公开(公告)号：US08564077B2

公开(公告)日：2013-10-22

申请号：US12643391

申请日：2009-12-21

申请人： Akinori Shiraishi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Yuichi Taguchi ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Yuichi Taguchi ,  Mitsutoshi Higashi

IPC分类号： H01L29/84 ,  H01L23/52 ,  H01L21/50

CPC分类号： G01P1/023 ,  B81B7/0074 ,  B81B2201/0235 ,  G01D11/245 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15156 ,  H01L2924/153 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.

摘要翻译： 一种电子部件用包装体，具有矩形包装体，该矩形包装体具有与安装基板的平坦安装面抵接的平坦切割面，与该平坦切断面交叉的第一侧面，以及形成在上述 平切面和第一侧表面，安装在封装主体中的电子部件，以及电连接到电子部件并形成在第一凹口部分的内壁表面上的第一焊盘。

公开(公告)号：US07981798B2

公开(公告)日：2011-07-19

申请号：US12233875

申请日：2008-09-19

申请人： Yuichi Taguchi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Akinori Shiraishi ,  Masahiro Sunohara ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

IPC分类号： H01L21/44

CPC分类号： H01L33/486 ,  B81B2207/096 ,  B81C1/00301 ,  H01L24/97 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/12041 ,  H01L2924/15788 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599

摘要： The present disclosure relates to a method of manufacturing a substrate. The method includes: (a) forming through holes by applying an anisotropic etching to a silicon substrate from a first surface of the silicon substrate; (b) forming a first insulating film to cover the first surface of the silicon substrate, surfaces of the silicon substrate exposed from the through holes, and a second surface of the silicon substrate opposite to the first surface; (c) forming an opening in a portion of the first insulating film provided on the second surface, the portion of the first insulating film corresponding to an area in which the through holes are formed; (d) etching the silicon substrate using the first insulating film provided on the second surface as a mask, thereby forming a cavity in the silicon substrate; and (e) removing the first insulating film.

摘要翻译： 本公开涉及一种制造衬底的方法。 该方法包括：（a）通过从硅衬底的第一表面向硅衬底施加各向异性蚀刻形成通孔; （b）形成第一绝缘膜以覆盖硅衬底的第一表面，从通孔露出的硅衬底的表面和与第一表面相对的硅衬底的第二表面; （c）在设置在第二表面上的第一绝缘膜的一部分中形成开口，第一绝缘膜的与形成通孔的区域相对应的部分; （d）使用设置在第二表面上的第一绝缘膜作为掩模蚀刻硅衬底，从而在硅衬底中形成空腔; 和（e）去除第一绝缘膜。

公开(公告)号：US07708613B2

公开(公告)日：2010-05-04

申请号：US11656580

申请日：2007-01-23

申请人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

发明人： Yuichi Taguchi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Mitsutoshi Higashi

IPC分类号： H01J1/62

CPC分类号： H01L33/507 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/16195 ,  H01L2933/0041

摘要： A method of producing a light emitting apparatus including a light emitting element, a light emitting element housing having a recess for housing the light emitting element, and a translucent substrate placed on the light emitting element housing is disclosed. The disclosed method includes a fluorescent-substance-containing resin forming step of forming a fluorescent-substance-containing resin on a first side of the translucent substrate which first side is opposite to a second side of the translucent substrate which second side faces the recess. In the fluorescent-substance-containing resin forming step, luminance and chromaticity of light that is emitted from the light emitting element and then transmitted by the fluorescent-substance-containing resin are measured and a thickness of the fluorescent-substance-containing resin is adjusted based on the measured luminance and chromaticity so that light emitted from the light emitting apparatus attains the specified luminance and chromaticity.

摘要翻译： 公开了一种制造包括发光元件的发光装置的方法，具有用于容纳发光元件的凹部的发光元件壳体和放置在发光元件壳体上的透光性基板。 所公开的方法包括在透光性基板的第一面上形成含有荧光物质的树脂的荧光物质的树脂形成工序，第一面与透光性基板的第二面相对，第二面与凹部相对。 在含荧光物质的树脂形成步骤中，测量从发光元件发射并随后由含荧光物质的树脂透射的光的亮度和色度，并调节含荧光物质的树脂的厚度 基于测量的亮度和色度，使得从发光装置发射的光达到规定的亮度和色度。

公开(公告)号：US07494898B2

公开(公告)日：2009-02-24

申请号：US11641336

申请日：2006-12-19

申请人： Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

发明人： Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

IPC分类号： H01L21/00

CPC分类号： H01L33/483 ,  B81B7/0067 ,  H01L2224/16225

摘要： A disclosed method for manufacturing a semiconductor device having a structure where a semiconductor element is mounted on a first substrate includes the steps of: bonding the first substrate on which the semiconductor element is mounted and a second substrate made of a material different from a material of the first substrate so as to encapsulate the semiconductor element; forming a first groove in the first substrate and a second groove in the second substrate; and cleaving a portion between the first groove and the second groove so as to individualize the semiconductor device.

摘要翻译： 公开的制造半导体器件的半导体器件的方法，其中半导体元件安装在第一衬底上，包括以下步骤：将其上安装有半导体元件的第一衬底和由不同于 第一衬底以封装半导体元件; 在所述第一基板中形成第一凹槽，在所述第二基板中形成第二凹槽; 并且在第一凹槽和第二凹槽之间切割一部分，以使半导体器件单独化。

公开(公告)号：US08053886B2

公开(公告)日：2011-11-08

申请号：US12535751

申请日：2009-08-05

申请人： Yuichi Taguchi ,  Mitsutoshi Higashi ,  Akinori Shiraishi ,  Hideaki Sakaguchi ,  Masahiro Sunohara

发明人： Yuichi Taguchi ,  Mitsutoshi Higashi ,  Akinori Shiraishi ,  Hideaki Sakaguchi ,  Masahiro Sunohara

IPC分类号： H01L23/48

CPC分类号： H01L23/481 ,  H01L21/6835 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/6835 ,  H01L2221/68372 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. At least one penetration hole extends from one surface of the semiconductor chip to an opposite surface of the semiconductor chip. A penetration electrode is situated inside the penetration hole without contacting a wall of the penetration hole. The penetration electrode has one end fixed to the one surface of the semiconductor chip and an opposite end protruding from the opposite surface of the semiconductor chip. A connection terminal is formed on the opposite end of the penetration electrode and electrically connected to the wiring board.

摘要翻译： 半导体封装包括布线板和安装在布线板上的半导体器件。 至少一个穿透孔从半导体芯片的一个表面延伸到半导体芯片的相对表面。 穿透电极位于穿透孔的内部，而不与穿透孔的壁接触。 穿透电极具有固定在半导体芯片的一个表面上的一端和从半导体芯片的相对表面突出的相对端。 连接端子形成在穿透电极的相对端并电连接到布线板。

公开(公告)号：US08044429B2

公开(公告)日：2011-10-25

申请号：US12907594

申请日：2010-10-19

申请人： Mitsutoshi Higashi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Hideaki Sakaguchi

发明人： Mitsutoshi Higashi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Hideaki Sakaguchi

IPC分类号： H01L29/267 ,  H01L29/16

CPC分类号： H01L33/60 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  Y10T29/49002 ,  Y10T83/04 ,  H01L2224/05599

摘要： A light-emitting device including a light-emitting element and a substrate where the light-emitting element is arranged. A housing part housing the light-emitting element and having a shape that is tapered upward from the substrate and a metal frame surrounding the light-emitting element and including the side face of the housing part made into an almost mirror-polished surface are provided on the substrate.

摘要翻译： 一种发光装置，其包括发光元件和布置有发光元件的基板。 壳体部分容纳发光元件并且具有从基板向上倾斜的形状以及围绕发光元件的金属框架并且包括被制成几乎镜面抛光表面的壳体部分的侧面设置在 底物。

公开(公告)号：US20110032710A1

公开(公告)日：2011-02-10

申请号：US12907594

申请日：2010-10-19

申请人： Mitsutoshi Higashi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Hideaki Sakaguchi

发明人： Mitsutoshi Higashi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Kei Murayama ,  Naoyuki Koizumi ,  Hideaki Sakaguchi

IPC分类号： F21V7/00 ,  F21V15/01 ,  H05K13/00 ,  B26D1/00

CPC分类号： H01L33/60 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  Y10T29/49002 ,  Y10T83/04 ,  H01L2224/05599

摘要： A light-emitting device including a light-emitting element and a substrate where the light-emitting element is arranged. A housing part housing the light-emitting element and having a shape that is tapered upward from the substrate and a metal frame surrounding the light-emitting element and including the side face of the housing part made into an almost mirror-polished surface are provided on the substrate.

摘要翻译： 一种发光装置，其包括发光元件和布置有发光元件的基板。 壳体部分容纳发光元件并且具有从基板向上倾斜的形状以及围绕发光元件的金属框架并且包括被制成几乎镜面抛光表面的壳体部分的侧面设置在 底物。

公开(公告)号：US20100155862A1

公开(公告)日：2010-06-24

申请号：US12643391

申请日：2009-12-21

申请人： Akinori Shiraishi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Yuichi Taguchi ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Masahiro Sunohara ,  Hideaki Sakaguchi ,  Yuichi Taguchi ,  Mitsutoshi Higashi

IPC分类号： H01L29/84 ,  H01L23/52 ,  H01L21/50

CPC分类号： G01P1/023 ,  B81B7/0074 ,  B81B2201/0235 ,  G01D11/245 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15156 ,  H01L2924/153 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： A package for electronic component comprises a rectangular package body having a flat cut surface to be abutted on a flat mounting surface of a mounting substrate, a first side surface intersecting with the flat cut surface, and a first notch part formed at a boundary between the flat cut surface and the first side surface, an electronic component installed in the package body, and a first pad electrically connected to the electronic component and formed on an inner wall surface of the first notch part.

摘要翻译： 一种电子部件用包装体，具有矩形包装体，该矩形包装体具有与安装基板的平坦安装面抵接的平坦切割面，与该平坦切断面交叉的第一侧面，以及形成在上述 平切面和第一侧表面，安装在封装主体中的电子部件，以及电连接到电子部件并形成在第一凹口部分的内壁表面上的第一焊盘。

公开(公告)号：US20070176197A1

公开(公告)日：2007-08-02

申请号：US11699034

申请日：2007-01-29

申请人： Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Mitsutoshi Higashi

发明人： Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Masahiro Sunohara ,  Yuichi Taguchi ,  Mitsutoshi Higashi

IPC分类号： H01L21/00 ,  H01L33/00 ,  H01L29/22

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device 10 has such a structure that a plurality of through electrodes 30 is formed on a substrate 20 and each of terminals of light emitting devices (LEDs) 40 is electrically connected to each of the through electrodes 30 via a bump 50 on a lower surface side. In the semiconductor device 10, moreover, a partition wall 80 for surrounding a mounting region of each of the light emitting devices 40 is formed on the substrate 20. The partition wall 80 is formed by laminating a metal film (Cu) using a thin film forming method such as a plating method. Furthermore, the partition wall 80 is formed to be opposed close to each of side surfaces of the light emitting devices 40 and is provided to surround each of the light emitting devices 40.

摘要翻译： 半导体器件10具有在基板20上形成多个贯通电极30的结构，并且发光器件（LED）40的每个端子经由下部的凸块50电连接到每个贯通电极30 表面 此外，在半导体装置10中，在基板20上形成有用于围绕各发光元件40的安装区域的分隔壁80.分隔壁80是利用薄膜 电镀法等成型方法。 此外，分隔壁80形成为与发光装置40的每个侧表面相对，并且被设置成围绕每个发光装置40。

公开(公告)号：US20070161211A1

公开(公告)日：2007-07-12

申请号：US11641336

申请日：2006-12-19

申请人： Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

发明人： Masahiro Sunohara ,  Yuichi Taguchi ,  Akinori Shiraishi ,  Naoyuki Koizumi ,  Kei Murayama ,  Hideaki Sakaguchi ,  Mitsutoshi Higashi

IPC分类号： H01L21/30

CPC分类号： H01L33/483 ,  B81B7/0067 ,  H01L2224/16225

摘要： A disclosed method for manufacturing a semiconductor device having a structure where a semiconductor element is mounted on a first substrate includes the steps of: bonding the first substrate on which the semiconductor element is mounted and a second substrate made of a material different from a material of the first substrate so as to encapsulate the semiconductor element; forming a first groove in the first substrate and a second groove in the second substrate; and cleaving a portion between the first groove and the second groove so as to individualize the semiconductor device.

摘要翻译： 公开的制造半导体器件的半导体器件的方法，其中半导体元件安装在第一衬底上，包括以下步骤：将其上安装有半导体元件的第一衬底和由不同于 第一衬底以封装半导体元件; 在所述第一基板中形成第一凹槽，在所述第二基板中形成第二凹槽; 并且在第一凹槽和第二凹槽之间切割一部分，以使半导体器件单独化。