摘要:
A showerhead used for dispensing gas over a wafer in chemical vapor deposition (CVD), especially for CVD of copper in a thermal process using a precursor such as HFAC-Cu-TMVS. The patterns of holes is tailored to compensate for thermal and other effects, in particular by increasing the density of holes toward the periphery of the wafer in three or more zones. Such a variable pattern is particularly useful for liquid precursors that are atomized in a carrier gas, in which case a second perforated plate in back of the showerhead face can be eliminated, thereby reducing the flow impedance and the required pressure of the liquid-entrained gas, which tends to deposit out at higher pressures. The reduced flow impedance is particularly useful for CVD of copper.
摘要:
Copper films having improved properties are deposited by chemical vapor deposition from an organocopper precursor of a blend of copper hexafluoroacetylacetonate trimethylvinylsilane and from about 1.0 to 5.0 percent by weight of trimethylvinylsilane that is vaporized in a vaporizer, and passed into a chemical vapor deposition chamber. Separately up to about 2 percent by weight of the precursor blend of water vapor is added directly to the chamber.
摘要:
An improved contactless EPROM array, EPROM cell design, and method for fabricating the same is based on a unique drain-source-drain configuration, in which a single source diffusion is shared by two columns of transistors. An elongated first drain diffusion region, an elongated source diffusion region, and an elongated second drain diffusion region, are formed in a semi-conductor substrate along essentially parallel lines. Field oxide regions are grown on opposite sides of the first and second drain diffusion regions. Floating gates and control gate wordlines are formed orthogonal to the drain-source-drain structure to establish two columns of storage cells having a shared source region. The shared source region is coupled through a bottom block select transistor to a virtual ground terminal. Each drain diffusion region is-coupled through a top block select transistor to global bitline. The cell structure uses two metal global bitlines which extend essentially parallel to the drain, source and drain diffusion regions, and a virtual ground conductor which couples a plurality of columns of transistors to a virtual ground terminal through a horizontal conductor, such as a buried diffusion line.
摘要:
A process for fabricating MOSFET structures, using one gate oxide thickness, but resulting in both low and high operating voltage devices, has been developed. A fabrication sequence is described illustrating the process that allows the formation of a depleted gate polysilicon structure, resulting in high operating voltages, and doped polysilicon gate structures, resulting in lower operating voltages.
摘要:
Provided is a high-strength, bonded La(Fe, Si)13-based magnetocaloric material, as well as a preparation method and use thereof. The magnetocaloric material comprises magnetocaloric alloy particles and an adhesive agent, wherein the particle size of the magnetocaloric alloy particles is less than or equal to 800 μm and are bonded into a massive material by the adhesive agent; the magnetocaloric alloy particle has a NaZn13-type structure and is represented by a chemical formula of La1-xRx(Fe1-p-qCopMnq)13-ySiyAα, wherein R is one or more selected from elements cerium (Ce), praseodymium (Pr) and neodymium (Nd), A is one or more selected from elements C, H and B, x is in the range of 0≤x≤0.5, y is in the range of 0.8≤y≤2, p is in the range of 0≤p≤0.2, q is in the range of 0≤q≤0.2, α is in the range of 0≤α≤3.0. Using a bonding and thermosetting method, and by means of adjusting the forming pressure, thermosetting temperature, and thermosetting atmosphere, etc., a high-strength, bonded La(Fe, Si)13-based magnetocaloric material can be obtained, which overcomes the frangibility, the intrinsic property, of the magnetocaloric material. At the same time, the magnetic entropy change remains substantially the same, as compared with that before the bonding. The magnetic hysteresis loss declines as the forming pressure increases. And the effective refrigerating capacity, after the maximum loss being deducted, remains unchanged or increases.
摘要:
The present invention relates to an interface and method for enabling interconnection of a host device and a small-formfactor pluggable module. The interface comprises a host device connector operative to receive a mating small-formfactor pluggable module connector and a switching device connected to the host device connector and operative to selectively switch at least one signal carried over the host device connector between at least two separate signal paths of the host device depending on a selected switching mode of the switching device.
摘要:
The present invention provides methods for the preparation of protein hydrolysate, peptide solution and peptide from BSG. The wet BSG or BSG powder is dispersed in extract solution to prepare the crude BSG protein or the crude BSG protein solution. Preparing the crude BSG protein solution using the crude BSG protein and adjusting the pH to 6.5˜8.5, or adjusting the pH of the crude BSG protein solution to 6.5˜8.5. Then the solution is hydrolyzed with protease at 45° C. to 65° C. for 1 h to 5 h in a water bath shaker to prepare BSG protein hydrolysate. The protein hydrolysate is heated to inactivate the protease and centrifuged to obtain the peptide solution. The peptide solution is separated by gel filtration and each peak is collected and pooled together to obtain the peptide. The protein hydrolysate, peptide solution and peptide in the present invention are all prepared from BSG which is a natural product and available at low cost throughout the year. There is no harmful material used in the production process. The results of in vitro experiment suggest that BSG peptide prepared by this method shows a significantly hypoglycemic effect.
摘要:
In one embodiment, an apparatus for performing an atomic layer deposition (ALD) process is provided which includes a chamber body containing a substrate support, a lid assembly attached to the chamber body, a remote plasma system (RPS) in fluid communication with the reaction zone, a centralized expanding conduit extending through the lid assembly and expanding radially outwards, a first gas delivery sub-assembly configured to deliver a first process gas, and a second gas delivery sub-assembly configured to deliver a second process gas into the centralized expanding conduit. The first gas delivery sub-assembly contains an annular channel encircling and in fluid communication with the centralized expanding conduit, wherein the annular channel is adapted to deliver the first process gas through a plurality of passageways and nozzles and into the centralized expanding conduit. The second gas delivery sub-assembly contains a gas inlet in fluid communication to the centralized expanding conduit.
摘要:
Embodiments described herein are directed to an apparatus for generating a precursor for a semiconductor processing system. In one embodiment, an apparatus for generating a precursor gas during a vapor deposition process is described. The apparatus includes a canister containing an interior volume between a lid and a bottom, a gaseous inlet and a gaseous outlet disposed on the lid, a plurality of silos coupled to the bottom and extending from a lower region to an upper region of the interior volume, and a tantalum precursor having a chlorine concentration of about 5 ppm or less contained within the lower region of the canister.