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公开(公告)号：US08001684B2
公开(公告)日：2011-08-23
申请号：US11959194
申请日：2007-12-18
IPC分类号： H05K3/02
CPC分类号： H05K3/281 , H05K1/0269 , H05K1/0393 , H05K3/027 , H05K2201/0355 , H05K2201/09063 , H05K2201/09918 , H05K2203/063 , H05K2203/1545 , H05K2203/166 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： An exemplary method for manufacturing flexible printed circuit board is provided. A metal foil is supplied from a first feeding roller. The metal foil has a first surface and a second surface on two opposite sides of the metal foil. A first coverlay having a number of first openings defined therein is supplied from a second feeding roller and laminated on the first surface of the metal foil. Electrical traces are formed with the metal foil. A second coverlay having a number of second openings defined therein is supplied from a third feeding roller and laminated on the second surface of the metal foil. Each of the second openings registers with the respective first opening so that the electrical traces are exposed from the corresponding first and second openings. The method can improve quality and efficiency of manufacturing flexible printed circuit boards in a hollowed out form.
摘要翻译： 提供了制造柔性印刷电路板的示例性方法。 从第一供给辊供给金属箔。 金属箔在金属箔的两个相对侧上具有第一表面和第二表面。 具有限定在其中的多个第一开口的第一覆盖层从第二馈送辊供应并层压在金属箔的第一表面上。 用金属箔形成电迹线。 具有限定在其中的多个第二开口的第二覆盖物从第三进料辊供应并层压在金属箔的第二表面上。 每个第二开口与相应的第一开口对准，使得电迹线从相应的第一和第二开口露出。 该方法可以提高以空心形式制造柔性印刷电路板的质量和效率。
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公开(公告)号：US07799603B2
公开(公告)日：2010-09-21
申请号：US12466361
申请日：2009-05-14
IPC分类号： H01L21/52
CPC分类号： H05K1/0271 , H05K3/0052 , H05K3/303 , H05K3/341 , H05K2201/09127 , H05K2201/09136 , H05K2201/09681 , H05K2201/09781 , H05K2201/10674 , H05K2201/2009
摘要： A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.
摘要翻译： 一种用于在印刷电路板上组装电子部件的方法包括以下步骤。 首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。 其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。 第三，电子部件安装在主体部分上并与导电图形电连接。 第五，去除不想要的部分。
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3.发明授权Circuit substrate for mounting electronic component and circuit substrate assembly having same 有权用于安装电子部件的电路基板和具有该电路的电路基板组件公开(公告)号：US08300420B2
公开(公告)日：2012-10-30
申请号：US12471396
申请日：2009-05-24
CPC分类号： H05K1/186 , B82Y10/00 , H01L23/373 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H01L2224/73267 , H01L2224/9222 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/18162 , H01L2924/19042 , H05K3/4038 , H05K2201/026
摘要： A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.
摘要翻译： 电路基板包括其中形成有导电图案的导电层，具有通孔的绝缘层和位于导电层和绝缘层之间的复合层。 通孔被配置为具有安装在其上的电子部件。 复合层包括聚合物基质和嵌入聚合物基质中的至少一个碳纳米管束。 至少一个碳纳米管束的一端与导电图案接触，另一端暴露在绝缘层的通孔中。
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公开(公告)号：US08067696B2
公开(公告)日：2011-11-29
申请号：US12389521
申请日：2009-02-20
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H05K3/243 , H05K2201/09136 , H05K2201/09736 , H05K2201/09781 , H05K2201/09827 , H05K2201/09845 , H05K2201/2009
摘要： A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.
摘要翻译： 印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。 铜层在其给定部分包括多个电迹线。 加强层的厚度在远离给定部分的方向上增加。 在本公开中还提供了制造印刷电路板的方法。
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公开(公告)号：US09247650B2
公开(公告)日：2016-01-26
申请号：US12589459
申请日：2009-10-22
申请人： Yao-Wen Bai , Rui Zhang , Cheng-Hsien Lin
发明人： Yao-Wen Bai , Rui Zhang , Cheng-Hsien Lin
CPC分类号： H05K3/246 , B82Y10/00 , C23C18/18 , H05K3/125 , H05K2201/026 , H05K2201/0323 , H05K2201/0347 , H05K2203/013 , H05K2203/072
摘要： A method for making conductive wires is provided. Firstly, an ink having carbon nanotubes is provided. Secondly, a baseline is formed using the ink on a substrate. Thirdly, the baseline is electroless plated.
摘要翻译： 提供制造导线的方法。 首先，提供具有碳纳米管的油墨。 其次，使用基板上的墨形成基线。 第三，基线是无电镀。
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公开(公告)号：US08071887B2
公开(公告)日：2011-12-06
申请号：US12253869
申请日：2008-10-17
申请人： Shing-Tza Liou , Yao-Wen Bai , Cheng-Hsien Lin
发明人： Shing-Tza Liou , Yao-Wen Bai , Cheng-Hsien Lin
IPC分类号： H05K1/03
CPC分类号： H05K1/097 , B82Y10/00 , H05K3/125 , H05K3/246 , H05K2201/026 , H05K2201/0272 , H05K2201/0323 , H05K2201/0347 , H05K2203/013 , Y10T29/49155 , Y10T428/2462 , Y10T428/30 , Y10T428/32
摘要： A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.
摘要翻译： 印刷电路板包括具有表面的基板，具有形成在表面上的多个电迹线的电路层和形成在电路层上的导电金属层。 电路层由碳纳米管和金属纳米颗粒组成。
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公开(公告)号：US08049113B2
公开(公告)日：2011-11-01
申请号：US12047152
申请日：2008-03-12
申请人： Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
发明人： Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
IPC分类号： H05K1/02
CPC分类号： H05K1/025 , H05K1/111 , H05K2201/09727 , Y02P70/611
摘要： The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.
摘要翻译： 印刷电路板技术领域本发明涉及印刷电路板。 在一个实施例中，印刷电路板包括介电层和形成在电介质层上的导电迹线。 导电层包括第一导电部分，连接部分和第二导电部分。 连接部分包括第一端和第二端。 第一端连接到第一导电部分; 第二端连接到第二导电部分。 连接部的宽度从第一端到第二端逐渐减小。 可以减少在所呈现的印刷电路板中传输的信号的反射和串扰。
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8.发明申请Carbon nanotube metal nanoparticle composite and method for making the same 审中-公开碳纳米管金属纳米颗粒复合材料及其制备方法公开(公告)号：US20100255290A1
公开(公告)日：2010-10-07
申请号：US12589477
申请日：2009-10-22
申请人： Yao-Wen Bai , Qiu-Yue Zhang , Cheng-Hsien Lin
发明人： Yao-Wen Bai , Qiu-Yue Zhang , Cheng-Hsien Lin
CPC分类号： B82Y30/00 , B82Y40/00 , C01B32/174 , Y10T428/254
摘要： A method for making carbon nanotube precious metal nanoparticles composite includes the following steps. A solution dissolving precious metal ions is provided. A water soluble polymer is provided and dissolved in water to form a solution of the soluble polymer. The solution of the precious metal ions is added into the solution of the soluble polymer to form a first mixture. A solution of carbon nanotubes is provided and added in the first mixture to form a second mixture. The second mixture is irradiated via radiation, the radiation have a wave length less than 450 nm.
摘要翻译： 制备碳纳米管贵金属纳米复合材料的方法包括以下步骤。 提供了溶解贵金属离子的溶液。 提供水溶性聚合物并溶解在水中以形成可溶性聚合物的溶液。 将贵金属离子的溶液加入到可溶性聚合物的溶液中以形成第一混合物。 提供碳纳米管溶液并加入到第一混合物中以形成第二混合物。 第二混合物通过辐射照射，辐射波长小于450nm。
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公开(公告)号：US07789989B2
公开(公告)日：2010-09-07
申请号：US12270612
申请日：2008-11-13
申请人： Lin Ren , Ying Su , Cheng-Hsien Lin
发明人： Lin Ren , Ying Su , Cheng-Hsien Lin
IPC分类号： B29C65/00
CPC分类号： H05K3/4691 , H05K3/0052 , H05K3/4611 , H05K2201/0909 , H05K2201/09127 , Y10T156/1052 , Y10T156/1062 , Y10T156/1064
摘要： A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.
摘要翻译： 制造刚柔柔性印刷电路板的方法包括以下步骤。 首先，提供柔性基板。 其次，在柔性基板中限定至少一个狭缝。 第三，提供具有对应于柔性基板的结构的刚性基板。 第四，将柔性基板层合到刚性基板上以获得层压基板。 第五，去除刚性基板的一部分。 第六，层叠基板沿着假想边界线切割以去除层叠基板的废弃部分。 因此，获得刚性柔性印刷电路板。
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公开(公告)号：US07581312B2
公开(公告)日：2009-09-01
申请号：US11877585
申请日：2007-10-23
申请人： Chih-Yi Tu , Cheng-Hsien Lin , Ming Wang
发明人： Chih-Yi Tu , Cheng-Hsien Lin , Ming Wang
IPC分类号： H05K3/20
CPC分类号： H05K3/4697 , H05K1/0393 , H05K3/4611 , H05K3/4635 , H05K2201/0909 , H05K2201/09127 , H05K2203/063 , Y10T29/49126 , Y10T29/49128 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating the first copper clad laminate, the binder layer and the second copper clad laminate; defining a via hole for establishing electric connection between the first copper clad laminate and the second copper clad laminate; cutting the first copper clad laminate, the binder layer and the second copper clad laminate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.
摘要翻译： 制造多层FPCB的方法包括以下步骤：提供第一覆铜层压板，第二覆铜层压板和粘合剂层; 在粘合剂层上限定开口; 在所述第一覆铜层压板上限定第一狭缝; 层压第一覆铜层压板，粘合剂层和第二覆铜层压板; 限定用于在所述第一覆铜层压板和所述第二覆铜层压板之间建立电连接的通孔; 切割第一覆铜层压板，粘合剂层和第二覆铜层压板，从而形成在不同区域中具有不同层数的多层柔性印刷电路板。
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