公开(公告)号：US10475773B2

公开(公告)日：2019-11-12

申请号：US15875955

申请日：2018-01-19

申请人： OSRAM Opto Semiconductors GmbH ,  X-Celeprint Limited

发明人： Matthew Meitl ,  Christopher Bower ,  Tansen Varghese

IPC分类号： H01L25/075 ,  H01L33/00 ,  H01L33/50 ,  H01L33/44 ,  H01L21/78 ,  H01L33/56 ,  H01L33/22 ,  H01L33/38 ,  H01L33/60

摘要： A method for producing a plurality of semiconductor components and a semiconductor component are disclosed. In an embodiment the component includes a light transmissive carrier, a semiconductor body disposed on the light transmissive carrier, the semiconductor body including a first semiconductor layer, a second semiconductor layer and an active region being arranged between the first semiconductor layer and the second semiconductor layer, wherein the semiconductor body includes a first patterned main surface facing the light transmissive carrier and a second main surface facing away from the carrier and a contact structure including a first contact area and a second contact area arranged on the second main surface, wherein the second contact area is electrically connected to the second semiconductor layer, and wherein the contact structure comprises a via extending from the second main surface throughout the second semiconductor layer and the active region into the first semiconductor layer.

公开(公告)号：US10418331B2

公开(公告)日：2019-09-17

申请号：US15863164

申请日：2018-01-05

申请人： X-Celeprint Limited

发明人： Christopher Bower

IPC分类号： H01L29/10 ,  H01L23/538 ,  H01L21/683 ,  H01L23/00 ,  H01L21/66

摘要： An electronic component array includes a backplane substrate, and a plurality of integrated circuit elements on the backplane substrate. Each of the integrated circuit elements includes a chiplet substrate having a connection pad and a conductor element on a surface thereof. The connection pad and the conductor element are electrically separated by an insulating layer that exposes at least a portion of the connection pad. At least one of the integrated circuit elements is misaligned on the backplane substrate relative to a desired position thereon. A plurality of conductive wires are provided on the backplane substrate including the integrated circuit elements thereon, and the connection pad of each of the integrated circuit elements is electrically connected to a respective one of the conductive wires notwithstanding the misalignment of the at least one of the integrated circuit elements. Related fabrication methods are also discussed.

公开(公告)号：US10361677B2

公开(公告)日：2019-07-23

申请号：US15639495

申请日：2017-06-30

申请人： X-Celeprint Limited

发明人： Christopher Bower ,  Matthew Meitl ,  Ronald S. Cok ,  Robert R. Rotzoll

IPC分类号： H03H9/56 ,  H03H9/17 ,  H03H9/02 ,  H03H9/05 ,  H03H9/54 ,  H03H9/00 ,  H03H9/58 ,  H03H9/13 ,  H03H9/145 ,  H03H3/02 ,  H03H3/08 ,  H03H9/64

摘要： A micro-transfer printable transverse bulk acoustic wave filter comprises a piezoelectric filter element having a top side, a bottom side, a left side, and a right side disposed over a sacrificial portion on a source substrate. A top electrode is in contact with the top side and a bottom electrode is in contact with the bottom side. A left acoustic mirror is in contact with the left side and a right acoustic mirror is in contact with the right side. The thickness of the transverse bulk acoustic wave filter is substantially less than its length or width and its length can be greater than its width. The transverse bulk acoustic wave filter can be disposed on, and electrically connected to, a semiconductor substrate comprising an electronic circuit to control the transverse bulk acoustic wave filter and form a composite heterogeneous device that can be micro-transfer printed.

公开(公告)号：US10312405B2

公开(公告)日：2019-06-04

申请号：US15967968

申请日：2018-05-01

申请人： X-Celeprint Limited

发明人： Christopher Bower ,  Matthew Meitl

IPC分类号： H01L21/00 ,  H01L23/34 ,  H01L33/00 ,  H01L21/20 ,  H01L21/18 ,  H01L21/78 ,  H01L25/00 ,  H01L23/00 ,  H01L21/683 ,  H01L33/22 ,  H01L33/44

摘要： The disclosed technology relates generally to a method and system for micro assembling GaN materials and devices to form displays and lighting components that use arrays of small LEDs and high-power, high-voltage, and or high frequency transistors and diodes. GaN materials and devices can be formed from epitaxy on sapphire, silicon carbide, gallium nitride, aluminum nitride, or silicon substrates. The disclosed technology provides systems and methods for preparing GaN materials and devices at least partially formed on several of those native substrates for micro assembly.

公开(公告)号：US10297502B2

公开(公告)日：2019-05-21

申请号：US15445728

申请日：2017-02-28

申请人： X-Celeprint Limited ,  X-FAB Semiconductor Foundries AG

发明人： Christopher Andrew Bower ,  Ronald S. Cok ,  William Andrew Nevin ,  Gabriel Kittler

IPC分类号： H01L25/00 ,  H01L21/78 ,  H01L21/762 ,  H01L21/683 ,  H01L21/84

摘要： A semiconductor structure suitable for micro-transfer printing includes a semiconductor substrate and a patterned insulation layer disposed on or over the semiconductor substrate. The insulation layer pattern forms one or more etch vias in contact with the semiconductor substrate. Each etch via is exposed. A semiconductor device is disposed on the patterned insulation layer and is surrounded by an isolation material in one or more isolation vias that are adjacent to the etch via. The etch via can be at least partially filled with a semiconductor material that is etchable with a common etchant as the semiconductor substrate. Alternatively, the etch via is empty and the semiconductor substrate is patterned to form a gap that separates at least a part of the semiconductor device from the semiconductor substrate and forms a tether physically connecting the semiconductor device to an anchor portion of the semiconductor substrate or the patterned insulation layer.

公开(公告)号：US20190088690A1

公开(公告)日：2019-03-21

申请号：US16192751

申请日：2018-11-15

申请人： X-Celeprint Limited

发明人： Christopher Bower ,  Etienne Menard ,  Matthew Meitl ,  Joseph Carr

IPC分类号： H01L27/12 ,  H01L21/84 ,  H01L21/3065 ,  H01L21/3205 ,  H01L29/786 ,  H01L21/768

CPC分类号： H01L27/1266 ,  H01L21/3065 ,  H01L21/32055 ,  H01L21/76834 ,  H01L21/76877 ,  H01L21/84 ,  H01L27/1214 ,  H01L27/1222 ,  H01L27/124 ,  H01L27/1248 ,  H01L29/78666

摘要： Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.

公开(公告)号：US20190077182A1

公开(公告)日：2019-03-14

申请号：US16181294

申请日：2018-11-05

申请人： X-Celeprint Limited

发明人： Ronald S. Cok ,  Robert R. Rotzoll ,  Christopher Bower ,  Mark Willner

IPC分类号： B42D25/305 ,  B42D25/485 ,  B42D25/30 ,  G07D11/00 ,  B42D25/29

摘要： A hybrid currency banknote includes a banknote having visible markings. One or more light-controlling elements and a controller are embedded in or on the banknote. The controller is electrically connected to the one or more light-controlling elements to control the one or more light-controlling elements. A power input connection is electrically connected to the controller, or one or more light-controlling elements, or both. A power source can be connected to the power input connection, for example a piezoelectric or photovoltaic power source. In response to applied power, the controller causes the one or more light-controlling elements to emit light. A value can be stored in a memory in the controller and displayed by the light-controlling elements. The value can be assigned or varied by a hybrid currency teller machine.

公开(公告)号：US10217308B2

公开(公告)日：2019-02-26

申请号：US15678981

申请日：2017-08-16

申请人： X-Celeprint Limited

发明人： Robert R. Rotzoll ,  Christopher Bower ,  Ronald S. Cok

IPC分类号： G08B25/10 ,  B42D25/485 ,  G07D7/12 ,  H04B5/00 ,  G08B5/36 ,  G06K19/077 ,  G06K19/07

摘要： A hybrid high-security document includes a document and one or more independent light-emitting modules disposed on or embedded in the document. Each module comprises an antenna with multiple turns, an electronic circuit, and a light emitter mounted and electrically connected on a substrate separate from the document. The electronic circuit is responsive to electrical power provided from the antenna to control the light emitter to emit light. The electronic circuit can include a memory storing information relevant to the hybrid high-security document or its use. The information can be accessed by external readers providing electromagnetic energy to the hybrid high-security document. The hybrid high-security document can be a hybrid banknote.

公开(公告)号：US10198890B2

公开(公告)日：2019-02-05

申请号：US15157838

申请日：2016-05-18

申请人： X-Celeprint Limited

发明人： Robert R. Rotzoll ,  Christopher Bower ,  Ronald S. Cok

IPC分类号： G08B25/10 ,  B42D25/485 ,  G07D7/12 ,  H04B5/00 ,  G08B5/36 ,  G06K19/077 ,  G06K19/07

摘要： A hybrid high-security document includes a document and one or more independent light-emitting modules disposed on or embedded in the document. Each module comprises an antenna with multiple turns, an electronic circuit, and a light emitter mounted and electrically connected on a substrate separate from the document. The electronic circuit is responsive to electrical power provided from the antenna to control the light emitter to emit light. The electronic circuit can include a memory storing information relevant to the hybrid high-security document or its use. The information can be accessed by external readers providing electromagnetic energy to the hybrid high-security document. The hybrid high-security document can be a hybrid banknote.

公开(公告)号：US10193025B2

公开(公告)日：2019-01-29

申请号：US15440843

申请日：2017-02-23

申请人： X-Celeprint Limited

发明人： Christopher Bower ,  Ronald S. Cok

IPC分类号： H01L29/20 ,  H01L33/00 ,  H01L33/46 ,  H01L25/075

摘要： An inorganic light-emitting diode (iLED) pixel structure includes a transparent pixel substrate having an LED surface, an emission surface opposite the LED surface, and one or more sides other than the LED surface and the emission surface that are not parallel to the LED surface or the emission surface. One or more iLEDs are mounted on the pixel substrate and each iLED has an emission side adjacent to the LED surface of the pixel substrate to emit light into the pixel substrate and out of the emission surface. A reflector is disposed on at least a portion of the one or more sides.