公开(公告)号：US20080116166A1

公开(公告)日：2008-05-22

申请号：US11865619

申请日：2007-10-01

Applicant: CHIH-YI TU ,  CHENG-HSIEN LIN ,  I-HSIEN CHIANG

Inventor： CHIH-YI TU ,  CHENG-HSIEN LIN ,  I-HSIEN CHIANG

IPC: H05K3/46 ,  H01B13/00

CPC classification number: H05K3/4697 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2203/063 ,  H05K2203/108 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which having a first copper clad laminate structure and a second copper clad laminate structure disposed on two opposite sides of the binder layer respectively using the binder layer; cutting the first copper clad laminate structure; cutting the multilayer FPCB in manner that a portion of first copper clad laminate structure that is exposed to the opening is separated from the first copper clad structure thereby obtain a multilayer FPCB having different number of layers in different areas.

Abstract translation: 本发明涉及一种制造在不同区域中具有不同层数的多层FPCB的方法。 该方法包括以下步骤：提供粘合剂层; 去除粘合剂层的一部分从而限定粘合剂层中的开口; 形成具有第一覆铜层压结构的多层FPCB和分别使用粘合剂层设置在粘合剂层的两个相对侧上的第二覆铜层压结构; 切割第一个覆铜层压结构; 以暴露于开口的第一覆铜层压体结构的一部分与第一铜包层结构体分离的方式切断多层FPCB，由此得到在不同区域中具有不同层数的多层FPCB。

公开(公告)号：US20070269588A1

公开(公告)日：2007-11-22

申请号：US11309852

申请日：2006-10-13

Applicant: Wen-Chin Lee ,  Cheng-Hsien Lin

Inventor： Wen-Chin Lee ,  Cheng-Hsien Lin

IPC: C23C18/31

CPC classification number: H05K3/0035 ,  H05K3/0038 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/0554 ,  H05K2203/108

Abstract: A method for forming stacked via-holes on a printed circuit board includes the steps of: providing a printed circuit board having a conductive trace formed on a side surface thereof; forming a first copper-clad laminate on the side surface having the conductive trace; forming a number of first copper micro-via in a copper layer of the first copper-clad laminate; forming a second copper-clad laminate on the surface of the copper layer having the first copper micro-via of the first copper-clad laminate; forming a number of second copper micro-via in a copper layer of the second copper-clad laminate by a first laser on the basis of the first copper micro-via, each second copper micro-via being located corresponding to its correspondingly first copper micro-via; and removing corresponding resin layer portions of the first and second copper-clad laminates, using a second laser, to yield the respective stacked via-holes.

Abstract translation: 一种在印刷电路板上形成堆叠的通孔的方法包括以下步骤：提供在其侧表面上形成有导电迹线的印刷电路板; 在具有导电迹线的侧表面上形成第一覆铜层压板; 在第一覆铜层压板的铜层中形成多个第一铜微通孔; 在具有第一覆铜层压板的第一铜微通孔的铜层的表面上形成第二覆铜层压板; 基于第一铜微通孔，通过第一激光在第二覆铜层压板的铜层中形成多个第二铜微通孔，每个第二铜微通孔对应于其相应的第一铜微通孔 -通过; 并使用第二激光器除去第一和第二覆铜层压板的相应树脂层部分，以产生相应的堆叠通孔。

公开(公告)号：US20070077688A1

公开(公告)日：2007-04-05

申请号：US11309364

申请日：2006-08-01

Applicant: CHIA-SHUO HSU ,  FU-SING HUANG ,  CHAO-CHING WANG

Inventor： CHIA-SHUO HSU ,  FU-SING HUANG ,  CHAO-CHING WANG

IPC: H01L21/00

CPC classification number: H01L21/67132 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/0064 ,  H05K3/0097 ,  H05K2203/0191 ,  H05K2203/1545

Abstract: A method for manufacturing of flexible printed circuit boards is provided. The method includes the steps of: providing a tape substrate having an electrically insulating layer and an electrically conducting layer; forming a wiring pattern at the electrically conducting layer; attaching a back film on a surface of the tape substrate; and cutting the tape substrate to get a number of flexible printed circuit boards attached on the back film.

Abstract translation: 提供一种柔性印刷电路板的制造方法。 该方法包括以下步骤：提供具有电绝缘层和导电层的带基片; 在导电层处形成布线图案; 在所述带基材的表面上附着背膜; 并切割带子基底以获得附着在背膜上的多个柔性印刷电路板。

公开(公告)号：US20070072129A1

公开(公告)日：2007-03-29

申请号：US11309363

申请日：2006-08-01

Applicant: CHIA-CHUN LIAO ,  POR-YANN JIANG

Inventor： CHIA-CHUN LIAO ,  POR-YANN JIANG

IPC: G03C5/00

CPC classification number: H05K3/064 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2203/0554 ,  H05K2203/0759

Abstract: The present invention provides a method for forming flexible printed circuit boards. The method includes the following steps: providing a substrate with a copper film formed on at least one surface of the substrate; and forming a number of copper holes in the copper film through a photolithography process. The photolithography process includes a step of coating a liquid photoresist onto the copper film.

Abstract translation: 本发明提供一种形成柔性印刷电路板的方法。 该方法包括以下步骤：在衬底的至少一个表面上提供形成有铜膜的衬底; 并通过光刻工艺在铜膜中形成多个铜孔。 光刻工艺包括将液体光致抗蚀剂涂覆到铜膜上的步骤。

公开(公告)号：US20120018299A1

公开(公告)日：2012-01-26

申请号：US13080671

申请日：2011-04-06

Applicant: CHIEN-PANG CHENG

Inventor： CHIEN-PANG CHENG

IPC: C25B9/00

CPC classification number: C25D17/06 ,  C25D3/38 ,  C25D17/005 ,  C25D21/14

Abstract: An electroplating apparatus includes an electroplating tank, a first anode plate, a first cathode plate, a second cathode plate, a number of first and second elastic elements, a number of pairs of clamping assemblies, a first drive member, and a second drive member. The electroplating tank holds an electrolyte solution. The first elastic elements are interconnected between the first anode plate and the first cathode plate. The second elastic elements are interconnected between the first anode plate and the second cathode plate. Each pair of clamping assemblies are used to clamp opposite ends of a plated-shaped workpiece. The first drive member and the second drive member are used to cooperatively move the clamping assemblies.

Abstract translation: 电镀装置包括电镀槽，第一阳极板，第一阴极板，第二阴极板，多个第一和第二弹性元件，多对夹紧组件，第一驱动构件和第二驱动构件 。 电镀槽容纳电解液。 第一弹性元件在第一阳极板和第一阴极板之间互连。 第二弹性元件在第一阳极板和第二阴极板之间互连。 每对夹紧组件用于夹紧电镀形工件的相对端。 第一驱动构件和第二驱动构件用于协同地移动夹紧组件。

公开(公告)号：US20120011713A1

公开(公告)日：2012-01-19

申请号：US13181453

申请日：2011-07-12

Applicant: HUI ZENG

Inventor： HUI ZENG

IPC: H05K3/00

CPC classification number: H05K3/4635 ,  H05K3/429 ,  H05K2201/055 ,  H05K2203/0228 ,  H05K2203/1545 ,  Y10T29/49124

Abstract: In a method for manufacturing multilayer PCBs having n circuit layers, a flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising n segmental portions. The strip is treated in a reel to reel process to form traces in n−2 segmental portions of each of the PCB units, the other two segmental portions are left untreated without traces. Then the strip is cut to obtain a number of separated PCB units. The PCB unit is folded in such a manner that the n−2 segmental portions having traces are arranged between the other two segmental portions without traces. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two segmental portions.

Abstract translation: 在制造具有n个电路层的多层PCB的方法中，提供了柔性衬底条。 该条带包括多个PCB单元，每个PCB单元包括n个段部分。 将带材以卷轴处理以在每个PCB单元的n-2个节段部分中形成迹线，而另外两个节段部分未被处理而没有痕迹。 然后切割条以获得多个分离的PCB单元。 PCB单元被折叠成使得具有迹线的n-2个节段部分布置在没有痕迹的另外两个节段部分之间。 将折叠的PCB单元层叠以形成多层基板，并且在两个节段部分中形成迹线。

公开(公告)号：US20110297437A1

公开(公告)日：2011-12-08

申请号：US13116021

申请日：2011-05-26

Applicant: HUI ZENG

Inventor： HUI ZENG

IPC: H05K5/00

CPC classification number: H01R4/2433 ,  H01R2201/04 ,  H01R2201/06

Abstract: An electronic component device for electrically and mechanically connecting to a lead wire includes a base and a cover. The base includes a receiving body, at least one electronic component, and two spaced stripping connectors. The receiving body defining an installation groove. The at least one electronic component and the stripping connectors are received in the receiving body. Each stripping connector is in electrically connected with the at least one electronic component. The stripping connector defines a stripping slot for extension of the core therethrough, which has a size smaller than or equal to the diameter of the core. The cover includes a pressing surface and an electrically insulating cutting body. The cutting body is used for cutting off the lead wire. The pressing surface is configured for pressing the lead wire into the stripping slot, thus making the core in electrical connection with the at least one electronic component.

Abstract translation: 用于电和机械地连接到引线的电子部件装置包括基座和盖。 基座包括接收体，至少一个电子部件和两个间隔开的剥离连接器。 接收体限定安装槽。 所述至少一个电子部件和剥离连接器被容纳在接收体中。 每个剥离连接器与至少一个电子部件电连接。 剥离连接器限定用于芯的延伸的剥离槽，其具有小于或等于芯的直径的尺寸。 盖子包括一个按压表面和一个电绝缘的切割体。 切割体用于切断导线。 按压表面构造成将引线压入剥离槽，从而使芯与至少一个电子部件电连接。

公开(公告)号：US08001684B2

公开(公告)日：2011-08-23

申请号：US11959194

申请日：2007-12-18

Applicant: Chia-Cheng Chen ,  Chao-Ching Wang ,  Chiang-Hua Huang ,  Cheng-Hsien Lin

Inventor： Chia-Cheng Chen ,  Chao-Ching Wang ,  Chiang-Hua Huang ,  Cheng-Hsien Lin

IPC: H05K3/02

CPC classification number: H05K3/281 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/027 ,  H05K2201/0355 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2203/063 ,  H05K2203/1545 ,  H05K2203/166 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.

Abstract translation: 提供了制造柔性印刷电路板的示例性方法。 从第一供给辊供给金属箔。 金属箔在金属箔的两个相对侧上具有第一表面和第二表面。 具有限定在其中的多个第一开口的第一覆盖层从第二馈送辊供应并层压在金属箔的第一表面上。 用金属箔形成电迹线。 具有限定在其中的多个第二开口的第二覆盖物从第三进料辊供应并层压在金属箔的第二表面上。 每个第二开口与相应的第一开口对准，使得电迹线从相应的第一和第二开口露出。 该方法可以提高以空心形式制造柔性印刷电路板的质量和效率。

公开(公告)号：US20110186339A1

公开(公告)日：2011-08-04

申请号：US12795839

申请日：2010-06-08

Applicant: YAO-WEN BAI ,  PAN TANG ,  XIAO-PING LI

Inventor： YAO-WEN BAI ,  PAN TANG ,  XIAO-PING LI

IPC: H05K1/00

CPC classification number: H05K1/00

Abstract: A printed circuit board includes a composite layer, a first electrically conductive pattern, and a second electrically conductive pattern. The composite layer includes a polymer matrix and an electrically conductive pin embedded therein. The polymer matrix has a first surface and an opposite second surface. The pin includes a catalyst block and a carbon nanotube bundle grown on the catalyst block. The catalyst block is exposed at the first surface, and the carbon nanotube bundle is exposed at the second surface. The first pattern is formed on the first surface, and includes a first electrical contact, which is electrically coupled to the catalyst block. The second pattern is formed on the second surface, and includes a second electrical contact, which is electrically coupled to the carbon nanotube bundle.

Abstract translation: 印刷电路板包括复合层，第一导电图案和第二导电图案。 复合层包括聚合物基质和嵌入其中的导电针。 聚合物基质具有第一表面和相对的第二表面。 该销包括在催化剂块上生长的催化剂嵌段和碳纳米管束。 催化剂块在第一表面露出，碳纳米管束在第二表面露出。 第一图案形成在第一表面上，并且包括电耦合到催化剂块的第一电接触。 第二图案形成在第二表面上，并且包括电耦合到碳纳米管束的第二电接触。

公开(公告)号：US07985482B2

公开(公告)日：2011-07-26

申请号：US12144260

申请日：2008-06-23

Applicant: Yung-Wei Lai ,  Cheng-Wei Kuo ,  Shing-Tza Liou

Inventor： Yung-Wei Lai ,  Cheng-Wei Kuo ,  Shing-Tza Liou

IPC: B32B27/08 ,  B32B27/34

CPC classification number: H05K3/0064 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/34 ,  B32B2250/42 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/546 ,  B32B2307/714 ,  B32B2457/08 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0195 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721 ,  Y10T428/31725

Abstract: A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar′ represents different substituted aromatic groups.

Abstract translation: 用于柔性印刷柔性印刷电路板的加强片包括交替层叠的聚酰亚胺层和聚酰胺酰亚胺层，其中聚酰胺酰亚胺的分子结构由下式表示：其中Ar和Ar'表示不同的取代芳族基团。