（MEMS）的方法包括：（1）从第一晶片去除材料以限定对应于xy加速度计的第一可移动部分和对应于z i加速度计的第二可移动部分，其中每个可移动部分包括 至少一个弯曲构件和至少一个检验质量块，通过从第一晶片的顶侧和底侧选择性地去除材料形成每个检验质量和挠曲构件; （2）将第一晶片接合到包括电子电路的第二晶片，使得在第一晶片和第二晶片之间限定间隙。 第一可移动部分的至少一个弯曲部件的厚度与第二可动部分的至少一个弯曲部件的厚度无关，并且第一可移动部分的检验质量块的厚度与 所述第二可动部的至少一个检验质量。

    MEMS DEVICES AND METHODS OF ASSEMBLING MICRO ELECTROMECHANICAL SYSTEMS (MEMS)
    5.
    发明申请
    MEMS DEVICES AND METHODS OF ASSEMBLING MICRO ELECTROMECHANICAL SYSTEMS (MEMS) 有权
    MEMS器件和组装微电子系统（MEMS）的方法

    公开(公告)号：US20100105167A1

    公开(公告)日：2010-04-29

    申请号：US12259953

    申请日：2008-10-28

    申请人： Mark Eskridge ,  Galen Magendanz

    发明人： Mark Eskridge ,  Galen Magendanz

    IPC分类号： H01L21/98

    CPC分类号： B81C3/004 ,  B81C2203/051 ,  H01L24/11 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  Y10S438/975 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A Micro ElectroMechanical Systems device according to an embodiment of the present invention is formed by dicing a MEMS wafer and attaching individual MEMS dies to a substrate. The MEMS die includes a MEMS component attached to a glass layer, which is attached to a patterned metallic layer, which in turn is attached to a number of bumps. Specifically, the MEMS component on the glass layer is aligned to one or more bumps using windows that are selectively created or formed in the metallic layer. One or more reference features are located on or in the glass layer and are optically detectable. The reference features may be seen from the front surface of the glass layer and used to align the MEMS components and may be seen through the windows and used to align the bumps. As an end result, the MEMS component may be precisely aligned with the bumps via optical detection of the reference features in the glass layer.

    摘要翻译： 根据本发明的实施例的微电子机械系统装置通过将MEMS晶片切割并将各个MEMS管芯附着到基板上而形成。 MEMS管芯包括附接到玻璃层的MEMS部件，其附接到图案化的金属层，该金属层又附接到多个凸块。 具体来说，使用在金属层中选择性地形成或形成的窗口，玻璃层上的MEMS部件与一个或多个凸块对准。 一个或多个参考特征位于玻璃层上或玻璃层中，并且是可光学检测的。 可以从玻璃层的前表面看到参考特征，并且用于对准MEMS部件，并且可以通过窗户看到并且用于对准凸块。 作为最终结果，MEMS部件可以通过光学检测玻璃层中的参考特征而与凸块精确对准。

    Device for Measuring Alignment of Adjoining Structures
    6.
    发明申请
    Device for Measuring Alignment of Adjoining Structures 有权
    用于测量相邻结构对准的装置

    公开(公告)号：US20100049467A1

    公开(公告)日：2010-02-25

    申请号：US12545383

    申请日：2009-08-21

    申请人： François De Crecy

    发明人： François De Crecy

    IPC分类号： G01B21/00 ,  G06F15/00

    CPC分类号： G01B21/085 ,  B81C3/004 ,  B81C2203/051 ,  G01B21/16 ,  G01M99/002 ,  H01L21/67242

    摘要： The invention relates to the field of micro- and nanotechnologies. In these techniques, it is sometimes necessary to glue several structures face to face and it is important to be able to check the alignment of the structures. A new method for measuring alignment, which comprises the following operations, is proposed for this purpose: activation of a heating element placed on the surface of the first structure, generation of electronic signals representative of a distribution of temperatures, on the basis of an array of temperature sensitive elements placed on the surface of the second structure, determination of a relative position of the heating element with respect to the array of sensitive elements, therefore of the first structure with respect to the second, on the basis of the distribution of temperatures, in a calculation circuit receiving the electronic signals engendered in the array of sensitive elements.

    摘要翻译： 本发明涉及微纳米技术领域。 在这些技术中，有时需要面对面地粘合几个结构，并且能够检查结构的对准是重要的。 提出了一种用于测量对准的新方法，其包括以下操作：基于阵列激活放置在第一结构的表面上的加热元件，产生代表温度分布的电子信号 温度敏感元件放置在第二结构的表面上，基于温度分布来确定加热元件相对于敏感元件阵列的相对位置，因此第一结构相对于第二结构相对于第二结构 在计算电路中接收产生在敏感元件阵列中的电子信号。

    Alignment method of using alignment marks on wafer edge
    8.
    发明申请
    Alignment method of using alignment marks on wafer edge 有权
    在晶片边缘上使用对准标记的对准方法

    公开(公告)号：US20060139643A1

    公开(公告)日：2006-06-29

    申请号：US11138348

    申请日：2005-05-27

    申请人： Chiu-Wang Chen

    发明人： Chiu-Wang Chen

    IPC分类号： G01B11/00

    CPC分类号： G03F9/7084 ,  B81C3/004 ,  B81C2203/051 ,  G03F9/703 ,  G03F9/7076 ,  G03F9/7088 ,  H01L22/10

    摘要： A method for stacking and bonding wafers in precision alignment by detecting alignment marks provided on wafer edges, comprising the steps of: (a) providing at least a first wafer having at least a first pattern and at least a second pattern disposed on the cross-section thereof, at least a second wafer having at least a third pattern and at least a fourth pattern disposed on the cross-section thereof, and at least a sensing device, while pairing the first pattern with the third pattern and pairing the second pattern with the fourth pattern; (b) actuating the first wafer and the second wafer for enabling the first to parallel the second wafer and to be a distance apart from the second wafer; (c) actuating the first wafer and the second wafer for bringing the two wafers to move toward each other while enabling the sensing device for detecting and determining whether or not the first pattern is in a position capable of matching with the third pattern and the second pattern in another position capable of matching with the fourth pattern; (d) bonding the first wafer and the second wafer while the first pattern matches the third pattern and the second pattern matches the fourth pattern.

    摘要翻译： 一种通过检测设置在晶片边缘上的对准标记来精确对准晶片的方法，包括以下步骤：（a）提供至少第一晶片，其具有至少第一图案和至少第二图案， 至少第二晶片，具有至少第三图案和至少第四图案设置在其横截面上，以及至少一个感测装置，同时将第一图案与第三图案配对并将第二图案与第二图案配对 第四种模式; （b）致动所述第一晶片和所述第二晶片，以使得所述第一晶片和所述第二晶片能够使所述第一晶片平行并且与所述第二晶片间隔一段距离; （c）致动所述第一晶片和所述第二晶片以使所述两个晶片朝向彼此移动，同时使所述感测装置能够检测和确定所述第一图案是否处于能够与所述第三图案匹配的位置，并且所述第二图案 在与第四图案匹配的另一位置的图案; （d）当第一图案与第三图案匹配时第一晶片和第二晶片接合，而第二图案与第四图案匹配。

    Positioning method in microprocessing process of bulk silicon
    9.
    发明授权
    Positioning method in microprocessing process of bulk silicon 有权

    公开(公告)号：US09902613B2

    公开(公告)日：2018-02-27

    申请号：US15315640

    申请日：2015-08-19

    申请人： CSMC TECHNOLOGIES FAB1 CO., LTD.

    发明人： Errong Jing

    IPC分类号： H01L21/00 ,  B81C3/00

    CPC分类号： B81C3/004 ,  B81C1/00 ,  B81C1/00603 ,  B81C3/00 ,  B81C2203/051 ,  G03F9/00 ,  H01L21/68

    摘要： A positioning method in a microprocessing process of bulk silicon comprises the steps of: fabricating, on a first surface of a first substrate (10), a first pattern (100), a stepper photo-etching machine alignment mark (200) for positioning the first pattern, and a double-sided photo-etching machine first alignment mark (300) for positioning the stepper photo-etching machine alignment mark; fabricating, on a second surface, opposite to the first surface, of the first substrate, a double-sided photo-etching machine second alignment mark (400) corresponding to the double-sided photo-etching machine first alignment mark; bonding a second substrate (20) on the first surface of the first substrate; performing thinning on a first surface of the second substrate; fabricating, on the first surface of the second substrate, a double-sided photo-etching machine third alignment mark (500) corresponding to the double-sided photo-etching machine second alignment mark; and finding, on the first surface of the second substrate by using the double-sided photo-etching machine third alignment mark, a corresponding position of the stepper photo-etching machine alignment mark.