公开(公告)号：US10748793B1

公开(公告)日：2020-08-18

申请号：US16274969

申请日：2019-02-13

Applicant: X-Celeprint Limited

Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L25/075 ,  B65G47/90 ,  B41F16/00 ,  H01L33/62

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US20200258761A1

公开(公告)日：2020-08-13

申请号：US16274969

申请日：2019-02-13

Applicant: X-Celeprint Limited

Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90 ,  B41F16/00

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US20200176286A1

公开(公告)日：2020-06-04

申请号：US16207738

申请日：2018-12-03

Applicant: X-Celeprint Limited

Inventor： Robert R. Rotzoll ,  António José Marques Trindade ,  Raja Fazan Gul ,  Alexandre Chikhaoui ,  David Gomez ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L21/683 ,  H01L23/00 ,  H01L25/04 ,  H01L41/313 ,  H01L41/311 ,  H01L41/047 ,  H01L41/053 ,  H03H9/05 ,  B41F16/00 ,  B65G47/90

Abstract: A module structure comprises a patterned substrate having a substrate surface and comprising a substrate post protruding from the substrate surface. A component is disposed on the substrate post. The component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post. The component extends over at least one edge of the substrate post. One or more component electrodes are disposed on the component.

公开(公告)号：US20200176285A1

公开(公告)日：2020-06-04

申请号：US16207690

申请日：2018-12-03

Applicant: X-Celeprint Limited

Inventor： David Gomez ,  Christopher Andrew Bower ,  Raja Fazan Gul ,  António José Marques Trindade ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L23/053 ,  H01L23/10 ,  H01L41/053 ,  H01L41/047 ,  H01L41/25 ,  H01L21/683

Abstract: A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.

公开(公告)号：US20200161291A1

公开(公告)日：2020-05-21

申请号：US16667215

申请日：2019-10-29

Applicant: The Board of Trustees of the University of Illinois ,  X-CELEPRINT LIMITED

Inventor： John A. ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC: H01L25/00 ,  H01S5/30 ,  H01S5/183 ,  H01S5/022 ,  H01L33/52 ,  H01L31/0304 ,  H01L31/0232 ,  H01L31/02 ,  H01L27/146 ,  H01S5/343 ,  H01S5/02 ,  H01L33/62 ,  H01L33/48 ,  H01L33/30 ,  H01L33/06 ,  H01L33/00 ,  H01L31/18 ,  H01L31/167 ,  H01L31/0693 ,  H01L31/0288 ,  H01L31/0216 ,  H01L27/12 ,  H01L31/043 ,  H01L25/04 ,  H01L33/56 ,  H01L33/54 ,  H01L25/16 ,  H01L31/0525 ,  H01L33/58 ,  H01L31/054 ,  H01L25/075 ,  H01S5/42 ,  H01L31/0725 ,  H01L21/00

Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

公开(公告)号：US10573544B1

公开(公告)日：2020-02-25

申请号：US16163559

申请日：2018-10-17

Applicant: X-Celeprint Limited

Inventor： Erich Radauscher ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Matthew Alexander Meitl

IPC: H01L21/67 ,  H01L21/68 ,  H01L21/66 ,  H01L21/683 ,  H01L25/075

Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.

公开(公告)号：US20200052176A1

公开(公告)日：2020-02-13

申请号：US16660776

申请日：2019-10-22

Applicant: X-Celeprint Limited

Inventor： Matthew Meitl ,  Tanya Yvette Moore ,  Ronald S. Cok ,  Salvatore Bonafede ,  Brook Raymond ,  Christopher Andrew Bower ,  Carl Ray Prevatte, JR.

IPC: H01L33/62 ,  H01L33/48

Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.

公开(公告)号：US20200020676A1

公开(公告)日：2020-01-16

申请号：US16033159

申请日：2018-07-11

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Matthew Alexander Meitl ,  Christopher Andrew Bower

IPC: H01L25/16 ,  G09G3/3225

Abstract: An exemplary active-matrix display comprises pixels disposed in a pixel array and pixel micro-controllers disposed in a controller array on a display substrate. Each of the pixels comprises micro-light-emitting elements that emit different color light. Each of the pixel micro-controllers is electrically connected to control the micro-light-emitting elements in each of two or more adjacent pixels in the pixel array. A spatial separation between pixels is greater than a spatial separation between the micro-light-emitting elements and is greater than a size of each of the micro-light-emitting elements. The micro-light-emitting elements in each of the pixels are disposed in a common pixel direction orthogonal to a pixel micro-controller center line an element distance substantially equal to or greater than one quarter of the extent of the pixel micro-controller in the common pixel direction from the center line. The pixel direction for each pixel controlled by a common pixel micro-controller is different.

公开(公告)号：US10468391B2

公开(公告)日：2019-11-05

申请号：US15891211

申请日：2018-02-07

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok

IPC: H01L33/48 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L25/16 ,  H01L33/62 ,  H01L25/13

Abstract: An inorganic light-emitting diode (iLED) display comprises a separate, independent, and distinct display substrate having a display area. A plurality of spatially separated pixels are distributed on or over the display substrate in the display area. Each pixel includes a group of two or more spatially separated iLEDs each having an iLED substrate separate, independent, and distinct from the display substrate. The two or more iLEDs are electrically connected in common to emit light together in response to a control signal. The pixels can include multiple groups of two or more iLEDs, each group of iLEDs can emit a different color of light to make a full-color display. The iLED display can be a passive-matrix display or include a pixel controller in an active-matrix configuration. The iLEDs and pixel controller can be provided on a pixel substrate disposed on the display substrate.

公开(公告)号：US10446719B2

公开(公告)日：2019-10-15

申请号：US14743915

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: G09G3/32 ,  H01L27/15 ,  H01L33/38 ,  H01L23/482 ,  H01L23/538 ,  H01L25/075 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H05B33/08 ,  G02B26/04 ,  G02F1/167 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  F21V9/08 ,  H01L33/58 ,  F21K9/60 ,  H01L33/20 ,  H01L33/40 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13 ,  F21Y101/00 ,  F21Y105/00

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.