公开(公告)号：US11806142B2

公开(公告)日：2023-11-07

申请号：US17117890

申请日：2020-12-10

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Stefan Schibli ,  Robert Sievi ,  David Meder ,  Andreas Reisinger ,  Jens Trötzschel ,  Anna Fuchs ,  Heiko Specht

IPC分类号： A61B5/1486 ,  C23C18/06 ,  C23C18/08 ,  A61B5/145

CPC分类号： A61B5/14865 ,  C23C18/06 ,  C23C18/08 ,  A61B5/14532 ,  A61B2562/125

摘要： One aspect relates to a method for the manufacture of a medical electrode, including: (i) providing a substrate; (ii) applying a composition onto the substrate, wherein the composition comprises (a) a non-aqueous solvent and (b) an organic precious metal complex compound that is dissolved in the solvent; (iii) heating the composition and thereby forming a precious metal layer on the substrate, wherein the solubility of the organic precious metal complex compound in propylene glycol mono-propyl ether at 25° C. and 1013 hPa is at least 1 mass percent, or at least 2, 3, 4, 5 or 10 mass percent, in relation to the total mass of the composition.

公开(公告)号：US20230243038A1

公开(公告)日：2023-08-03

申请号：US18004581

申请日：2021-04-26

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Robert SIEVI ,  Michael GOCK ,  Richard WALTER

IPC分类号： C23C18/08

CPC分类号： C23C18/08

摘要： A preparation containing:



(A) 30 to 90 wt. % of at least one organic solvent,
(B) 10 to 70 wt. % of at least one noble metal complex comprising diolefin and C6-C18 monocarboxylate ligands selected from the group consisting of noble metal complexes of the type [LPd[O(CO)R1]X]n, [LRh[O(CO)R1]]m, and [LIr[O(CO)R1]]m, wherein L represents a compound acting as diolefin ligand, wherein X is selected among bromide, chloride, iodide, and —O(CO)R2, wherein —O(CO)R1 and —O(CO)R2 represent identical or different non-aromatic C6-C18 monocarboxylic acid residues, and wherein n is an integral number 1, and m is an integral number 2, and
(C) 0 to 10 wt. % of at least one additive.

公开(公告)号：US11697880B2

公开(公告)日：2023-07-11

申请号：US16325614

申请日：2017-08-16

申请人： SERAM COATINGS AS

发明人： Nuria Espallargas ,  Fahmi Mubarok

IPC分类号： B22F1/18 ,  B32B5/16 ,  C23C4/10 ,  C04B35/628 ,  C23C4/134 ,  C04B35/565 ,  C04B35/622 ,  C23C18/18 ,  C23C18/34 ,  C23C4/06 ,  C04B35/583 ,  C23C18/16 ,  C04B35/563 ,  C23C18/08 ,  C23C18/12 ,  C04B35/584 ,  C23C18/36 ,  B22F1/17 ,  B22F1/148 ,  C04B35/626 ,  C23C18/32

CPC分类号： C23C4/10 ,  B22F1/148 ,  B22F1/17 ,  C04B35/563 ,  C04B35/565 ,  C04B35/583 ,  C04B35/584 ,  C04B35/62222 ,  C04B35/62645 ,  C04B35/62695 ,  C04B35/62842 ,  C04B35/62886 ,  C23C4/06 ,  C23C4/134 ,  C23C18/08 ,  C23C18/1216 ,  C23C18/1245 ,  C23C18/1295 ,  C23C18/1635 ,  C23C18/1689 ,  C23C18/1692 ,  C23C18/1696 ,  C23C18/1886 ,  C23C18/1893 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  B22F2999/00 ,  C04B2235/3826 ,  C04B2235/405 ,  C04B2235/5436 ,  B22F2999/00 ,  B22F1/17 ,  B22F9/24

摘要： A process comprising: (i) coating particles of silicon carbide, silicon nitride, boron carbide or boron nitride with a metal alloy or metal layer; (ii) agglomerating the particles of step (i); thermally spraying the agglomerated metal or metal alloy coated particles onto a substrate to provide a coating thereon.

公开(公告)号：US20230183896A1

公开(公告)日：2023-06-15

申请号：US18167826

申请日：2023-02-10

申请人： University of Windsor

发明人： Tricia Breen CARMICHAEL ,  Yunyun WU

IPC分类号： D04B21/04 ,  C23C18/54 ,  D05C17/02 ,  H01M4/74 ,  D06M11/51 ,  D04B1/04 ,  C23C18/08 ,  H01M4/139

CPC分类号： D04B21/04 ,  C23C18/54 ,  D05C17/023 ,  H01M4/747 ,  D06M11/51 ,  D04B1/04 ,  C23C18/08 ,  H01M4/139

摘要： In a preferred embodiment, there is provided a modified fabric composition, the composition comprising a fabric member and an electroactive member for storing energy, wherein the fabric member comprises a fabric framework defining a deformable plane and a plurality of projections extending at an angle from the plane, and wherein the electroactive member is coupled to at least one of the projections.

公开(公告)号：US11352699B2

公开(公告)日：2022-06-07

申请号：US16421128

申请日：2019-05-23

申请人： University of Connecticut

发明人： Steven L. Suib ,  Niluka D. Wasalathanthri ,  David A. Kriz ,  Madhavi N. Pahalagedara ,  Wimalika Thalgaspitiya ,  Dinithi Rathnayake

IPC分类号： C01G41/02 ,  C23C18/08 ,  B32B15/01 ,  C23C18/12 ,  B32B15/20 ,  C23C24/04 ,  H01B1/08 ,  C01G41/00 ,  C23C24/00 ,  C30B29/22 ,  C23C18/04

摘要： The present disclosure relates to tungsten bronze thin films and method of making the same. Specifically, the present disclosure relates to a thin, homogeneous, highly conducting cubic tungsten bronze film with densely packed micron size particles and the process of making the film.

公开(公告)号：US11081375B2

公开(公告)日：2021-08-03

申请号：US17003595

申请日：2020-08-26

申请人： JABIL INC.

发明人： Lim Lai Ming ,  Zambri Bin Samsudin

IPC分类号： H01L21/67 ,  C23C18/08 ,  H01L21/48

摘要： The disclosure is and includes at least an apparatus, system and method for a ramped electrical interconnection for use in semiconductor fabrications. The apparatus, system and method includes at least a first semiconductor substrate having thereon a first electrical circuit comprising first electrical components; a second semiconductor substrate at least partially covering the first electrical circuit, and having thereon a second electrical circuit comprising second electrical components; a ramp formed through the second semiconductor substrate between at least one of the first electrical components and at least one of the second electrical components; and an additively manufactured conductive trace formed on the ramp to electrically connect the at least one first electrical component and the at least one second electrical component.

公开(公告)号：US20210177323A1

公开(公告)日：2021-06-17

申请号：US17117890

申请日：2020-12-10

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Stefan SCHIBLI ,  Robert SIEVI ,  David MEDER ,  Andreas REISINGER ,  Jens TRÖTZSCHEL ,  Anna ERMERT ,  Heiko SPECHT

IPC分类号： A61B5/1486 ,  C23C18/08 ,  C23C18/06

摘要： One aspect relates to a method for the manufacture of a medical electrode, including: (i) providing a substrate; (ii) applying a composition onto the substrate, wherein the composition comprises (a) a non-aqueous solvent and (b) an organic precious metal complex compound that is dissolved in the solvent; (iii) heating the composition and thereby forming a precious metal layer on the substrate, wherein the solubility of the organic precious metal complex compound in propylene glycol mono-propyl ether at 25° C. and 1013 hPa is at least 1 mass percent, or at least 2, 3, 4, 5 or 10 mass percent, in relation to the total mass of the composition.

公开(公告)号：US10895013B2

公开(公告)日：2021-01-19

申请号：US14438380

申请日：2013-11-10

申请人： BEN GURION UNIVERSITY OF THE NEGEV RESEARCH AND DEVELOPMENT AUTHORITY

发明人： Raz Jelinek ,  Ahiud Morag

IPC分类号： C23C18/31 ,  C23C18/16 ,  C23C18/42 ,  C23C18/18 ,  C23C18/54 ,  C23C18/08 ,  C23C18/20

摘要： An electroless process for depositing gold (Au0) from a solution, comprising allowing gold (Au0) place from a solution of gold thiocyanate complex dissolved in a mixture of water-miscible organic solvent and water, or the deposition of gold (Au0) takes place on a deposition-directing layer comprising positively charged organic groups, said layer being provided on at least a portion of a surface of a substrate sought to be gold-coated.

公开(公告)号：US20200165729A1

公开(公告)日：2020-05-28

申请号：US16697731

申请日：2019-11-27

申请人： Jar-Wha Lee ,  Zachary Douglas Adams ,  Mark Andrew Maltese

发明人： Jar-Wha Lee ,  Zachary Douglas Adams ,  Mark Andrew Maltese

IPC分类号： C23C18/08 ,  B05D3/10 ,  C23C18/04

摘要： A method for forming a conductive metal-polymer composite coated polymer includes providing a polymer substrate and immersing the polymer substrate in a metal solution. The method further includes decomposing the metal solution in a thermally controlled environment and reducing the metal solution to metal such that the metal is deposited on a surface of the polymer substrate. After reducing the metal solution, the method includes treating the surface with a polymer coating to form the metal-polymer composite coated polymer.

公开(公告)号：US10435817B2

公开(公告)日：2019-10-08

申请号：US15308951

申请日：2015-05-06

申请人： President and Fellows of Harvard College

发明人： Charles M. Lieber ,  Robert Day ,  Max Nathan Mankin ,  Ruixuan Gao ,  Thomas J. Kempa

IPC分类号： C30B29/66 ,  B82Y30/00 ,  H01L29/06 ,  C23C14/22 ,  C23C16/44 ,  C30B23/02 ,  C30B25/18 ,  C30B29/06 ,  C30B29/08 ,  H01L21/02 ,  H01L29/16 ,  H01L29/20 ,  H01L29/22 ,  H01L29/423 ,  H01L29/786 ,  C30B29/38 ,  C30B29/60 ,  B82Y40/00 ,  C23C18/08 ,  C23C18/12

摘要： The present invention generally relates to nanoscale wires, and to methods of producing nanoscale wires. In some aspects, the nanoscale wires are nanowires comprising a core which is continuous and a shell which may be continuous or discontinuous, and/or may have regions having different cross-sectional areas. In some embodiments, the shell regions are produced by passing the shell material (or a precursor thereof) over a core nanoscale wire under conditions in which Plateau-Raleigh crystal growth occurs, which can lead to non-homogenous deposition of the shell material on different regions of the core. The core and the shell each independently may comprise semiconductors, and/or non-semiconductor materials such as semiconductor oxides, metals, polymers, or the like. Other embodiments are generally directed to systems and methods of making or using such nanoscale wires, devices containing such nanoscale wires, or the like.