公开(公告)号：US4720034A

公开(公告)日：1988-01-19

申请号：US928951

申请日：1986-11-10

申请人： Jong S. Lee

发明人： Jong S. Lee

IPC分类号： H05K3/34 ,  H05K13/04 ,  B05C13/00

CPC分类号： H05K3/3468 ,  H05K13/0465 ,  H05K3/3426 ,  H05K2201/10984 ,  Y02P70/613 ,  Y10S269/903

摘要： Desired control of the thickness and composition of a solder coat on the J-leads of an integrated circuit Quad package is obtained by orienting the packages while being solder coated in a "leads-up" orientation as a series of strips mounting the packages are passed through a solder wave of a wave soldering apparatus on a pallet. The Quad or other shaped integrated circuit or other electronic packages which have leads extending exteriorly thereof, thus have the critical lead crest portions coated with substantially the same solder layer thickness and composition. This permits reliable electrical connections between the crest portions of the leads and printed circuit board metal traces (metallization), particularly in surface mounting of the package to a printed circuit board. An additional feature of the invention is a pallet for holding a series of package-holding elongate frames which pallet is used for conveying the packages through the wave soldering apparatus.

摘要翻译： 期望对集成电路的J引线上的焊料涂层的厚度和组成的控制四重封装是通过将封装定向在以“引导”方向焊接涂覆的情况下获得的，因为安装封装的一系列带通过 通过在托盘上的波峰焊装置的焊波。 具有在其外部延伸的引线的四边形或其他形状的集成电路或其他电子封装，因此具有涂覆有基本上相同的焊料层厚度和组成的临界引线顶部。 这允许引线的顶部和印刷电路板金属迹线（金属化）之间的可靠电连接，特别是在封装到印刷电路板的表面安装中。 本发明的附加特征是用于保持一系列包装保持细长框架的托盘，该托盘用于通过波峰焊装置输送包装。

公开(公告)号：US4693408A

公开(公告)日：1987-09-15

申请号：US858663

申请日：1986-05-02

申请人： David R. Dines ,  Vertis C. Webb

发明人： David R. Dines ,  Vertis C. Webb

IPC分类号： B23K1/012 ,  H01R43/02 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01R43/0256 ,  B23K1/012 ,  H05K3/3405 ,  H05K2201/10189 ,  H05K2201/10984 ,  H05K2203/0405 ,  Y10T29/49144 ,  Y10T29/49149

摘要： A connector (10) having two rows of opposed terminals (11, 12) joined by a pair of solder bars (13, 14) is mounted on a printed circuit board (16) with the terminals overlaying circuit board edge contact pads (15, 19) on opposite sides of the board. The assembled connector and circuit board is placed in a fixture whereafter pairs of comb devices are manipulated to position the comb tines between adjoining pairs of terminals. The fixture is conveyed at a fast rate in a first direction past a pair of heaters (34, 35) for preheating the two rows of terminals, the solder bars, and the circuit board pads. Next, the fixture is returned in a second opposite direction at a slow rate past the heaters to melt and thereby solder bond the comb held terminals to their corresponding board pads.

摘要翻译： 具有由一对焊条（13,14）连接的两列相对端子（11,12）的连接器（10）安装在印刷电路板（16）上，端子覆盖电路板边缘接触焊盘 19）在板的对面。 将组装的连接器和电路板放置在固定装置中，然后操纵成对的梳状装置以将梳齿定位在相邻的端子对之间。 固定装置通过一对加热器（34,35）以第一方向以快速的速度传送，用于预热两排端子，焊条和电路板焊盘。 接下来，夹具以比较慢的速度在第二相反方向返回到加热器以熔化，从而将梳状保持端子焊接到它们对应的板焊盘。

公开(公告)号：US4684055A

公开(公告)日：1987-08-04

申请号：US771846

申请日：1985-09-09

申请人： Scott D. Baer ,  Thomas P. Glenn

发明人： Scott D. Baer ,  Thomas P. Glenn

IPC分类号： B23K3/06 ,  B23K35/02 ,  H05K3/34 ,  B23K31/02

CPC分类号： B23K3/06 ,  B23K35/0222 ,  H05K3/3484 ,  H05K2201/10424 ,  H05K2201/10984 ,  H05K2203/0156 ,  H05K2203/0338

摘要： A method for soldering the underside of a substrate between leads. A paste of solder emulsified in a flux material is printed onto a carrier and film. The paste is adhered to the film by drying or reflowing before being placed onto the substrate between the projecting leads. The substrate and film are then heated. The molten solder having an affinity for plated surface areas of the substrate and no affinity for the polyimide film transfers and self-aligns to the plated surfaces of the substrate. The method allows selective soldering of the underside surface of a substrate having leads without soldering these leads, or selective soldering of some plated areas of a substrate while leaving other plated areas free of solder.

摘要翻译： 用于在引线之间焊接衬底的下侧的方法。 将在助焊剂材料中乳化的焊料膏印刷到载体和膜上。 通过干燥或回流将糊状物粘附到膜上，然后将其放置在突出引线之间的基板上。 然后将基材和膜加热。 对基板的电镀表面区域具有亲和力并且对聚酰亚胺膜没有亲和性的熔融焊料转移并与衬底的电镀表面自对准。 该方法允许在没有焊接这些引线的情况下选择性地焊接具有引线的基板的下表面，或者选择性地焊接衬底的一些电镀区域，同时留下不含焊料的其它电镀区域。

公开(公告)号：US4554575A

公开(公告)日：1985-11-19

申请号：US493903

申请日：1983-05-12

申请人： Michael R. Lucas

发明人： Michael R. Lucas

IPC分类号： H01L23/13 ,  H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K3/42 ,  H01L23/14 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L23/3672 ,  H01L23/13 ,  H01L23/49811 ,  H05K1/0206 ,  H05K3/303 ,  H05K3/3442 ,  H01L2924/0002 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/09181 ,  H05K2201/10727 ,  H05K2201/10984 ,  H05K2201/2036 ,  H05K2203/0415 ,  H05K3/42 ,  Y02P70/613

摘要： A leadless integrated circuit chip carrier apparatus and method of assembly to a printed circuit board. A plurality of castellations are provided in the perimeter walls of the carrier member and solder preforms are deformably fitted in the castellations for reflow vapor phase soldering to the printed circuit board. A spacer member is disposed between the carrier member and the printed circuit board and has a thermal coefficient of expansion matched to that of the solder. The spacer includes a high thermal conductivity planar metal portion sandwiched between an adhesive epoxy layer which facilitates assembly of the carrier to the circuit board.

摘要翻译： 一种无引线集成电路芯片载体装置和组装到印刷电路板的方法。 在载体构件的周边壁中设置多个雉member，并且焊料预成型件可变形地装配在蓖麻中以便回流气相焊接到印刷电路板。 间隔构件设置在载体构件和印刷电路板之间，并且具有与焊料的热膨胀系数匹配的热膨胀系数。 间隔件包括夹在粘合剂环氧树脂层之间的高导热平面金属部分，其有助于将载体组装到电路板。

公开(公告)号：US4502745A

公开(公告)日：1985-03-05

申请号：US562510

申请日：1983-12-19

申请人： Richard A. Chavers ,  Oland J. Duff

发明人： Richard A. Chavers ,  Oland J. Duff

IPC分类号： H05K3/34 ,  H01R4/02

CPC分类号： H01R12/57 ,  H05K3/3405 ,  H05K2201/10386 ,  H05K2201/10984

摘要： A progressively-increasing clamping force lead (10) includes a resilient contact finger (22) having an outer arcuate loop portion (26) and a locking tab (34) having a camming surface (70) projecting at an angle from an outer end of the arcuate loop portion toward a planar surface (56) of a clamping finger (20). In the assembling of the lead (10) to the substrate circuit device (16), as the locking tab (34) engages and rides up an adjacent edge (64) of the substrate circuit device, the locking tab causes progresive flexing of an inner connecting portion (36) of the contact finger (22) and progressive coiling of the arcuate loop portion (26) of the contact finger to cause the arcuate loop portion to engage a contact pad (14) with a progressively-increasing force. Subsequently, the arcuate loop portion (26) and the locking tab (34) seat firmly on the contact pad (14) to retain the lead (10) securely on the substrate circuit device (16). The lead (10) then may be soldered to the contact pad (14).

摘要翻译： 逐渐增加的夹紧力引线（10）包括具有外弓形环部分（26）的弹性接触指（22）和具有凸出表面（70）的锁定突片（34），所述凸轮表面（70）从 所述弓形环部朝向夹紧指（20）的平坦表面（56）。 在将引线（10）组装到基板电路装置（16）中时，随着锁定突片（34）接合并且爬上基板电路装置的相邻边缘（64），锁定突片引起内部 接触指状物（22）的连接部分（36）和接触指状物的弓形环部分（26）的逐渐卷绕，以使弓形环部分以逐渐增加的力接合接触垫片（14）。 随后，弓形环部分（26）和锁定片（34）牢固地安置在接触垫（14）上，以将引线（10）牢固地保持在基板电路装置（16）上。 引线（10）然后可以焊接到接触焊盘（14）。

公开(公告)号：US4206542A

公开(公告)日：1980-06-10

申请号：US4389

申请日：1979-01-18

申请人： Joseph A. Reavill

发明人： Joseph A. Reavill

IPC分类号： H01R43/02 ,  H05K3/34 ,  H01R43/00

CPC分类号： H05K3/3478 ,  H01R43/0235 ,  H05K3/3447 ,  H05K2201/10424 ,  H05K2201/10984 ,  H05K2203/0415 ,  Y10T29/4921

摘要： A method and apparatus for loading solder preforms on to the pins of a multiple pin connector. A positioning plate has open sockets in the pattern of the pins of the connector to be loaded, the sockets being sized to receive a single solder preform in each one. A slidable retainer fits into a channel below the positioning plate to partially close the sockets and retain preforms therein. Loose preforms are contained in a dam attached to the top of the positioning plate and are shaken into the sockets on a vibrator table. The dam and excess preforms are removed and the positioning plate is covered by a cover plate to hold the preforms in place. The connector pins are then inserted through slots in the retainer, through the preforms and through holes in the cover plate. The retainer is removed, allowing the preforms to drop on the pins and the loaded connector is removed from the apparatus.

摘要翻译： 一种用于将焊料预制件装载到多针连接器的销上的方法和装置。 定位板具有以待加载的连接器的销的图案的开放插座，插座的尺寸被设计成在每一个中容纳单个焊料预制件。 可滑动的保持器配合到定位板下方的通道中以部分地关闭插座并将预制件保持在其中。 松动的预制件被包含在连接到定位板的顶部的坝中，并被摇动到振动台上的插座中。 取下大坝和多余的预成型件，并将定位板用盖板覆盖以将预制件保持在适当的位置。 然后，连接器插头穿过保持器中的狭槽，穿过预制件和盖板中的通孔。 保持器被移除，允许预成型件落在销上，并且将装载的连接器从设备移除。

公开(公告)号：US3997237A

公开(公告)日：1976-12-14

申请号：US659847

申请日：1976-02-20

申请人： Donald Richard White

发明人： Donald Richard White

IPC分类号： H01R4/02 ,  H01R12/58 ,  H05K3/34 ,  H01R9/06

CPC分类号： H01R12/58 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10856 ,  H05K2201/10984 ,  H05K2203/0415

摘要： An electrical terminal includes a mounting portion for insertion in a hole in a circuit board, a rectangular seating portion joining the mounting portion including a pair of shoulders for engaging a surface of a circuit board when the mounting portion is inserted in a hole in a circuit board. The seating portion includes a hole transverse to the mounting portion, and a cold-formed solder element extending through the hole. Each end of the solder element is cold formed to provide a mass of solder on each surface of the seating portion.

摘要翻译： 电气端子包括用于插入电路板的孔中的安装部分，连接安装部分的矩形安置部分，该安装部分包括一对肩部，用于当安装部分插入电路中的孔中时与电路板的表面接合 板。 座部包括横向于安装部分的孔和延伸穿过孔的冷成形焊料元件。 焊料元件的每个端部被冷成形以在座部的每个表面上提供大量焊料。

公开(公告)号：US3911163A

公开(公告)日：1975-10-07

申请号：US42865273

申请日：1973-12-26

申请人： XEROX CORP

发明人： WILSON DENNIS L

IPC分类号： B23K3/06 ,  H05K3/34 ,  C23C1/00

CPC分类号： B23K3/06 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/10189 ,  H05K2201/10984 ,  H05K2203/0338 ,  H05K2203/107

摘要： Solder is applied to a series of individual pins or the pins installed in a connector block by filling the peripheral depressions of a gear-like wheel with a solder paste and rolling the gear across successive pins. As each pin extends into and contacts the solder paste, the pin or solder or both are heated to flow the solder.

摘要翻译： 通过用焊膏填充齿轮状轮的周边凹陷并将齿轮滚过连续的销，将焊料施加到一系列单独的销或安装在连接器块中的销。 当每个引脚延伸到焊膏并与其接触时，引脚或焊料或两者都被加热以使焊料流动。

公开(公告)号：US3849870A

公开(公告)日：1974-11-26

申请号：US30649872

申请日：1972-11-14

申请人： AMP INC

发明人： COBAUGH R ,  PARMER K

IPC分类号： B23K1/20 ,  B23K3/06 ,  H01R4/02 ,  H05K3/34

CPC分类号： B23K1/20 ,  B23K3/0676 ,  B23K2201/36 ,  H01R4/028 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10984 ,  H05K2201/2081 ,  Y10T29/49149

摘要： An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a soldernonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shape of the solder bands and by reducing their structural integrity though the creation of numerous hairline fractures.

摘要翻译： 公开了一种电气端子结构，其具有粘附到端子的选定部分上的流动沉积量或焊料带，并且被限制在端子的表面上通过存在不可焊接材料而不是必须 触摸终端 还公开了将带状电端子安装在设置在基板中的电镀孔中的方法，其中根据上述应用技术将焊带施加到端子。 还公开了使焊接条平坦化的技术，并且所得到的端接结构具有粘附在其上的扁平焊接带。 焊接带的平坦化有助于通过改变焊接带的形状并通过减少其结构完整性来将带状端子插入电镀孔中，同时产生许多发条断裂。

公开(公告)号：US3333047A

公开(公告)日：1967-07-25

申请号：US42753665

申请日：1965-01-13

申请人： GERARD GEOFFROI LOUIS EMIL

发明人： GERARD GEOFFROI LOUIS EMIL

IPC分类号： H01R4/02 ,  H05K3/22 ,  H05K3/34

CPC分类号： H05K3/3426 ,  H01R4/022 ,  H05K3/222 ,  H05K3/225 ,  H05K3/3447 ,  H05K3/3478 ,  H05K2201/10287 ,  H05K2201/10984 ,  H05K2203/0415 ,  Y02P70/613