摘要:
A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. At least one penetration hole extends from one surface of the semiconductor chip to an opposite surface of the semiconductor chip. A penetration electrode is situated inside the penetration hole without contacting a wall of the penetration hole. The penetration electrode has one end fixed to the one surface of the semiconductor chip and an opposite end protruding from the opposite surface of the semiconductor chip. A connection terminal is formed on the opposite end of the penetration electrode and electrically connected to the wiring board.
摘要:
A light-emitting device including a light-emitting element and a substrate where the light-emitting element is arranged. A housing part housing the light-emitting element and having a shape that is tapered upward from the substrate and a metal frame surrounding the light-emitting element and including the side face of the housing part made into an almost mirror-polished surface are provided on the substrate.
摘要:
One of a backup apparatus and a storage system performs control to store backup data in a storage system which belongs to an organization and/or location different from an organization and/or location to which a storage-target storage system for original data belongs, based on information (P) and/or (Q) below: (P) information relating to original data, and information relating to backup data, which is a copy of the original data; (Q) information indicating an organization and/or location to which each storage system belongs.
摘要:
In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity.
摘要:
Provided is a computer system including a plurality of storage apparatuses, in which, if the storage apparatuses employ an external mapping/connection system, the plurality of storage apparatuses can efficiently use each other's storage resources. The computer system includes a plurality of storage apparatuses and a management computer for managing the storage apparatuses. The management computer determines whether or not it is possible to perform external connection between the plurality of storage apparatuses and whether or not it is possible to divert the use of a storage device in one storage apparatus to another storage apparatus, on the basis of a criteria table, and if it is possible to perform external connection between the plurality of storage apparatuses, it is carried out and, if it is not possible, the management computer diverts the use of a storage device in one storage apparatus to another storage apparatus.
摘要:
A processor of a storage controller receives an erasure process request relating to data stored in a storage unit, from a host computer, via a data I/O interface, detects a logical storage extent which is different to the logical storage extent allocated to the storage unit and which can be allocated, allocates the logical storage extent thus detected to the storage unit, sends a notification indicating that access to the storage unit is possible, to the host computer which is the source of the request, and then executes erasure of the data in the logical storage extent that is associated with the storage unit forming the erasure object, and sends a data erasure notification to the management computer when the data has been erased.
摘要:
A probe card is disclosed that includes a board having a first surface and a second surface facing away from each other and a through hole formed between the first and second surfaces; and a probe needle having a penetration part and a support part. The penetration part is placed in the through hole without contacting the board and projects from the first and second surfaces of the board. The support part is integrated with a first one of the end portions of the penetration part and connected to one of the first and second surfaces of the board. The support part has a spring characteristic. The penetration part is configured to have a second one of its end portions come into contact with an electrode pad of a semiconductor chip at the time of conducting an electrical test on the semiconductor chip.
摘要:
A light-emitting device including a light-emitting element and a substrate where the light-emitting element is arranged. A housing part housing the light-emitting element and having a shape that is tapered upward from the substrate and a metal frame surrounding the light-emitting element and including the side face of the housing part made into an almost mirror-polished surface are provided on the substrate.
摘要:
The threshold excess is judged by a peak value, and therefore, since the threshold excess is judged by a value of high-workload IO of backup or the like that is designed on the assumption that the workload of storage is high, whether the performance limit has been reached remains uncertain. Furthermore, although an optimistic prediction trend with low workload trend and a pessimistic prediction trend with high pessimistic workload trend are presented, LUs that require improvement remain uncertain. Moreover, the time to improve the configuration and the effect of the improvement remain uncertain, and therefore, an improved configuration cannot be determined.Configuration information, performance information, and operation information are acquired from a storage, a performance limit excess time is predicted based on the performance information excluding LUs exceeding the performance trend, and an optimal improved configuration is determined from the performance limit after improvement and the time required for the improvement.
摘要:
A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.