公开(公告)号：US5569952A

公开(公告)日：1996-10-29

申请号：US316304

申请日：1994-09-30

申请人： Ronald Dekker ,  Henricus G. R. Maas ,  Dirk J. Gravesteijn ,  Martinus P. J. G. Versleijen

发明人： Ronald Dekker ,  Henricus G. R. Maas ,  Dirk J. Gravesteijn ,  Martinus P. J. G. Versleijen

IPC分类号： H01L29/41 ,  H01L21/331 ,  H01L21/60 ,  H01L23/482 ,  H01L29/73 ,  H01L29/732 ,  H01L23/50 ,  H01L29/417 ,  H01L29/70

CPC分类号： H01L24/05 ,  H01L23/4824 ,  H01L24/06 ,  H01L29/0657 ,  H01L29/7325 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/45144 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48644 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13064 ,  H01L2924/3011

摘要： A semiconductor device includes a semiconductor body (1) having a semiconductor element with connection points (2, 3) which adjoins a surface (4) of the semiconductor body (1) and is laterally insulated and surrounded by a first depression (5) in the surface (4), which depression (5) is provided with a wall (6) and a bottom (7), while the surface (4) of the semiconductor body (1) and the wall (6) and bottom (7) of the depression (5) are covered with an insulating layer (8). The connection points (2, 3) are provided in the insulating layer (8) on the surface (4) of the semiconductor body (1) and are connected to conductor tracks (10, 11) which connect the connection points (2, 3) across a wall (6) to connection surfaces (12, 13) associated with the connection points (2, 3) and situated on the bottom (7). It is found in practice that, in the case of progressive miniaturization, the manufacture of such devices leads to rejects caused by short-circuits between connection surfaces (12, 13). According to the invention, one or several further depressions (50) surrounded by the first depression (5) is/are present in the surface (4) of the semiconductor body (1), while only one connection surface (12, 13) is present on the bottom (7, 57) of each of the first and further depressions (5, 50), which connection surface is connected to a connection point (2, 3) on the surface (4) of the semiconductor body (1) via a conductor track (10, 11). Short-circuits are found to take place in the known semiconductor devices on a wall (6) of the depression (5) when there are more than one conductor tracks (10, 11) on this wall (6). Here, however, only one conductor track (10 or 11) is present on the wall (6, 56 of the depression (5, 50), so short-circuits with other conductor tracks on the wall (6, 56) cannot arise.

公开(公告)号：US08679355B2

公开(公告)日：2014-03-25

申请号：US13321116

申请日：2010-05-26

申请人： Hauke Pohlmann ,  Ronald Dekker ,  Joerg Mueller ,  Martin Duemling

发明人： Hauke Pohlmann ,  Ronald Dekker ,  Joerg Mueller ,  Martin Duemling

IPC分类号： C23F1/00

CPC分类号： H03H3/0073 ,  B81B2201/0271 ,  B81C1/0019 ,  Y10T29/49005 ,  Y10T29/49128 ,  Y10T29/49156

摘要： A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in the material later (34); etching material from the trench (40) such as to also etch the substrate (32) from the first side of the substrate (32); grinding the substrate (32) from a second side of the substrate to expose the trench (40); and using the exposed trench (40) as an etch hole. The exposed trench (40) is used as an etch hole for releasing a portion of the material layer (34), for example a beam resonator (12), from the substrate (32). An input electrode (6), an output electrode (8), and a top electrode (10) are provided.

摘要翻译： 一种制造包括微机电元件的电子器件的方法，所述方法包括以下步骤：在衬底（32）的第一侧上提供材料层（34）; 在后面的材料（34）中提供沟槽（40）; 从沟槽（40）蚀刻材料，以便也从衬底（32）的第一侧蚀刻衬底（32）; 从衬底的第二侧研磨衬底（32）以露出沟槽（40）; 并使用暴露的沟槽（40）作为蚀刻孔。 暴露的沟槽（40）用作用于从衬底（32）释放材料层（34）的一部分（例如光束谐振器（12））的蚀刻孔。 设置有输入电极（6），输出电极（8）和顶部电极（10）。

公开(公告)号：US08254733B2

公开(公告)日：2012-08-28

申请号：US12710729

申请日：2010-02-23

申请人： Rene Gerrit Heideman ,  Ronald Dekker

发明人： Rene Gerrit Heideman ,  Ronald Dekker

IPC分类号： G02B6/00 ,  C12Q1/00

CPC分类号： G01N21/7746 ,  B01L3/5027 ,  B01L2200/10 ,  B01L2300/0654 ,  B01L2300/0867 ,  B01L2400/0421 ,  G01N21/45 ,  G01N27/44721 ,  H01S5/14

摘要： An apparatus and method for optically detecting the presence of an analyte in a solution is presented. An embodiment comprises a waveguide resonator that is optically coupled to a fluid in a fluidic conduit so that the resonant wavelength of the waveguide resonator is based on the refractive index of the fluid.

摘要翻译： 提出了用于光学检测溶液中分析物的存在的装置和方法。 一个实施例包括与流体导管中的流体光学耦合的波导谐振器，使得波导谐振器的谐振波长基于流体的折射率。

公开(公告)号：US20120103085A1

公开(公告)日：2012-05-03

申请号：US13379226

申请日：2010-07-16

申请人： Jaap Roger Haartsen ,  Ronald Dekker ,  Pascal De Graaf ,  Nicolaas Johannes Anthonius Van Veen ,  Alphonsus Tarcisius Jozef Maria Schipper

发明人： Jaap Roger Haartsen ,  Ronald Dekker ,  Pascal De Graaf ,  Nicolaas Johannes Anthonius Van Veen ,  Alphonsus Tarcisius Jozef Maria Schipper

IPC分类号： G01F1/69 ,  H05K3/00 ,  H05K3/32 ,  G01F1/68

CPC分类号： A61M11/005 ,  A61B5/1117 ,  A61B5/681 ,  A61B5/6831 ,  A61B2562/0219 ,  A61B2562/0271 ,  A61M5/16886 ,  A61M11/003 ,  A61M11/042 ,  A61M15/00 ,  A61M16/0003 ,  A61M16/104 ,  A61M16/18 ,  A61M2016/0021 ,  A61M2016/0027 ,  A61M2016/003 ,  A61M2205/332 ,  A61M2205/3334 ,  A61M2205/3368 ,  A61M2205/3375 ,  A61M2205/50 ,  A61M2205/82 ,  G01P5/10 ,  G01P5/12 ,  G01P13/006 ,  G08B21/0446 ,  Y10T29/49117 ,  Y10T29/49128

摘要： A thermal flow sensor integrated circuit for sensing flow in a channel based on temperature measurements, the integrated circuit having a temperature sensing element (30) on a front side of the integrated circuit arranged to face the channel, and a bond pad (60, 200) coupled electrically to the temperature sensing element, for making electrical contact off the integrated circuit, the bond pad being arranged to face away from the channel. By having the bond pad facing away from the channel, the space needed for the bond pad and any connections to it need not extend beyond the temperature sensing element and get in the way of the channel. Hence the temperature sensing element can be located closer to the channel or in the channel to enable measurements with better response time and sensitivity.

摘要翻译： 一种热流传感器集成电路，用于基于温度测量来感测通道中的流动，所述集成电路具有布置成面对所述通道的所述集成电路的前侧上的温度感测元件（30），以及接合焊盘（60,200 ）电耦合到所述温度感测元件，用于使所述集成电路进行电接触，所述接合焊盘被布置为面向远离所述通道。 通过使接合焊盘面向远离通道，接合焊盘所需的空间和与其连接的空间不需要延伸超过温度感测元件并妨碍通道。 因此，温度感测元件可以位于更靠近通道或通道中以使得能够以更好的响应时间和灵敏度进行测量。

公开(公告)号：US20120044459A1

公开(公告)日：2012-02-23

申请号：US13228684

申请日：2011-09-09

申请人： Edwin Jan Klein ,  Ronald Dekker

发明人： Edwin Jan Klein ,  Ronald Dekker

IPC分类号： G02B27/26 ,  G03B21/14

CPC分类号： G03B35/26 ,  G03B21/14 ,  G03B21/2013 ,  G03B21/2033 ,  G03B21/2073 ,  H04N9/3129 ,  H04N13/337 ,  H04N13/363

摘要： An image projection system having a laser projector that projects two differently polarized images on a display region is disclosed. The laser projector enables viewing the two differently polarized images as a three-dimensional image. The image projection system includes a planar lightwave circuit-based beam combiner that enables multiple colors of laser light having different polarization modes to be combined in a single output beam that is scanned over the display region at video rates to produce the two polarized images.

摘要翻译： 公开了一种具有在显示区域上投影两个不同偏振图像的激光投影仪的图像投影系统。 激光投影机可以将两个不同偏振的图像视为三维图像。 图像投影系统包括基于平面光波电路的光束组合器，其能够将具有不同偏振模式的多种激光的颜色组合在以视频速率在显示区域上扫描以产生两个偏振图像的单个输出光束中。

公开(公告)号：US08067802B2

公开(公告)日：2011-11-29

申请号：US10561532

申请日：2003-11-04

申请人： Ronald Dekker ,  Theodorus Martinus Michielsen

发明人： Ronald Dekker ,  Theodorus Martinus Michielsen

IPC分类号： H01L29/786

CPC分类号： H01L27/12 ,  G02F1/133305 ,  G02F1/136227 ,  G02F1/167 ,  G02F2001/13613 ,  G02F2202/105 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/3244 ,  H01L51/524 ,  H01L51/5253 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2251/5338

摘要： The rollable device of the invention comprises a substrate of an insulating material (12) with apertures (15) extending from a first to a second side. On the first side switching elements (13) are present, as well as interconnect lines and the like, covered by a coating of organic material (3). On the second side a functional layer is present. Examples of such functional layers include capacitors, antennas and particularly electro-optical layers. Thus, with a rollable display that may include an antenna and a driver circuit is obtained.

摘要翻译： 本发明的可滚动装置包括具有从第一侧延伸到第二侧的孔（15）的绝缘材料（12）的基板。 存在第一侧开关元件（13）以及由有机材料（3）的涂层覆盖的互连线等。 在第二面上存在功能层。 这些功能层的实例包括电容器，天线，特别是电光层。 因此，可以获得可包括天线和驱动电路的可滚动显示器。

公开(公告)号：US20100150496A1

公开(公告)日：2010-06-17

申请号：US12710729

申请日：2010-02-23

申请人： Rene Gerrit Heideman ,  Ronald Dekker

发明人： Rene Gerrit Heideman ,  Ronald Dekker

IPC分类号： G02B6/10

CPC分类号： G01N21/7746 ,  B01L3/5027 ,  B01L2200/10 ,  B01L2300/0654 ,  B01L2300/0867 ,  B01L2400/0421 ,  G01N21/45 ,  G01N27/44721 ,  H01S5/14

摘要： An apparatus and method for optically detecting the presence of an analyte in a solution is presented. An embodiment comprises a waveguide resonator that is optically coupled to a fluid in a fluidic conduit so that the resonant wavelength of the waveguide resonator is based on the refractive index of the fluid.

摘要翻译： 提出了用于光学检测溶液中分析物的存在的装置和方法。 一个实施例包括与流体导管中的流体光学耦合的波导谐振器，使得波导谐振器的谐振波长基于流体的折射率。

公开(公告)号：US20100149523A1

公开(公告)日：2010-06-17

申请号：US12710669

申请日：2010-02-23

申请人： Rene Gerrit Heideman ,  Ronald Dekker

发明人： Rene Gerrit Heideman ,  Ronald Dekker

IPC分类号： G01N21/41 ,  G02B6/00

CPC分类号： G01N21/7746 ,  B01L3/5027 ,  B01L2200/10 ,  B01L2300/0654 ,  B01L2300/0867 ,  B01L2400/0421 ,  G01N21/45 ,  G01N27/44721 ,  H01S5/14

摘要： An apparatus and method for optically detecting the presence of an analyte in a solution is presented. An embodiment comprises a waveguide resonator that is optically coupled to a fluid in a fluidic conduit so that the resonant wavelength of the waveguide resonator is based on the refractive index of the fluid.

公开(公告)号：US07736948B2

公开(公告)日：2010-06-15

申请号：US12093337

申请日：2006-11-03

申请人： Ronald Dekker ,  Greja Johanna Adriana Maria Verheijden ,  Theodorus Martinus Michielsen ,  Carel Van Der Poel ,  Cornelis Adrianus Henricus Antonius Mutsaers

发明人： Ronald Dekker ,  Greja Johanna Adriana Maria Verheijden ,  Theodorus Martinus Michielsen ,  Carel Van Der Poel ,  Cornelis Adrianus Henricus Antonius Mutsaers

IPC分类号： H01L21/00

CPC分类号： H01L27/1266 ,  H01L21/84 ,  H01L27/1214 ,  Y10T29/49124

摘要： Individual devices (100) are locally attached to a carrier substrate (10), so that they can be removed therefrom individually. This is achieved through the use of a patterned release layer, particularly a layer that is removable through decomposition into gaseous or vaporized decomposition products. The mechanical connection between the carrier substrate (10) and the individual devices (100) is provided by a bridging portion (43) of an adhesion layer (40).

摘要翻译： 单个设备（100）局部地附接到载体基板（10），使得它们可以单独地从其移除。 这通过使用图案化的释放层，特别是通过分解成气态或蒸发的分解产物可除去的层来实现。 载体基板（10）和各个装置（100）之间的机械连接由粘合层（40）的桥接部分（43）提供。

公开(公告)号：US07704881B2

公开(公告)日：2010-04-27

申请号：US12092605

申请日：2006-11-03

申请人： Johan H. Klootwijk ,  Antonius L. A. M. Kemmeren ,  Ronald Dekker ,  Eric Cornelis Egbertus Van Grunsven ,  Freddy Roozeboom

发明人： Johan H. Klootwijk ,  Antonius L. A. M. Kemmeren ,  Ronald Dekker ,  Eric Cornelis Egbertus Van Grunsven ,  Freddy Roozeboom

IPC分类号： H01L21/44

CPC分类号： H01L21/76898 ,  H01L21/764 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention relates to a method for producing a substrate with at least one covered via that electrically and preferably also thermally connects a first substrate side with an opposite second substrate side. The processing involves forming a trench on a the first substrate side remains and covering the trench with a permanent layer on top of a temporary, sacrificial cap-layer, which is decomposed in a thermal process step. The method of the invention provides alternative ways to remove decomposition products of the sacrificial cap-layer material without remaining traces or contamination even in the presence of the permanent layer. This is, according to a first aspect of the invention, achieved by providing the substrate trench with an overcoat layer that has holes. The holes in the overcoat layer leave room for the removal of the decomposition products of the cap-layer material. According to the second aspect of the invention, opening the covered trench from the second substrate side and allowing the cap-layer material to be removed through that opening provides a solution. Both methods of the present invention are based on the common idea of using a temporary cap-layer even in a situation where the substrate opening is permanently covered before the removal of the temporary cap-layer.

摘要翻译： 本发明涉及一种制造具有至少一个覆盖通孔的基板的方法，所述至少一个覆盖通孔电连接并优选地将第一基板侧与相对的第二基板侧热连接。 所述处理涉及在第一基板侧上形成沟槽，并在热处理步骤中分解的临时牺牲盖层的顶部上保留并覆盖具有永久层的沟槽。 本发明的方法提供了即使在存在永久层的情况下除去牺牲帽层材料的分解产物而不留下痕迹或污染物的替代方法。 根据本发明的第一方面，这是通过为基底沟槽提供具有孔的外涂层而实现的。 外涂层中的孔留下去除盖层材料的分解产物的空间。 根据本发明的第二方面，从第二基板侧打开被覆盖的沟槽并且允许通过该开口去除盖层材料提供了一种解决方案。 本发明的两种方法都是基于即使在去除临时盖层之前基材开口被永久地覆盖的情况下使用临时盖层的常见思想。